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1. 发明申请

US20060121722A1 Method of making printed circuit board with varying depth conductive holes adapted for receiving pinned electrical components 审中-公开
标题翻译：制造适于接收固定电气部件的具有不同深度导电孔的印刷电路板的方法
公开(公告)号：US20060121722A1
公开(公告)日：2006-06-08
申请号：US11334445
申请日：2006-01-19
申请人： Norman Card , Benson Chan , Richard Day , John Lauffer , Roy Magnuson , Voya Markovich
发明人： Norman Card , Benson Chan , Richard Day , John Lauffer , Roy Magnuson , Voya Markovich
IPC分类号： H01L21/4763 , H01L21/44 , H05K1/00 , H05K1/11
CPC分类号： H05K3/429 , H01L2224/13 , H05K1/113 , H05K1/115 , H05K3/0032 , H05K3/0035 , H05K3/421 , H05K2201/0347 , H05K2201/09454 , H05K2201/09509 , H05K2201/09518 , H05K2201/09563 , H05K2201/0959 , H05K2201/0969 , H05K2201/09845
摘要： A method of making a printed circuit board in which openings of different length are formed using a cover atop one of the openings to prevent dielectric material from an interim layer of heat-deformable dielectric material from entering the opening when the sub-composite having the opening therein is bonded to a second sub-composite. The bonded sub-composites are then provided with a second opening which extends there-through, this second opening being longer than the first. Pins of an electrical component may then be inserted within the first and second openings of different length.
摘要翻译：一种制造印刷电路板的方法，其中使用在其中一个开口顶部上的盖形成不同长度的开口，以防止当具有开口的子复合材料时，来自可热变形介电材料的中间层的电介质材料进入开口其中粘合到第二子复合材料。然后，粘合的亚复合材料具有在其上延伸的第二开口，该第二开口比第一开口长。然后可以将电气部件的引脚插入到不同长度的第一和第二开口内。

2. 发明申请

US20060214010A1 Circuitized substrate with shielded signal lines and plated-thru-holes and method of making same, and electrical assembly and information handling system utilizing same 失效
标题翻译：具有屏蔽信号线和电镀通孔的电路基板及其制造方法，以及利用其组合和信息处理系统
公开(公告)号：US20060214010A1
公开(公告)日：2006-09-28
申请号：US11401401
申请日：2006-04-11
申请人： Benson Chan , Frank Egitto , Roy Magnuson , Voya Markovich , David Thomas
发明人： Benson Chan , Frank Egitto , Roy Magnuson , Voya Markovich , David Thomas
IPC分类号： G06K19/06
CPC分类号： G06K7/084 , G06K17/00 , G06K19/005 , G06K19/07354 , G06K2017/0064 , H05K1/0221 , H05K1/0222 , H05K3/429 , H05K3/4602 , H05K2201/09809 , H05K2203/0733 , Y10T29/49165
摘要： A circuitized substrate in which selected ones of the signal conductors are substantially surrounded by shielding members which shield the conductors during passage of high frequency signals, e.g., to reduce noise. The shielding members may form solid members which lie parallel and/or perpendicular to the signal conductors, and may also be substantially cylindrical in shape to surround a conductive thru-hole which also forms part of the substrate. An electrical assembly and an information handling system are also defined.
摘要翻译：电路化基板，其中所选择的信号导体基本上由在高频信号通过期间屏蔽导体的屏蔽构件包围，例如降低噪声。屏蔽构件可以形成平行和/或垂直于信号导体的固体构件，并且也可以基本上为圆柱形，以包围也形成衬底的一部分的导电通孔。还定义了电组件和信息处理系统。

3. 发明申请

US20070007033A1 Circuitized substrate with soler-coated microparticle paste connections, multilayered substrate assembly, electrical assembly and information handling system utilizing same and method of making said substrate 有权
标题翻译：具有涂层微粒糊连接的电路化基板，多层基板组件，利用其的电气组件和信息处理系统以及制造所述基板的方法
公开(公告)号：US20070007033A1
公开(公告)日：2007-01-11
申请号：US11244180
申请日：2005-10-06
申请人： Rabindra Das , John Lauffer , Roy Magnuson , Voya Markovich
发明人： Rabindra Das , John Lauffer , Roy Magnuson , Voya Markovich
IPC分类号： H05K1/09
CPC分类号： H05K3/4069 , H05K3/429 , H05K3/4614 , H05K2201/015 , H05K2201/0245 , H05K2201/09536 , H05K2201/096 , H05K2201/10378 , H05K2203/1152
摘要： A circuitized substrate which includes a conductive paste for providing electrical connections. The paste, in one embodiment, includes a binder component and at least one metallic component including microparticles. In another embodiment, the paste includes the binder and a plurality of nano-wires. Selected ones of the microparticles or nano-wires include a layer of solder thereon. A method of making such a substrate is also provided, as are an electrical assembly and information handling system adapter for having such a substrate as part thereof.
摘要翻译：一种电路化基板，包括用于提供电连接的导电浆料。在一个实施方案中，糊状物包含粘合剂组分和至少一种包含微粒的金属组分。在另一个实施方案中，糊状物包括粘合剂和多根纳米线。所选择的微粒或纳米线包括其上的焊料层。还提供了制造这种基板的方法，以及用于将这种基板作为其一部分的电组件和信息处理系统适配器。

4. 发明申请

US20060005383A1 Method of forming printed circuit card 失效
标题翻译：形成印刷电路卡的方法
公开(公告)号：US20060005383A1
公开(公告)日：2006-01-12
申请号：US11224191
申请日：2005-09-12
申请人： Kenneth Fallon , Miguel Jimarez , Ross Keesler , John Lauffer , Roy Magnuson , Voya Markovich , Irv Memis , Jim Paoletti , Marybeth Perrino , John Welsh , William Wilson
发明人： Kenneth Fallon , Miguel Jimarez , Ross Keesler , John Lauffer , Roy Magnuson , Voya Markovich , Irv Memis , Jim Paoletti , Marybeth Perrino , John Welsh , William Wilson
IPC分类号： H01R43/00
CPC分类号： H05K3/445 , H01L23/49827 , H01L23/49833 , H01L23/50 , H01L2924/0002 , H05K1/056 , H05K1/113 , H05K3/0023 , H05K3/0052 , H05K3/0094 , H05K3/06 , H05K3/108 , H05K3/426 , H05K3/429 , H05K3/44 , H05K3/4623 , H05K3/4641 , H05K2201/0919 , H05K2201/09536 , H05K2201/09554 , H05K2201/096 , H05K2201/10734 , H05K2203/0323 , H05K2203/0574 , H05K2203/0733 , H05K2203/1394 , Y10T29/49117 , Y10T29/49126 , Y10T29/49128 , Y10T29/49155 , Y10T29/49156 , Y10T29/49165 , H01L2924/00
摘要： A method of forming a printed circuit card with a metal power plane layer between two photoimageable dielectric layers is provided. Photoformed metal filled vias and plated through holes are in the photopatternable material, and signal circuitry is on the surfaces of each of the dielectric materials connected to the vias and plated through holes. A border may be around the card including a metal layer terminating in from the edge of one of the dielectric layers. Copper foil with clearance holes is provided. First and second layers of photoimageable curable dielectric material are on opposite sides of the copper. Patterns are developed on the first and second layers of the photoimageable material to reveal the metal layer through vias. Through holes are developed where holes were patterned in both dielectric layers. The surfaces of the photoimageable material, vias and through holes are metallized by copper plating, preferably using photoresist.
摘要翻译：提供了一种在两个可光成像的电介质层之间形成具有金属功率平面层的印刷电路卡的方法。光刻图形的金属填充通孔和电镀通孔位于光图案化材料中，信号电路位于连接到通孔和电镀通孔的每个介电材料的表面上。边框可以在卡周围，包括从电介质层之一的边缘终止的金属层。提供带有间隙孔的铜箔。第一层和第二层可光成像的可固化电介质材料位于铜的相对两侧。在可光成像材料的第一层和第二层上形成图案以通过通孔显露金属层。开发了通孔，在两个电介质层中对其进行图案化。可光成像材料，通孔和通孔的表面通过镀铜进行金属化，优选使用光致抗蚀剂。

5. 发明申请

US20050042383A1 Colloidal seed formation for printed circuit board metallization 审中-公开
标题翻译：用于印刷电路板金属化的胶体种子形成
公开(公告)号：US20050042383A1
公开(公告)日：2005-02-24
申请号：US10939735
申请日：2004-09-13
申请人： Raymond Galasco , Roy Magnuson , Voya Markovich , Thomas Miller , Anita Sargent , William Wilson
发明人： Raymond Galasco , Roy Magnuson , Voya Markovich , Thomas Miller , Anita Sargent , William Wilson
IPC分类号： C23C18/28 , H05K3/18 , B05D1/18
CPC分类号： C23C18/28 , H05K3/181
摘要： A colloidal metal seed formulation useful for catalytically activating a surface of a non-conductive dielectric substrate in an electroless plating process is provided. The colloidal metal seed formulation includes stannous chloride, palladium chloride, HCl and a surfactant selected from a diphenyloxide disulfonic acid or alkali or alkaline earth metal salt thereof, C30H50O10, an alcohol alkoxylate and mixtures thereof. A method of electroless plating of a conductive metal onto a non-conductive dielectric substrate using the colloidal metal seed formulation is also provided.
摘要翻译：提供了一种用于在非电镀过程中催化活化非导电电介质基片的表面的胶态金属种子制剂。胶体金属种子制剂包括氯化亚锡，氯化钯，HCl和选自二苯氧基二磺酸或其碱金属或碱土金属盐，C30H50O10，醇烷氧基化物及其混合物的表面活性剂。还提供了使用胶体金属种子制剂将导电金属化学镀在非导电电介质基底上的方法。

6. 发明申请

US20050289019A1 Method and system for tracking goods 有权
标题翻译：跟踪货物的方法和系统
公开(公告)号：US20050289019A1
公开(公告)日：2005-12-29
申请号：US10860067
申请日：2004-06-04
申请人： Benson Chan , How Lin , William Maines , Voya Markovich
发明人： Benson Chan , How Lin , William Maines , Voya Markovich
IPC分类号： B65G61/00 , G06K17/00 , G06Q10/00 , G06Q99/00
CPC分类号： G06K17/00 , G06Q10/08 , G06Q10/087
摘要： A method and system for tracking goods, etc., food products, which involves identifying the received goods at a specified location and thereafter assigning an encoded readable code to each of the goods which can be only accessed by authorized personnel responsible for handling the goods on through to and including shipment, e.g., to customers. A host computer includes a database for encoding received identification data and thereafter encoding same to provide the readable codes. The method and system also allows the customer/recipient to access the codes to discern whether he/she has received the correct goods he purchased.
摘要翻译：一种用于跟踪货物等的食品的方法和系统，其涉及在指定位置识别所接收的货物，然后将编码的可读代码分配给每个商品，所述商品只能由负责处理商品的授权人员访问通过和包括装运，例如，给客户。主计算机包括用于对接收到的标识数据进行编码的数据库，然后对其进行编码以提供可读代码。该方法和系统还允许客户/接收者访问代码以辨别他/她是否已经收到他购买的正确商品。

7. 发明申请

US20050064740A1 Method of making an interposer sub-assembly in a printed wiring board 失效
公开(公告)号：US20050064740A1
公开(公告)日：2005-03-24
申请号：US10979366
申请日：2004-11-01
申请人： William Brodsky , Benson Chan , Michael Gaynes , Voya Markovich
发明人： William Brodsky , Benson Chan , Michael Gaynes , Voya Markovich
IPC分类号： H05K3/32 , H01R12/00
CPC分类号： H01R12/523 , H05K3/325 , Y10T29/49117 , Y10T29/4913 , Y10T29/49144 , Y10T29/49165 , Y10T29/49213
摘要： The details of a printed wiring board (PWB) sub-assembly and the method of producing the same are described. The sub-assembly comprises a printed circuit board electrically joined through a plurality of connections to one or more area array devices, such as modules or printed wiring boards. The sub-assembly can serve as a part of an original assembly. The sub-assembly can function as an after market item that can be readily substituted as a replacement for a failed component wherein the dimensional space between the printed circuit board and one or both of the area array devices must provide sufficient clearance for surface mounted devices.

8. 发明授权

US07142121B2 Radio frequency device for tracking goods 失效
标题翻译：射频设备跟踪商品
公开(公告)号：US07142121B2
公开(公告)日：2006-11-28
申请号：US10860071
申请日：2004-06-04
申请人： Benson Chan , William Kimler , How Lin , William Maines , Voya Markovich
发明人： Benson Chan , William Kimler , How Lin , William Maines , Voya Markovich
IPC分类号： G08B13/14
CPC分类号： G06K19/07749 , G06K2017/0045 , G06Q10/087
摘要： A radio frequency (RF) device (or “tag”) for containing specific information relating to a particular good being shipped from one location (e.g., warehouse) to another (e.g., customer). The device includes a circuitized substrate (e.g., a printed circuit board), a semiconductor chip, an antenna and a power regulator, and is designed in one embodiment to be partly inserted within a good (e.g., a cardboard box) containing one or more of the goods being shipped and tracked. Alternatively, the device may be attached by other means (e.g., adhesive). A shipper can simply track the goods containing such devices using wireless communication devices (e.g., satellites) to quickly and readily ascertain the specific location of the goods at any time as well as the appropriate desired information relating to such goods (e.g., quantity, weight, type, etc.).
摘要翻译：用于包含与从一个位置（例如，仓库）运送到另一个位置（例如客户）的特定商品相关的特定信息的射频（RF）设备（或“标签”）。该装置包括电路化基板（例如，印刷电路板），半导体芯片，天线和功率调节器，并且在一个实施例中设计成部分地插入到包含一个或多个的货物被运输和跟踪。或者，该装置可以通过其他方式（例如，粘合剂）附接。托运人可以使用无线通信设备（例如，卫星）轻松跟踪含有此类设备的货物，以便随时快速确定货物的具体位置以及与此类货物相关的适当的所需信息（例如数量，重量，类型等）。

9. 发明申请

US20060213973A1 Electronic card assembly 有权
标题翻译：电子卡组装
公开(公告)号：US20060213973A1
公开(公告)日：2006-09-28
申请号：US11086324
申请日：2005-03-23
申请人： Benson Chan , How Lin , Voya Markovich , Ronald Smith
发明人： Benson Chan , How Lin , Voya Markovich , Ronald Smith
IPC分类号： G06K5/00 , G06K19/06
CPC分类号： G06K19/005 , G06K7/084 , G06K17/00 , G06K19/07354 , G06K2017/0064
摘要： An electronic card assembly is provided which includes a protective housing having a movable card therein. The card, in one example one having a magnetic stripe, has its information erased when being inserted into the housing and re-written back onto its information portion (magnetic stripe) during card withdrawal, provided appropriate human information (e.g., from a fingerprint) is received by the assembly's reader component.
摘要翻译：提供了一种电子卡组件，其包括其中具有可移动卡的保护壳体。在一个示例中具有磁条的卡在卡插入时被插入到壳体中被擦除并且在卡退出期间被重新写回到其信息部分（磁条）上，提供适当的人类信息（例如，从指纹）被大会的阅读器组件接收。

10. 发明授权

US07552091B2 Method and system for tracking goods 有权
标题翻译：跟踪货物的方法和系统
公开(公告)号：US07552091B2
公开(公告)日：2009-06-23
申请号：US10860067
申请日：2004-06-04
申请人： Benson Chan , How Lin , William Maines , Voya Markovich
发明人： Benson Chan , How Lin , William Maines , Voya Markovich
IPC分类号： G06Q99/00
CPC分类号： G06K17/00 , G06Q10/08 , G06Q10/087
摘要： A method and system for tracking goods, etc., food products, which involves identifying the received goods at a specified location and thereafter assigning an encoded readable code to each of the goods which can be only accessed by authorized personnel responsible for handling the goods on through to and including shipment, e.g., to customers. A host computer includes a database for encoding received identification data and thereafter encoding same to provide the readable codes. The method and system also allows the customer/recipient to access the codes to discern whether he/she has received the correct goods he purchased.
摘要翻译：一种用于跟踪货物等的食品的方法和系统，其涉及在指定位置识别所接收的货物，然后将编码的可读代码分配给每个商品，所述商品只能由负责处理商品的授权人员访问通过和包括装运，例如，给客户。主计算机包括用于对接收到的标识数据进行编码的数据库，然后对其进行编码以提供可读代码。该方法和系统还允许客户/接收者访问代码以辨别他/她是否已经收到他购买的正确商品。

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