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1. 发明授权

US06400013B1 Thermoelectric module with interarray bridges 失效
标题翻译：带电桥的热电模块
公开(公告)号：US06400013B1
公开(公告)日：2002-06-04
申请号：US09709577
申请日：2000-11-13
申请人： Michimasa Tsuzaki , Nobuteru Maekawa , Narimasa Iwamoto , Junji Imai , Hiroaki Okada , Teruaki Komatsu , Shinya Murase , Hiroyuki Inoue , Masayuki Sagawa , Yuri Sakai
发明人： Michimasa Tsuzaki , Nobuteru Maekawa , Narimasa Iwamoto , Junji Imai , Hiroaki Okada , Teruaki Komatsu , Shinya Murase , Hiroyuki Inoue , Masayuki Sagawa , Yuri Sakai
IPC分类号： H01L2334
CPC分类号： H01L35/325 , H01L35/32 , H01L2924/0002 , H01L2924/00
摘要： A thermoelectric module is capable of successfully reducing the heat stress for increased reliability. The module includes a plurality of thermoelectric chips of P-type and N-type arranged in a matrix between sets of first and second contacts to form a series electrical circuit. The chips are arranged to give at least three chip arrays each having a limited number of the chips. A first carrier is provided on one side of the chips to carry the first contacts and to include first bridges each integrally joining two adjacent first contacts to define first discrete couples for electrical connection of the chips in each chip array. The first carrier further includes at least two inter-array bridges which are solely responsible for electrical interconnection between the adjacent chip arrays. On the opposite side of the chips, there are formed a plurality of second bridges each integrally joining the two adjacent second contacts to give second discrete couples for electrical connection of the two adjacent chips in each of the chip arrays. Thus, the inter-array bridges are formed only on one side of the chips for interconnection of the first contacts between the adjacent chip arrays. Therefore, the heat stress applied to the end of the chip array where the two adjacent chip arrays are interconnected can be well relieved on the side of the second contacts in which the second discrete couples are kept totally isolated from each other.
摘要翻译：热电模块能够成功地降低热应力以提高可靠性。该模块包括在第一和第二触点组之间以矩阵形式布置的多个P型和N型热电芯片，以形成串联电路。芯片被布置成给出至少三个芯片阵列，每个芯片阵列具有有限数量的芯片。第一载体设置在芯片的一侧以承载第一触点并且包括每个一体地连接两个相邻的第一触点的第一桥，以限定用于每个芯片阵列中的芯片的电连接的第一离散耦合。第一载体还包括至少两个排列间桥，其单独负责相邻芯片阵列之间的电互连。在芯片的相对侧，形成多个第二桥，每个第二桥整体地连接两个相邻的第二触点，以给出第二离散耦合，用于电连接每个芯片阵列中的两个相邻的芯片。因此，阵列间桥仅形成在芯片的一侧，用于相邻芯片阵列之间的第一触点的互连。因此，施加到两个相邻芯片阵列相互连接的芯片阵列的端部的热应力可以在第二接触件的一侧彼此完全隔离的第二触头侧得到很好的缓解。

2. 发明授权

US06391676B1 Thermoelectric module and a method of fabricating the same 失效
标题翻译：热电模块及其制造方法
公开(公告)号：US06391676B1
公开(公告)日：2002-05-21
申请号：US09200972
申请日：1998-11-30
申请人： Michimasa Tsuzaki , Nobuteru Maekawa , Narimasa Iwamoto , Junji Imai , Hiroaki Okada , Teruaki Komatsu , Shinya Murase , Hiroyuki Inoue , Masayuki Sagawa , Yuri Sakai
发明人： Michimasa Tsuzaki , Nobuteru Maekawa , Narimasa Iwamoto , Junji Imai , Hiroaki Okada , Teruaki Komatsu , Shinya Murase , Hiroyuki Inoue , Masayuki Sagawa , Yuri Sakai
IPC分类号： H01L2100
CPC分类号： H01L35/325 , H01L35/32 , H01L2924/0002 , H01L2924/00
摘要： A thermoelectric module is capable of successfully reducing the heat stress for increased reliability. The module includes a plurality of thermoelectric chips of P-type and N-type arranged in a matrix between sets of first and second contacts to form a series electrical circuit. The chips are arranged to give at least three chip arrays each having a limited number of the chips. A first carrier is provided on one side of the chips to carry the first contacts and to include first bridges each integrally joining two adjacent first contacts to define first discrete couples for electrical connection of the chips in each chip array. The first carrier further includes at least two inter-array bridges which are solely responsible for electrical interconnection between the adjacent chip arrays. On the opposite side of the chips, there are formed a plurality of second bridges each integrally joining the two adjacent second contacts to give second discrete couples for electrical connection of the two adjacent chips in each of the chip arrays. Thus, the inter-array bridges are formed only on one side of the chips for interconnection of the first contacts between the adjacent chip arrays. Therefore, the heat stress applied to the end of the chip array where the two adjacent chip arrays are interconnected can be well relieved on the side of the second contacts in which the second discrete couples are kept totally isolated from each other.
摘要翻译：热电模块能够成功地降低热应力以提高可靠性。该模块包括在第一和第二触点组之间以矩阵形式布置的多个P型和N型热电芯片，以形成串联电路。芯片被布置成给出至少三个芯片阵列，每个芯片阵列具有有限数量的芯片。第一载体设置在芯片的一侧以承载第一触点并且包括每个一体地连接两个相邻的第一触点的第一桥，以限定用于每个芯片阵列中的芯片的电连接的第一离散耦合。第一载体还包括至少两个排列间桥，其单独负责相邻芯片阵列之间的电互连。在芯片的相对侧，形成多个第二桥，每个第二桥整体地连接两个相邻的第二触点，以给出第二离散耦合，用于电连接每个芯片阵列中的两个相邻的芯片。因此，阵列间桥仅形成在芯片的一侧，用于相邻芯片阵列之间的第一触点的互连。因此，施加到两个相邻芯片阵列相互连接的芯片阵列的端部的热应力可以在第二接触件的一侧彼此完全隔离的第二触头侧得到很好的缓解。

3. 发明授权

US07473298B2 Charged water particle, and method for creating environment where mist of charged water particle is dispersed 有权
标题翻译：带电水粒子，以及分散带电水粒子雾的产生环境的方法
公开(公告)号：US07473298B2
公开(公告)日：2009-01-06
申请号：US10552743
申请日：2004-05-26
申请人： Hiroshi Suda , Yasunori Matsui , Narimasa Iwamoto , Toshiyuki Yamauchi , Shigekazu Azukizawa , Takayuki Nakada , Tomonori Tanaka , Tomohiro Yamaguchi
发明人： Hiroshi Suda , Yasunori Matsui , Narimasa Iwamoto , Toshiyuki Yamauchi , Shigekazu Azukizawa , Takayuki Nakada , Tomonori Tanaka , Tomohiro Yamaguchi
IPC分类号： B03C3/013
CPC分类号： C01B15/01 , A61L2/22 , A61L9/14 , B03C3/014 , B05B1/14 , B05B5/0255 , C01B5/00
摘要： Charged fine particulate water is provided, which has a nanometer particle size, for example, a particle size of 3 to 100 nm, and contains radicals such as hydroxyl radicals and superoxides. This charged fine particulate water can be generated by applying an electric-field intensity of 700 to 1200 V/mm between a pair of electrodes, while supplying water between the electrodes. By allowing the thus obtained charged fine particulate water to diffuse into an indoor space, it is possible to effectively remove bad odor components/bacteria from the indoor space.
摘要翻译：提供了带有微米级粒子的水，其具有例如粒径为3〜100nm的纳米粒径，并且含有自由基，例如羟基自由基和超氧化物。通过在一对电极之间施加700〜1200V / mm的电场强度，同时在电极之间供水，可以产生该带电的细颗粒水。通过使由此得到的带电微粒子水扩散到室内空间，能够有效地从室内空间去除臭气成分/细菌。

4. 发明申请

US20060214020A1 Charged water particle, and method for creating environment where mist of charged water particle is dispersed 有权
公开(公告)号：US20060214020A1
公开(公告)日：2006-09-28
申请号：US10552743
申请日：2004-05-26
申请人： Hiroshi Suda , Yasunori Matsui , Narimasa Iwamoto , Toshiyuki Yamauchi , Shigekazu Azukizawa , Takayuki Nakada , Tomonori Tanaka , Tomohiro Yamaguchi
发明人： Hiroshi Suda , Yasunori Matsui , Narimasa Iwamoto , Toshiyuki Yamauchi , Shigekazu Azukizawa , Takayuki Nakada , Tomonori Tanaka , Tomohiro Yamaguchi
IPC分类号： B05B5/025 , F23D11/32
CPC分类号： C01B15/01 , A61L2/22 , A61L9/14 , B03C3/014 , B05B1/14 , B05B5/0255 , C01B5/00
摘要： Charged fine particulate water is provided, which has a nanometer particle size, for example, a particle size of 3 to 100 nm, and contains radicals such as hydroxyl radicals and superoxides. This charged fine particulate water can be generated by applying an electric-field intensity of 700 to 1200 V/mm between a pair of electrodes, while supplying water between the electrodes. By allowing the thus obtained charged fine particulate water to diffuse into an indoor space, it is possible to effectively remove bad odor components/bacteria from the indoor space.

5. 发明授权

US06231959B1 Prepreg of epoxy resin, hardener, and organodialkyurea promotor 失效
标题翻译：环氧树脂预浸料，固化剂和有机二元醇促进剂
公开(公告)号：US06231959B1
公开(公告)日：2001-05-15
申请号：US09225500
申请日：1999-01-06
申请人： Yoshihiko Nakamura , Masahiro Matsumura , Narimasa Iwamoto , Hidetsugu Motobe , Yukio Hatta
发明人： Yoshihiko Nakamura , Masahiro Matsumura , Narimasa Iwamoto , Hidetsugu Motobe , Yukio Hatta
IPC分类号： B32B1704
CPC分类号： C08G59/686 , C08G59/5086 , C08G59/621 , H05K1/0326 , Y10T428/24994 , Y10T428/31511
摘要： An epoxy resin composition featured in containing, in a matrix of an epoxy resin having more than two epoxy groups in each molecule, a phenolic hardening agent having more than two phenolic hydroxyl groups in each molecule, an organobis(N-dialkylurea) hardening promotion agent, a solvent for the hardening promotion agent, and a guanamine compound, and capable of obtaining a prepreg excellent in the preservation stability and, less causing a solvency errosion (halo phenomenon) due to an infiltration of plating solution along boundaries between a printed copper circuit formed in an inner-layered circuit board and a resin forming the prepreg, is realized.
摘要翻译：一种环氧树脂组合物，其特征在于，在每个分子中具有多于两个环氧基的环氧树脂的基质中含有每个分子中具有多于两个酚羟基的酚类硬化剂，有机双（N-二烷基脲）硬化促进剂，硬化促进剂的溶剂和胍胺化合物，并且能够获得保存稳定性优异的预浸料，并且由于电镀液沿着印刷铜电路之间的边界渗入而导致溶解性腐蚀（光晕现象）形成在内层电路板和形成预浸料的树脂中。

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