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1. 发明授权

US5841064A Peltier module 失效
标题翻译：珀耳帖模块
公开(公告)号：US5841064A
公开(公告)日：1998-11-24
申请号：US776186
申请日：1997-01-24
申请人： Nobuteru Maekawa , Katsuyoshi Shimoda , Teruaki Komatsu , Shinya Murase , Hiroaki Okada , Hiroyuki Inoue
发明人： Nobuteru Maekawa , Katsuyoshi Shimoda , Teruaki Komatsu , Shinya Murase , Hiroaki Okada , Hiroyuki Inoue
IPC分类号： F25B21/02 , H01L35/32 , H01L35/02 , H01L35/08
CPC分类号： H01L35/32
摘要： A Peltier effect module comprising a plurality of Peltier effect elements arranged in parallel between a pair of substrates where the Peltier effect elements are connected to connection electrodes disposed on the substrates. The array of Peltier effect elements is sealed off by a hollow seal frame surrounding the Peltier effect element array with a seal formed by a bond between both end edges of the seal frame and the substrates. Because the perimeter around the Peltier effect elements is sealed using a seal frame metalically bonded at both ends to the substrates, resistance to moisture penetration is largely determined by the material from which the seal frame is made. Therefore, by appropriately selecting the seal frame materials, the Peltier effect module can be reliably protected for a long period of time against moisture penetration.
摘要翻译： PCT No.PCT / JP96 / 01421 Sec。 371日期1997年1月24日 102（e）日期1997年1月24日PCT提交1996年5月27日PCT公布。 WO96 / 37918 PCT公开号日期：1996年11月28日帕尔帖效应模块包括平行布置在一对基板之间的多个珀耳帖效应元件，其中帕尔帖效应元件连接到设置在基板上的连接电极。 Peltier效应元件的阵列由围绕珀尔帖效应元件阵列的中空密封框架密封，密封框架和基板的两端边缘之间的接合形成密封。由于珀耳帖效应元件周围的周边是使用两端金属结合到基板上的密封框进行密封的，所以耐水分渗透的程度很大程度上取决于制作密封框架的材料。因此，通过适当选择密封框架材料，可以长时间可靠地保护珀尔帖效应模块以防止水分渗透。

2. 发明授权

US06400013B1 Thermoelectric module with interarray bridges 失效
标题翻译：带电桥的热电模块
公开(公告)号：US06400013B1
公开(公告)日：2002-06-04
申请号：US09709577
申请日：2000-11-13
申请人： Michimasa Tsuzaki , Nobuteru Maekawa , Narimasa Iwamoto , Junji Imai , Hiroaki Okada , Teruaki Komatsu , Shinya Murase , Hiroyuki Inoue , Masayuki Sagawa , Yuri Sakai
发明人： Michimasa Tsuzaki , Nobuteru Maekawa , Narimasa Iwamoto , Junji Imai , Hiroaki Okada , Teruaki Komatsu , Shinya Murase , Hiroyuki Inoue , Masayuki Sagawa , Yuri Sakai
IPC分类号： H01L2334
CPC分类号： H01L35/325 , H01L35/32 , H01L2924/0002 , H01L2924/00
摘要： A thermoelectric module is capable of successfully reducing the heat stress for increased reliability. The module includes a plurality of thermoelectric chips of P-type and N-type arranged in a matrix between sets of first and second contacts to form a series electrical circuit. The chips are arranged to give at least three chip arrays each having a limited number of the chips. A first carrier is provided on one side of the chips to carry the first contacts and to include first bridges each integrally joining two adjacent first contacts to define first discrete couples for electrical connection of the chips in each chip array. The first carrier further includes at least two inter-array bridges which are solely responsible for electrical interconnection between the adjacent chip arrays. On the opposite side of the chips, there are formed a plurality of second bridges each integrally joining the two adjacent second contacts to give second discrete couples for electrical connection of the two adjacent chips in each of the chip arrays. Thus, the inter-array bridges are formed only on one side of the chips for interconnection of the first contacts between the adjacent chip arrays. Therefore, the heat stress applied to the end of the chip array where the two adjacent chip arrays are interconnected can be well relieved on the side of the second contacts in which the second discrete couples are kept totally isolated from each other.
摘要翻译：热电模块能够成功地降低热应力以提高可靠性。该模块包括在第一和第二触点组之间以矩阵形式布置的多个P型和N型热电芯片，以形成串联电路。芯片被布置成给出至少三个芯片阵列，每个芯片阵列具有有限数量的芯片。第一载体设置在芯片的一侧以承载第一触点并且包括每个一体地连接两个相邻的第一触点的第一桥，以限定用于每个芯片阵列中的芯片的电连接的第一离散耦合。第一载体还包括至少两个排列间桥，其单独负责相邻芯片阵列之间的电互连。在芯片的相对侧，形成多个第二桥，每个第二桥整体地连接两个相邻的第二触点，以给出第二离散耦合，用于电连接每个芯片阵列中的两个相邻的芯片。因此，阵列间桥仅形成在芯片的一侧，用于相邻芯片阵列之间的第一触点的互连。因此，施加到两个相邻芯片阵列相互连接的芯片阵列的端部的热应力可以在第二接触件的一侧彼此完全隔离的第二触头侧得到很好的缓解。

3. 发明授权

US06391676B1 Thermoelectric module and a method of fabricating the same 失效
标题翻译：热电模块及其制造方法
公开(公告)号：US06391676B1
公开(公告)日：2002-05-21
申请号：US09200972
申请日：1998-11-30
申请人： Michimasa Tsuzaki , Nobuteru Maekawa , Narimasa Iwamoto , Junji Imai , Hiroaki Okada , Teruaki Komatsu , Shinya Murase , Hiroyuki Inoue , Masayuki Sagawa , Yuri Sakai
发明人： Michimasa Tsuzaki , Nobuteru Maekawa , Narimasa Iwamoto , Junji Imai , Hiroaki Okada , Teruaki Komatsu , Shinya Murase , Hiroyuki Inoue , Masayuki Sagawa , Yuri Sakai
IPC分类号： H01L2100
CPC分类号： H01L35/325 , H01L35/32 , H01L2924/0002 , H01L2924/00
摘要： A thermoelectric module is capable of successfully reducing the heat stress for increased reliability. The module includes a plurality of thermoelectric chips of P-type and N-type arranged in a matrix between sets of first and second contacts to form a series electrical circuit. The chips are arranged to give at least three chip arrays each having a limited number of the chips. A first carrier is provided on one side of the chips to carry the first contacts and to include first bridges each integrally joining two adjacent first contacts to define first discrete couples for electrical connection of the chips in each chip array. The first carrier further includes at least two inter-array bridges which are solely responsible for electrical interconnection between the adjacent chip arrays. On the opposite side of the chips, there are formed a plurality of second bridges each integrally joining the two adjacent second contacts to give second discrete couples for electrical connection of the two adjacent chips in each of the chip arrays. Thus, the inter-array bridges are formed only on one side of the chips for interconnection of the first contacts between the adjacent chip arrays. Therefore, the heat stress applied to the end of the chip array where the two adjacent chip arrays are interconnected can be well relieved on the side of the second contacts in which the second discrete couples are kept totally isolated from each other.
摘要翻译：热电模块能够成功地降低热应力以提高可靠性。该模块包括在第一和第二触点组之间以矩阵形式布置的多个P型和N型热电芯片，以形成串联电路。芯片被布置成给出至少三个芯片阵列，每个芯片阵列具有有限数量的芯片。第一载体设置在芯片的一侧以承载第一触点并且包括每个一体地连接两个相邻的第一触点的第一桥，以限定用于每个芯片阵列中的芯片的电连接的第一离散耦合。第一载体还包括至少两个排列间桥，其单独负责相邻芯片阵列之间的电互连。在芯片的相对侧，形成多个第二桥，每个第二桥整体地连接两个相邻的第二触点，以给出第二离散耦合，用于电连接每个芯片阵列中的两个相邻的芯片。因此，阵列间桥仅形成在芯片的一侧，用于相邻芯片阵列之间的第一触点的互连。因此，施加到两个相邻芯片阵列相互连接的芯片阵列的端部的热应力可以在第二接触件的一侧彼此完全隔离的第二触头侧得到很好的缓解。

4. 发明授权

US5950067A Method of fabricating a thermoelectric module 失效
标题翻译：制造热电模块的方法
公开(公告)号：US5950067A
公开(公告)日：1999-09-07
申请号：US973095
申请日：1998-03-19
申请人： Nobuteru Maegawa , Hiroaki Okada , Michimasa Tsuzaki , Yuri Sakai , Katsuyoshi Shimoda , Teruaki Komatsu , Shinya Murase , Hiroyuki Inoue , Masayuki Sagawa
发明人： Nobuteru Maegawa , Hiroaki Okada , Michimasa Tsuzaki , Yuri Sakai , Katsuyoshi Shimoda , Teruaki Komatsu , Shinya Murase , Hiroyuki Inoue , Masayuki Sagawa
IPC分类号： H01L35/32 , H01L35/34 , H01L21/324
CPC分类号： H01L35/32 , H01L35/325 , H01L35/34 , Y10S257/93
摘要： A method of fabricating a thermoelectric module in which a plurality of thermoelectric chips are arranged in a matrix between first and second dielectric substrates and electrically connected in series so as to heat one of the substrates and cool the other substrate. Elongated thermoelectric bars of P-type and N-type to be cut into the chips are employed together with a first conductive plate having a plurality of first contacts arranged in a matrix pattern. Adjacent first contacts spaced along the row are interconnected by horizontal bridges. The method of the present invention comprises the steps of integrating the first conductive plate to the first substrate to support the first conductive plate thereby; placing a plurality of the bars of the P-type and N-type on the first contacts along the rows in such a manner that the P-type bars alternate with the N-type bars in a spaced relation along the column; bonding each bar on its one face to the first contacts; cutting each bar into the chips and cutting the horizontal bridges simultaneously to allocate the chips on the individual first contacts; placing a plurality of second contacts of a second substrate onto the chips to form a series electric circuit of the chips in combination with the first contacts, and bonding the second substrate supporting the second contacts to the first substrate.
摘要翻译： PCT No.PCT / JP97 / 01797 Sec。 371日期：1998年3月19日 102（e）1998年3月19日PCT PCT 1997年6月3日PCT公布。公开号WO97 / 45882 日期1997年12月4日一种制造热电模块的方法，其中多个热电芯片以矩阵形式布置在第一和第二电介质基板之间并串联电连接以加热其中一个基板并冷却另一个基板。将要切割成芯片的P型和N型的细长热电棒与具有以矩阵图案排列的多个第一触头的第一导电板一起使用。沿着行间隔的相邻的第一接触件通过水平桥互连。本发明的方法包括以下步骤：将第一导电板与第一基板集成，从而支撑第一导电板; 沿着行将P型和N型的多个条放置在第一触点上，使得P型条以与柱相隔的关系与N型条交替; 将其一个面上的每个条连接到第一触点; 将每个棒切割成芯片并同时切割水平桥，以将芯片分配在单独的第一触点上; 将第二基板的多个第二触点放置在芯片上以与第一触点组合形成芯片的串联电路，以及将支撑第二触点的第二基板接合到第一基板。

5. 发明授权

US10326897B2 Image forming apparatus which utilizes a web browser to display a first or previous screen 有权
公开(公告)号：US10326897B2
公开(公告)日：2019-06-18
申请号：US15907671
申请日：2018-02-28
申请人： Hiroyuki Inoue
发明人： Hiroyuki Inoue
IPC分类号： H04N1/00 , H04L29/08
摘要： An operation panel, circuitry; and a web browser executing on the circuitry. The circuitry performs receiving an instruction to execute a web application, determining whether the web application was previously executed, displaying a previously generated screen of the web application, when the determining determines that the web application was previously executed, and displaying a new screen of the web application corresponding to a start screen, when the determining determines that the web application was not previously executed.

6. 发明授权

US09522488B2 Tenter oven and manufacturing method for stretched film 有权
标题翻译：拉幅炉和拉伸膜的制造方法
公开(公告)号：US09522488B2
公开(公告)日：2016-12-20
申请号：US14007780
申请日：2012-03-23
申请人： Doseok Lee , Takuya Kawagoe , Hiroyuki Inoue
发明人： Doseok Lee , Takuya Kawagoe , Hiroyuki Inoue
IPC分类号： B29C35/04 , F26B13/00 , F26B21/00 , B29C55/08 , B29C55/20
CPC分类号： B29C35/045 , B29C55/08 , B29C55/20 , F26B13/00 , F26B21/004
摘要： A tenter oven stretches a thermoplastic resin film in the width direction thereof, wherein an air blowing nozzle provided therein that blows heated air onto a film running along a film passing surface is a proximate nozzle in which an air blowing opening provided on the air blowing surface thereof is formed as a slit, a distance (L) between the air blowing surface and the film passing surface and a slit width (B) of the slit satisfy the relationship expressed by the equation, (L/B)≦10, and the distance (L) is 150 mm or less.
摘要翻译：拉幅机烘箱在其宽度方向上延伸热塑性树脂膜，其中设置在其中的空气吹送喷嘴将加热的空气吹送到沿着膜通过表面延伸的膜上，是近似的喷嘴，其中设置在吹风表面形成为狭缝，空气吹出面和膜通过面之间的距离（L）和狭缝的狭缝宽度（B）满足由式（L / B）≤10表示的关系，并且距离（L）为150mm以下。

7. 发明授权

US09266273B2 Apparatus for producing a thermoplastic resin film 有权
标题翻译：用于制造热塑性树脂膜的设备
公开(公告)号：US09266273B2
公开(公告)日：2016-02-23
申请号：US13500819
申请日：2010-10-04
申请人： Doseok Lee , Hiroyuki Inoue , Hiroyuki Aso
发明人： Doseok Lee , Hiroyuki Inoue , Hiroyuki Aso
IPC分类号： B29C47/88 , B29C47/76 , B29C47/00 , B29L11/00 , B29L7/00 , B29C47/92
CPC分类号： B29C47/8875 , B29C47/0021 , B29C47/768 , B29C47/8845 , B29C47/92 , B29C2947/00 , B29L2007/00 , B29L2011/0075
摘要： A thermoplastic resin film manufacturing method and manufacturing device are disclosed wherein an air volume sprayed by the auxiliary cooling device onto the surface of the film on the opposite side thereof to the cooling drum side thereof is set to be larger than the suction amount by an exhaust mechanism between nozzles, to avoid the suction of the air containing the high concentration of oligomer around the extrusion die into the auxiliary cooling device, thereby preventing precipitation and deposition of the oligomer onto spraying nozzles within the auxiliary cooling device and the suction surface of the exhaust mechanism between nozzles.
摘要翻译：公开了一种热塑性树脂膜的制造方法和制造装置，其中由辅助冷却装置喷射到其与其冷却鼓侧相反的一侧的膜表面上的空气体积被设定为大于排气的吸入量喷嘴之间的机构，以避免将包含挤出模头周围的高浓度低聚物的空气吸入辅助冷却装置中，从而防止低聚物沉淀并沉积在辅助冷却装置内的喷嘴和排气的吸入表面喷嘴之间的机构。

8. 发明授权

US08889062B2 Carbonaceous refractory and method of production of same and also blast furnace bottom or side walls 有权
$Carbonaceous refractory and method of production of same and also blast furnace bottom or side walls$
标题翻译：碳质耐火材料及其生产方法以及高炉底部或侧壁
公开(公告)号：US08889062B2
公开(公告)日：2014-11-18
申请号：US13138416
申请日：2010-02-17
申请人： Hiroyuki Inoue , Michio Nitta , Taijiro Matsui , Tsutomu Wakasa , Yoshiyuki Yamagami , Toru Mochida
发明人： Hiroyuki Inoue , Michio Nitta , Taijiro Matsui , Tsutomu Wakasa , Yoshiyuki Yamagami , Toru Mochida
IPC分类号： F27B1/10 , F27D1/00 , C04B35/528 , C04B35/532 , C21B7/06 , C04B35/52 , B82Y30/00 , C04B35/01 , C04B35/80
CPC分类号： C04B35/013 , B82Y30/00 , C04B35/522 , C04B35/528 , C04B35/532 , C04B35/806 , C04B2235/3206 , C04B2235/3217 , C04B2235/3222 , C04B2235/3244 , C04B2235/3418 , C04B2235/3463 , C04B2235/3817 , C04B2235/3843 , C04B2235/404 , C04B2235/424 , C04B2235/428 , C04B2235/5244 , C04B2235/5276 , C04B2235/5436 , C04B2235/5454 , C04B2235/80 , C04B2235/96 , C21B7/06 , F27D1/0006
摘要： A carbonaceous refractory and a method of production is provided, which prevents a drop in the molten pig iron corrosion resistance, molten pig iron penetration resistance, and other properties of carbonaceous refractories required for blast furnace bottom refractories. The mechanical strength of the refractories is raised so as to suppress cracking due to thermal stress. The carbonaceous refractory comprises a carbonaceous material comprising one or more of calcined anthracite, calcined coke, natural graphite, or artificial graphite in 60 to 85 mass %, a refractory metal oxide in 5 to 15 mass %, metal silicon in 4 to 15 mass %, and carbon black in 2 to 10 mass %. An organic binder is added to refractory materials, which are kneaded, molded and fired in a nonoxidizing atmosphere.
摘要翻译：提供了碳质耐火材料和生产方法，其防止了高炉底部耐火材料所需的生铁耐腐蚀性，熔融猪铁渗透阻力以及耐火材料的其它性能的降低。提高耐火材料的机械强度，以抑制由于热应力引起的开裂。碳质耐火材料包括含有60〜85质量％的煅烧无烟煤，煅烧焦炭，天然石墨或人造石墨中的一种或多种的碳质材料，5〜15质量％的难熔金属氧化物，4〜15质量％的金属硅，，炭黑为2〜10质量％。将有机粘合剂加入耐火材料中，将其在非氧化气氛中捏合，模制和烧制。

9. 发明授权

US08750731B2 Image formation apparatus 有权
标题翻译：图像形成装置
公开(公告)号：US08750731B2
公开(公告)日：2014-06-10
申请号：US13354865
申请日：2012-01-20
申请人： Hiroyuki Inoue
发明人： Hiroyuki Inoue
IPC分类号： G03G15/00
CPC分类号： G03G15/50 , G03G15/5008 , G03G15/6564 , G03G2215/00721
摘要： An image formation apparatus includes an image carrier on which a developer image is to be formed, an image transfer device configured to transfer the developer image formed on the image carrier to a medium at an image transfer position, a controller configured to control drive of the image carrier and the image transfer device, a first medium feeder configured to feed the medium to the image transfer position along a medium conveyance path extending from the first medium feeder to the image transfer position, and a medium detector provided between the first medium feeder and the image transfer position in the medium conveyance path. The controller is configured to control the drive of the image carrier on the basis of a medium-detection result by the medium detector.
摘要翻译：图像形成装置包括要在其上形成显影剂图像的图像载体，被配置为将形成在图像载体上的显影剂图像转印到图像转印位置的介质的图像转印装置，被配置为控制图像载体图像载体和图像转印装置，第一介质供给器，被配置为沿着从第一介质进料器延伸到图像转印位置的介质输送路径将介质输送到图像转印位置，以及介质检测器，设置在第一介质进料器和介质输送路径中的图像转印位置。控制器被配置为基于介质检测器的介质检测结果来控制图像载体的驱动。

10. 发明申请

US20140013612A1 TENTER OVEN AND MANUFACTURING METHOD FOR STRETCHED FILM 有权
标题翻译：丝网烤箱和制造薄膜的制造方法
公开(公告)号：US20140013612A1
公开(公告)日：2014-01-16
申请号：US14007780
申请日：2012-03-23
申请人： Doseok Lee , Takuya Kawagoe , Hiroyuki Inoue
发明人： Doseok Lee , Takuya Kawagoe , Hiroyuki Inoue
IPC分类号： B29C35/04
CPC分类号： B29C35/045 , B29C55/08 , B29C55/20 , F26B13/00 , F26B21/004
摘要： A tenter oven stretches a thermoplastic resin film in the width direction thereof, wherein an air blowing nozzle provided therein that blows heated air onto a film running along a film passing surface is a proximate nozzle in which an air blowing opening provided on the air blowing surface thereof is formed as a slit, a distance (L) between the air blowing surface and the film passing surface and a slit width (B) of the slit satisfy the relationship expressed by the equation, (L/B)≦10, and the distance (L) is 150 mm or less.
摘要翻译：拉幅机烘箱在其宽度方向上延伸热塑性树脂膜，其中设置在其中的空气吹送喷嘴将加热的空气吹送到沿着膜通过表面延伸的膜上，是近似的喷嘴，其中设置在吹风表面形成为狭缝，空气吹出面与膜通过面之间的距离（L）和狭缝的狭缝宽度（B）满足由式（L / B）@ 10表示的关系，并且距离（L）为150mm以下。

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