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1. 发明授权

US07009706B2 Measuring chip 失效
标题翻译：测量芯片
公开(公告)号：US07009706B2
公开(公告)日：2006-03-07
申请号：US10318406
申请日：2002-12-13
申请人： Nobufumi Mori , Takeharu Tani , Atsushi Mukai
发明人： Nobufumi Mori , Takeharu Tani , Atsushi Mukai
IPC分类号： G01N21/55
CPC分类号： G01N21/553 , G01N21/552
摘要： A measuring chip comprising a dielectric block and a thin film layer formed on one surface of the dielectric block. The thin film layer is used for placing a sample thereon. The dielectric block is formed as a single block, which includes an entrance surface at which a light beam enters the dielectric block, an exit surface from which the light beam emerges, and the one surface on which the thin film layer is formed. In addition, the dielectric block is integrated with the thin film layer and formed from a resin whose photoelastic coefficient is less than 50×10−12 Pa−1.
摘要翻译：一种测量芯片，包括形成在介质块的一个表面上的介质块和薄膜层。薄膜层用于在其上放置样品。介质块形成为单个块，其包括光束入射到介质块的入射表面，出射表面以及形成有薄膜层的一个表面。此外，介电块与薄膜层成一体，并由光弹性系数小于50×10 -2 Pa -1的树脂形成。

2. 发明申请

US20130238924A1 TEMPERATURE CONTROLLER 有权
标题翻译：温度控制器
公开(公告)号：US20130238924A1
公开(公告)日：2013-09-12
申请号：US13381024
申请日：2011-03-16
申请人： Atsushi Mukai , Hirofumi Hosokawa , Yutaka Tomiki , Nobuhiko Negishi
发明人： Atsushi Mukai , Hirofumi Hosokawa , Yutaka Tomiki , Nobuhiko Negishi
IPC分类号： G06F1/32
CPC分类号： G06F1/3206 , G05D23/22
摘要： A temperature controller capable of being connected to a computer is able to be stably operated at the time of being connected to the computer. The temperature controller is operated by a power source from the computer and operated by a general power source. A voltage used in the temperature controller includes a first voltage for processing a digital signal. The temperature controller includes a feedback circuit for monitoring a change in the first voltage of the temperature controller and when detecting that the first voltage exceeds a predetermined value, lowering the supply of the general power source, and the voltage of the power source supplied from the computer is smaller than the predetermined value.
摘要翻译：能够连接到计算机的温度控制器能够在连接到计算机时稳定地操作。温度控制器由来自计算机的电源操作并由一般电源操作。用于温度控制器的电压包括用于处理数字信号的第一电压。温度控制器包括用于监测温度控制器的第一电压的变化的反馈电路，并且当检测到第一电压超过预定值时，降低一般电源的供应，以及从该电源供应的电源的电压计算机小于预定值。

3. 发明授权

US07501649B2 Sensor including porous body with metal particles loaded in the pores of the body and measuring apparatus using the same 失效
标题翻译：传感器包括具有装载在身体孔中的金属颗粒的多孔体和使用其的测量装置
公开(公告)号：US07501649B2
公开(公告)日：2009-03-10
申请号：US11638573
申请日：2006-12-14
申请人： Masayuki Naya , Atsushi Mukai
发明人： Masayuki Naya , Atsushi Mukai
IPC分类号： H01L29/15
CPC分类号： G01N21/554
摘要： A sensor chip includes a layer-shaped base body, which has a plurality of fine holes formed in one surface, and fine metal particles, each of which is loaded in one of the fine holes of the base body. At least a part of each of the fine metal particles is exposed to a side of the layer-shaped base body, which side is more outward than the one surface of the layer-shaped base body. The layer-shaped base body may be constituted of anodic oxidation alumina. The sensor chip constitutes a sensor utilizing localized plasmon resonance, with which a state of binding of a sensing medium with a specific substance is capable of being detected quickly and with a high sensitivity.
摘要翻译：传感器芯片包括具有形成在一个表面中的多个细孔的层状基体和分别装载在基体的一个细孔中的金属微粒。每个细金属颗粒的至少一部分暴露于层状基体的一侧，该侧比层状基体的一个表面更向外侧。层状基体可以由阳极氧化氧化铝构成。传感器芯片构成利用局部等离子体共振的传感器，通过该传感器能够快速且灵敏地检测感测介质与特定物质的结合状态。

4. 发明申请

US20100236606A1 PHOTOELECTRIC CONVERSION DEVICE AND SOLAR CELL, AND PROCESS FOR PRODUCING THE PHOTOELECTRIC CONVERSION DEVICE 审中-公开
标题翻译：光电转换装置和太阳能电池，以及用于制造光电转换装置的方法
公开(公告)号：US20100236606A1
公开(公告)日：2010-09-23
申请号：US12721314
申请日：2010-03-10
申请人： Hiroyuki Kobayashi , Shinya Suzuki , Toshiaki Fukunaga , Atsushi Mukai
发明人： Hiroyuki Kobayashi , Shinya Suzuki , Toshiaki Fukunaga , Atsushi Mukai
IPC分类号： H01L27/142 , H01L31/0216 , H01L31/18
CPC分类号： H01L31/0392 , H01L21/02568 , H01L21/02631 , H01L31/0322 , H01L31/03925 , H01L31/03928 , H01L31/046 , H01L31/065 , H01L31/0749 , Y02E10/541
摘要： A photoelectric conversion device wherein a lower electrode, a photoelectric-conversion semiconductor layer of a compound semiconductor material, and an upper electrode are formed in this order on an anodized substrate in which an anodized oxide film as an insulating film is formed on an aluminum base arranged at at least one surface of a metal substrate. The lower electrode is formed on the anodized oxide film. The main component of the photoelectric-conversion semiconductor layer is a compound semiconductor material with a chalcopyrite structure of Group Ib, IIIb and VIb elements. The photoelectric conversion device includes at least one insulative alkali supply layer formed between the anodized substrate and the lower electrode, and at least one insulative antidiffusion layer being formed between the anodized substrate and the at least one alkali supply layer, and suppressing diffusion, toward the anodized substrate, of one or more alkali and/or alkaline earth metal elements.
摘要翻译：在阳极氧化基板上依次形成下电极，化合物半导体材料的光电转换半导体层和上电极的光电转换装置，其中在铝基底上形成作为绝缘膜的阳极化氧化膜布置在金属基板的至少一个表面上。在阳极氧化膜上形成下电极。光电转换半导体层的主要成分是具有Ib，IIIb和VIb族元素的黄铜矿结构的化合物半导体材料。光电转换装置包括在阳极氧化基板和下电极之间形成的至少一个绝缘碱性供应层，并且在阳极化基板和至少一个碱供应层之间形成至少一个绝缘抗扩散层，并且抑制扩散阳极氧化底物，一种或多种碱金属和/或碱土金属元素。

5. 发明申请

US20070090411A1 Sensor chip, process for producing the same, and sensor using the same 失效
标题翻译：传感器芯片，其制造方法和使用其的传感器
公开(公告)号：US20070090411A1
公开(公告)日：2007-04-26
申请号：US11638573
申请日：2006-12-14
申请人： Masayuki Naya , Atsushi Mukai
发明人： Masayuki Naya , Atsushi Mukai
IPC分类号： H01L29/768
CPC分类号： G01N21/554
摘要： A sensor chip includes a layer-shaped base body, which has a plurality of fine holes formed in one surface, and fine metal particles, each of which is loaded in one of the fine holes of the base body. At least a part of each of the fine metal particles is exposed to a side of the layer-shaped base body, which side is more outward than the one surface of the layer-shaped base body. The layer-shaped base body may be constituted of anodic oxidation alumina. The sensor chip constitutes a sensor utilizing localized plasmon resonance, with which a state of binding of a sensing medium with a specific substance is capable of being detected quickly and with a high sensitivity.
摘要翻译：传感器芯片包括具有形成在一个表面中的多个细孔的层状基体和分别装载在基体的一个细孔中的金属微粒。每个细金属颗粒的至少一部分暴露于层状基体的一侧，该侧比层状基体的一个表面更向外侧。层状基体可以由阳极氧化氧化铝构成。传感器芯片构成利用局部等离子体共振的传感器，通过该传感器能够快速且灵敏地检测感测介质与特定物质的结合状态。

6. 发明授权

US07079250B2 Structure, structure manufacturing method and sensor using the same 失效
标题翻译：结构，结构制造方法及使用其的传感器
公开(公告)号：US07079250B2
公开(公告)日：2006-07-18
申请号：US11067661
申请日：2005-02-28
申请人： Atsushi Mukai
发明人： Atsushi Mukai
IPC分类号： G01N21/55 , G01B9/02
CPC分类号： G01N21/554
摘要： A plasmon resonance device 100 according to an example of a structure is characterized in that metallic particles 7 isolated from each other are formed in each of a plurality of pores 5 of anodic oxidized alumina 3. As a method of manufacturing the plasmon resonance device 100, a metal is coated on the anodic oxidized alumina 3 opening the pores 5 and a metal coated element provided on the opening surface of the pore in the anodic oxidized alumina 3 is removed. Consequently, metallic particles isolated from each other are formed in the respective independent pores. The plasmon resonance device 100 can be used as a sensor utilizing a localized plasmon resonance phenomenon.
摘要翻译：根据结构的实例的等离子体共振装置100的特征在于，在阳极氧化氧化铝3的多个孔5中形成彼此隔离的金属颗粒7.作为制造等离子体共振装置100的方法，将金属涂覆在阳极氧化的氧化铝3上，打开孔5，并且去除设置在阳极氧化氧化铝3中的孔的开口表面上的金属涂覆元件。因此，在各个独立的孔中形成彼此分离的金属颗粒。等离子体共振装置100可以用作利用局部等离子体共振现象的传感器。

7. 发明申请

US20050266321A1 Mask for proximity field optical exposure, exposure apparatus and method therefor 审中-公开
标题翻译：用于近场光学曝光的掩模，曝光装置及其方法
公开(公告)号：US20050266321A1
公开(公告)日：2005-12-01
申请号：US11144944
申请日：2005-06-06
申请人： Isao Tsuruma , Masayuki Naya , Atsushi Mukai
发明人： Isao Tsuruma , Masayuki Naya , Atsushi Mukai
IPC分类号： G03B27/42 , G03B27/58 , G03C5/00 , G03F1/00 , G03F1/60 , G03F1/82 , G03F7/20 , H01L21/027
CPC分类号： B82Y10/00 , G03F1/50 , G03F1/82 , G03F7/2014 , G03F7/70325 , G03F7/7035 , G03F7/707 , G03F7/70741 , G03F7/70783
摘要： A mask for exposure 1 having an aperture in a prescribed pattern formed on one surface and subjected to proximity field exposure in a state kept in contact with the surface of a wafer 2. The mask 1 is made of a transparent material such as glass or quartz glass. The mask 1 forms a circular shape with a thickness of 1 mm or less, preferably 0.1-0.5 mm.
摘要翻译：一种曝光用掩模1，其具有形成在一个表面上的规定图案的孔径，并且在与晶片2的表面保持接触的状态下进行近场曝光。面罩1由诸如玻璃或石英玻璃的透明材料制成。掩模1形成厚度为1mm以下，优选为0.1-0.5mm的圆形。

8. 发明授权

US07031168B2 Electronic component and the method of using it 有权
标题翻译：电子元件及其使用方法
公开(公告)号：US07031168B2
公开(公告)日：2006-04-18
申请号：US10438333
申请日：2003-05-15
申请人： Shigeyuki Kato , Takafumi Kishi , Maakazu Kido , Toshimichi Surga , Gen Yoneda , Akira Takaishi , Atsushi Mukai , Yoshihiro Nagami , Hirofumi Hosokawa
发明人： Shigeyuki Kato , Takafumi Kishi , Maakazu Kido , Toshimichi Surga , Gen Yoneda , Akira Takaishi , Atsushi Mukai , Yoshihiro Nagami , Hirofumi Hosokawa
IPC分类号： H05K1/00 , H05K1/18 , H05K1/02 , H05K1/06 , H05K1/08
CPC分类号： G05B19/0421
摘要： Module substrates each having the functions of input, power supply, and output/communication corresponding to the required model are attached to a base substrate having shared bus wiring. Thus, a main CPU of an input module can discriminate the respective module substrates to perform the control operation corresponding to the model, thereby sharing the module substrates among different models.
摘要翻译：具有对应于所需型号的输入，电源和输出/通信功能的模块基板附接到具有共享总线布线的基板。因此，输入模块的主CPU可以区分各个模块基板以执行与模型相对应的控制操作，从而在不同型号之间共享模块基板。

9. 发明申请

US20050227153A1 Mask for proximity field optical exposure, exposure apparatus and method therefor 审中-公开
标题翻译：用于近场光学曝光的掩模，曝光装置及其方法
公开(公告)号：US20050227153A1
公开(公告)日：2005-10-13
申请号：US11144825
申请日：2005-06-06
申请人： Isao Tsuruma , Masayuki Naya , Atsushi Mukai
发明人： Isao Tsuruma , Masayuki Naya , Atsushi Mukai
IPC分类号： G03B27/42 , G03B27/58 , G03C5/00 , G03F1/00 , G03F1/60 , G03F1/82 , G03F7/20 , H01L21/027 , G03F9/00
CPC分类号： B82Y10/00 , G03F1/50 , G03F1/82 , G03F7/2014 , G03F7/70325 , G03F7/7035 , G03F7/707 , G03F7/70741 , G03F7/70783
摘要： A mask for exposure 1 having an aperture in a prescribed pattern formed on one surface and subjected to proximity field exposure in a state kept in contact with the surface of a wafer 2. The mask 1 is made of a transparent material such as glass or quartz glass. The mask 1 forms a circular shape with a thickness of 1 mm or less, preferably 0.1-0.5 mm.
摘要翻译：一种曝光用掩模1，其具有形成在一个表面上的规定图案的孔径，并且在与晶片2的表面保持接触的状态下进行近场曝光。掩模1由透明材料制成，例如玻璃或石英玻璃。掩模1形成厚度为1mm以下，优选为0.1-0.5mm的圆形。

10. 发明申请

US20050170494A1 Structure, structure manufacturing method and sensor using the same 失效
标题翻译：结构，结构制造方法及使用其的传感器
公开(公告)号：US20050170494A1
公开(公告)日：2005-08-04
申请号：US11067661
申请日：2005-02-28
申请人： Atsushi Mukai
发明人： Atsushi Mukai
IPC分类号： C12M1/34 , G01N21/55 , G01N33/553
CPC分类号： G01N21/554
摘要： A plasmon resonance device 100 according to an example of a structure is characterized in that metallic particles 7 isolated from each other are formed in each of a plurality of pores 5 of anodic oxidized alumina 3. As a method of manufacturing the plasmon resonance device 100, a metal is coated on the anodic oxidized alumina 3 opening the pores 5 and a metal coated element provided on the opening surface of the pore in the anodic oxidized alumina 3 is removed. Consequently, metallic particles isolated from each other are formed in the respective independent pores. The plasmon resonance device 100 can be used as a sensor utilizing a localized plasmon resonance phenomenon.
摘要翻译：根据结构的实例的等离子体共振装置100的特征在于，在阳极氧化氧化铝3的多个孔5中形成彼此隔离的金属颗粒7.作为制造等离子体共振装置100的方法，将金属涂覆在阳极氧化的氧化铝3上，打开孔5，并且去除设置在阳极氧化氧化铝3中的孔的开口表面上的金属涂覆元件。因此，在各个独立的孔中形成彼此分离的金属颗粒。等离子体共振装置100可以用作利用局部等离子体共振现象的传感器。

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