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1. 发明授权

US07142121B2 Radio frequency device for tracking goods 失效
标题翻译：射频设备跟踪商品
公开(公告)号：US07142121B2
公开(公告)日：2006-11-28
申请号：US10860071
申请日：2004-06-04
申请人： Benson Chan , William Kimler , How Lin , William Maines , Voya Markovich
发明人： Benson Chan , William Kimler , How Lin , William Maines , Voya Markovich
IPC分类号： G08B13/14
CPC分类号： G06K19/07749 , G06K2017/0045 , G06Q10/087
摘要： A radio frequency (RF) device (or “tag”) for containing specific information relating to a particular good being shipped from one location (e.g., warehouse) to another (e.g., customer). The device includes a circuitized substrate (e.g., a printed circuit board), a semiconductor chip, an antenna and a power regulator, and is designed in one embodiment to be partly inserted within a good (e.g., a cardboard box) containing one or more of the goods being shipped and tracked. Alternatively, the device may be attached by other means (e.g., adhesive). A shipper can simply track the goods containing such devices using wireless communication devices (e.g., satellites) to quickly and readily ascertain the specific location of the goods at any time as well as the appropriate desired information relating to such goods (e.g., quantity, weight, type, etc.).
摘要翻译：用于包含与从一个位置（例如，仓库）运送到另一个位置（例如客户）的特定商品相关的特定信息的射频（RF）设备（或“标签”）。该装置包括电路化基板（例如，印刷电路板），半导体芯片，天线和功率调节器，并且在一个实施例中设计成部分地插入到包含一个或多个的货物被运输和跟踪。或者，该装置可以通过其他方式（例如，粘合剂）附接。托运人可以使用无线通信设备（例如，卫星）轻松跟踪含有此类设备的货物，以便随时快速确定货物的具体位置以及与此类货物相关的适当的所需信息（例如数量，重量，类型等）。

2. 发明申请

US20050289019A1 Method and system for tracking goods 有权
标题翻译：跟踪货物的方法和系统
公开(公告)号：US20050289019A1
公开(公告)日：2005-12-29
申请号：US10860067
申请日：2004-06-04
申请人： Benson Chan , How Lin , William Maines , Voya Markovich
发明人： Benson Chan , How Lin , William Maines , Voya Markovich
IPC分类号： B65G61/00 , G06K17/00 , G06Q10/00 , G06Q99/00
CPC分类号： G06K17/00 , G06Q10/08 , G06Q10/087
摘要： A method and system for tracking goods, etc., food products, which involves identifying the received goods at a specified location and thereafter assigning an encoded readable code to each of the goods which can be only accessed by authorized personnel responsible for handling the goods on through to and including shipment, e.g., to customers. A host computer includes a database for encoding received identification data and thereafter encoding same to provide the readable codes. The method and system also allows the customer/recipient to access the codes to discern whether he/she has received the correct goods he purchased.
摘要翻译：一种用于跟踪货物等的食品的方法和系统，其涉及在指定位置识别所接收的货物，然后将编码的可读代码分配给每个商品，所述商品只能由负责处理商品的授权人员访问通过和包括装运，例如，给客户。主计算机包括用于对接收到的标识数据进行编码的数据库，然后对其进行编码以提供可读代码。该方法和系统还允许客户/接收者访问代码以辨别他/她是否已经收到他购买的正确商品。

3. 发明授权

US07552091B2 Method and system for tracking goods 有权
标题翻译：跟踪货物的方法和系统
公开(公告)号：US07552091B2
公开(公告)日：2009-06-23
申请号：US10860067
申请日：2004-06-04
申请人： Benson Chan , How Lin , William Maines , Voya Markovich
发明人： Benson Chan , How Lin , William Maines , Voya Markovich
IPC分类号： G06Q99/00
CPC分类号： G06K17/00 , G06Q10/08 , G06Q10/087
摘要： A method and system for tracking goods, etc., food products, which involves identifying the received goods at a specified location and thereafter assigning an encoded readable code to each of the goods which can be only accessed by authorized personnel responsible for handling the goods on through to and including shipment, e.g., to customers. A host computer includes a database for encoding received identification data and thereafter encoding same to provide the readable codes. The method and system also allows the customer/recipient to access the codes to discern whether he/she has received the correct goods he purchased.
摘要翻译：一种用于跟踪货物等的食品的方法和系统，其涉及在指定位置识别所接收的货物，然后将编码的可读代码分配给每个商品，所述商品只能由负责处理商品的授权人员访问通过和包括装运，例如，给客户。主计算机包括用于对接收到的标识数据进行编码的数据库，然后对其进行编码以提供可读代码。该方法和系统还允许客户/接收者访问代码以辨别他/她是否已经收到他购买的正确商品。

4. 发明申请

US20050270160A1 Radio frequency device for tracking goods 失效
标题翻译：射频设备跟踪商品
公开(公告)号：US20050270160A1
公开(公告)日：2005-12-08
申请号：US10860071
申请日：2004-06-04
申请人： Benson Chan , William Kimler , How Lin , William Maines , Voya Markovich
发明人： Benson Chan , William Kimler , How Lin , William Maines , Voya Markovich
IPC分类号： G06K17/00 , G06K19/077 , G06Q10/00 , G08B1/08
CPC分类号： G06K19/07749 , G06K2017/0045 , G06Q10/087
摘要： A radio frequency (RF) device (or “tag”) for containing specific information relating to a particular good being shipped from one location (e.g., warehouse) to another (e.g., customer). The device includes a circuitized substrate (e.g., a printed circuit board), a semiconductor chip, an antenna and a power regulator, and is designed in one embodiment to be partly inserted within a good (e.g., a cardboard box) containing one or more of the goods being shipped and tracked. Alternatively, the device may be attached by other means (e.g., adhesive). A shipper can simply track the goods containing such devices using wireless communication devices (e.g., satellites) to quickly and readily ascertain the specific location of the goods at any time as well as the appropriate desired information relating to such goods (e.g., quantity, weight, type, etc.).
摘要翻译：用于包含与从一个位置（例如，仓库）运送到另一个位置（例如客户）的特定商品相关的特定信息的射频（RF）设备（或“标签”）。该装置包括电路化基板（例如，印刷电路板），半导体芯片，天线和功率调节器，并且在一个实施例中设计成部分地插入到包含一个或多个的货物被运输和跟踪。或者，该装置可以通过其他方式（例如，粘合剂）附接。托运人可以使用无线通信设备（例如，卫星）轻松跟踪含有此类设备的货物，以便随时快速确定货物的具体位置以及与此类货物相关的适当的所需信息（例如数量，重量，类型等）。

5. 发明申请

US20060213973A1 Electronic card assembly 有权
标题翻译：电子卡组装
公开(公告)号：US20060213973A1
公开(公告)日：2006-09-28
申请号：US11086324
申请日：2005-03-23
申请人： Benson Chan , How Lin , Voya Markovich , Ronald Smith
发明人： Benson Chan , How Lin , Voya Markovich , Ronald Smith
IPC分类号： G06K5/00 , G06K19/06
CPC分类号： G06K19/005 , G06K7/084 , G06K17/00 , G06K19/07354 , G06K2017/0064
摘要： An electronic card assembly is provided which includes a protective housing having a movable card therein. The card, in one example one having a magnetic stripe, has its information erased when being inserted into the housing and re-written back onto its information portion (magnetic stripe) during card withdrawal, provided appropriate human information (e.g., from a fingerprint) is received by the assembly's reader component.
摘要翻译：提供了一种电子卡组件，其包括其中具有可移动卡的保护壳体。在一个示例中具有磁条的卡在卡插入时被插入到壳体中被擦除并且在卡退出期间被重新写回到其信息部分（磁条）上，提供适当的人类信息（例如，从指纹）被大会的阅读器组件接收。

6. 发明授权

US08198739B2 Semi-conductor chip with compressible contact structure and electronic package utilizing same 有权
标题翻译：具有可压缩接触结构的半导体芯片和利用其的电子封装
公开(公告)号：US08198739B2
公开(公告)日：2012-06-12
申请号：US12836612
申请日：2010-08-13
申请人： How Lin , Frank Egitto , Voya Markovich
发明人： How Lin , Frank Egitto , Voya Markovich
IPC分类号： H01L23/48 , H01L21/44
CPC分类号： H01L23/3157 , H01L24/05 , H01L24/13 , H01L24/16 , H01L24/72 , H01L2224/0226 , H01L2224/02335 , H01L2224/024 , H01L2224/0401 , H01L2224/05147 , H01L2224/05644 , H01L2224/05647 , H01L2224/16225 , H01L2224/16227 , H01L2224/73251 , H01L2224/8121 , H01L2224/81815 , H01L2224/81901 , H01L2924/01006 , H01L2924/01013 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H01L2924/15311 , H01L2924/15787 , H01L2924/15788 , H01L2924/351 , H01L2924/00 , H01L2224/16 , H01L2224/72
摘要： A method of forming a compressible contact structure on a semi-conductor chip which comprises bonding a compressible polymer layer to the chip's surface, forming a plurality of openings within the layer, depositing electrically conductive material within the openings to form electrical connections with the chip's contacts, forming a plurality of electrically conductive line elements on the polymer layer extending from a respective opening and each including an end portion, and forming a plurality of contact members each on a respective one of the line segment end portions. The compressible polymer layer allows the contact members to deflect toward (compress) the chip when the contact members are engaged by an external force or forces. A semi-conductor chip including such a compressible contact structure is also provided.
摘要翻译：一种在半导体芯片上形成可压缩接触结构的方法，包括将可压缩的聚合物层粘合到芯片的表面，在该层内形成多个开口，在开口内沉积导电材料以形成与芯片的触点的电连接在聚合物层上形成多个导电线元件，所述多个导电线元件从相应的开口延伸并且各自包括端部，并且在所述线段端部中的相应一个上形成多个接触元件。当可接触构件通过外力或力接合时，可压缩聚合物层允许接触构件偏转（压缩）芯片。还提供了包括这种可压缩接触结构的半导体芯片。

7. 发明申请

US20070010065A1 Method of making a capacitive substrate for use as part of a larger circuitized substrate, method of making said circuitized substrate and method of making an information handling system including said circuitized substrate 有权
标题翻译：制造用作较大电路基板的一部分的电容基板的方法，制造所述电路化基板的方法和制造包括所述电路化基板的信息处理系统的方法
公开(公告)号：US20070010065A1
公开(公告)日：2007-01-11
申请号：US11352279
申请日：2006-02-13
申请人： Rabindra Das , John Lauffer , How Lin , Voya Markovich
发明人： Rabindra Das , John Lauffer , How Lin , Voya Markovich
IPC分类号： H01L21/20 , H01L21/44
CPC分类号： H05K1/162 , H05K1/113 , H05K3/0023 , H05K3/4602 , H05K2201/0187 , H05K2201/0209 , H05K2201/09309 , H05K2201/09509 , H05K2201/09536 , H05K2203/013 , H05K2203/0568
摘要： A method of forming a capacitive substrate in which at least one capacitive dielectric layer of material is screen or ink jet printed onto a conductor and the substrate is thereafter processed further, including the addition of thru-holes to couple selected elements within the substrate to form at least two capacitors as internal elements of the substrate. The capacitive substrate may be incorporated within a larger circuitized substrate, e.g., to form an electrical assembly. A method of making an information handling system including such substrates is also provided.
摘要翻译：一种形成电容衬底的方法，其中材料的至少一个电容介电层被屏幕或喷墨印刷到导体上，然后进一步处理衬底，包括添加通孔以将所选择的元件耦合到衬底内以形成至少两个电容器作为衬底的内部元件。电容性衬底可以结合在更大的电路化衬底内，例如以形成电组件。还提供了一种制造包括这种基板的信息处理系统的方法。

8. 发明申请

US20070139977A1 Method of improving electrical connections in circuitized substrates 有权
标题翻译：改善电路化基板电连接的方法
公开(公告)号：US20070139977A1
公开(公告)日：2007-06-21
申请号：US11305073
申请日：2005-12-19
申请人： Subahu Desai , John Lauffer , How Lin , Voya Markovich , Ronald Smith
发明人： Subahu Desai , John Lauffer , How Lin , Voya Markovich , Ronald Smith
IPC分类号： H02M3/315
CPC分类号： H05K3/4069 , H05K1/0293 , H05K3/105 , H05K2201/096 , H05K2203/105
摘要： A method of improving conductive paste connections in a circuitized substrate in which at least one and preferably a series of high voltage pulses are applied across the paste and at least one and preferably a series of high current pulses are applied, both series of pulses applied separately. The result is an increase in the number of conductive paths through the paste connections from those present prior to the pulse applications and a corresponding resistance reduction in said connections.
摘要翻译：一种改进电路化基板中的导电糊料连接的方法，其中施加至少一个并且优选一系列高压脉冲施加在该糊料上并且至少一个并且优选地一系列高电流脉冲，两个脉冲串分别施加。结果是通过粘合连接的导电路径的数量从在脉冲应用之前存在的导电路径的数量增加以及所述连接中相应的电阻减小。

9. 发明申请

US20120038046A1 SEMI-CONDUCTOR CHIP WITH COMPRESSIBLE CONTACT STRUCTURE AND ELECTRONIC PACKAGE UTILIZING SAME 有权
标题翻译：具有可接触结构的半导体芯片和使用其的电子封装
公开(公告)号：US20120038046A1
公开(公告)日：2012-02-16
申请号：US12836612
申请日：2010-08-13
申请人： How Lin , Frank Egitto , Voya Markovich
发明人： How Lin , Frank Egitto , Voya Markovich
IPC分类号： H01L23/48 , H01L21/447
CPC分类号： H01L23/3157 , H01L24/05 , H01L24/13 , H01L24/16 , H01L24/72 , H01L2224/0226 , H01L2224/02335 , H01L2224/024 , H01L2224/0401 , H01L2224/05147 , H01L2224/05644 , H01L2224/05647 , H01L2224/16225 , H01L2224/16227 , H01L2224/73251 , H01L2224/8121 , H01L2224/81815 , H01L2224/81901 , H01L2924/01006 , H01L2924/01013 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H01L2924/15311 , H01L2924/15787 , H01L2924/15788 , H01L2924/351 , H01L2924/00 , H01L2224/16 , H01L2224/72
摘要： A method of forming a compressible contact structure on a semi-conductor chip which comprises bonding a compressible polymer layer to the chip's surface, forming a plurality of openings within the layer, depositing electrically conductive material within the openings to form electrical connections with the chip's contacts, forming a plurality of electrically conductive line elements on the polymer layer extending from a respective opening and each including an end portion, and forming a plurality of contact members each on a respective one of the line segment end portions. The compressible polymer layer allows the contact members to deflect toward (compress) the chip when the contact members are engaged by an external force or forces. A semi-conductor chip including such a compressible contact structure is also provided.
摘要翻译：一种在半导体芯片上形成可压缩接触结构的方法，包括将可压缩的聚合物层粘合到芯片的表面，在该层内形成多个开口，在开口内沉积导电材料以形成与芯片的触点的电连接在聚合物层上形成多个导电线元件，所述多个导电线元件从相应的开口延伸并且各自包括端部，并且在所述线段端部中的相应一个上形成多个接触元件。当可接触构件通过外力或力接合时，可压缩聚合物层允许接触构件偏转（压缩）芯片。还提供了包括这种可压缩接触结构的半导体芯片。

10. 发明申请

US20060214010A1 Circuitized substrate with shielded signal lines and plated-thru-holes and method of making same, and electrical assembly and information handling system utilizing same 失效
标题翻译：具有屏蔽信号线和电镀通孔的电路基板及其制造方法，以及利用其组合和信息处理系统
公开(公告)号：US20060214010A1
公开(公告)日：2006-09-28
申请号：US11401401
申请日：2006-04-11
申请人： Benson Chan , Frank Egitto , Roy Magnuson , Voya Markovich , David Thomas
发明人： Benson Chan , Frank Egitto , Roy Magnuson , Voya Markovich , David Thomas
IPC分类号： G06K19/06
CPC分类号： G06K7/084 , G06K17/00 , G06K19/005 , G06K19/07354 , G06K2017/0064 , H05K1/0221 , H05K1/0222 , H05K3/429 , H05K3/4602 , H05K2201/09809 , H05K2203/0733 , Y10T29/49165
摘要： A circuitized substrate in which selected ones of the signal conductors are substantially surrounded by shielding members which shield the conductors during passage of high frequency signals, e.g., to reduce noise. The shielding members may form solid members which lie parallel and/or perpendicular to the signal conductors, and may also be substantially cylindrical in shape to surround a conductive thru-hole which also forms part of the substrate. An electrical assembly and an information handling system are also defined.
摘要翻译：电路化基板，其中所选择的信号导体基本上由在高频信号通过期间屏蔽导体的屏蔽构件包围，例如降低噪声。屏蔽构件可以形成平行和/或垂直于信号导体的固体构件，并且也可以基本上为圆柱形，以包围也形成衬底的一部分的导电通孔。还定义了电组件和信息处理系统。

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