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1. 发明授权

US07935230B2 Electro-chemical processor 有权
标题翻译：电化学处理器
公开(公告)号：US07935230B2
公开(公告)日：2011-05-03
申请号：US11608151
申请日：2006-12-07
申请人： Daniel J. Woodruff , Paul R. McHugh , Gregory J. Wilson , Kyle M. Hanson , Nigel Stewart , Erik Lund , Steven L. Peace
发明人： Daniel J. Woodruff , Paul R. McHugh , Gregory J. Wilson , Kyle M. Hanson , Nigel Stewart , Erik Lund , Steven L. Peace
IPC分类号： C25F7/00
CPC分类号： C25D17/001 , C25D17/004
摘要： A processor for making porous silicon or processing other substrates has first and second chamber assemblies. The first and second chamber assemblies include first and second seals for sealing against a wafer, and first and second electrodes, respectively. The first and/or second seal is moveable towards and away from a wafer in the processor, to move between a wafer load/unload position, and a wafer process position. The first electrode may move along with the first seal, and the second electrode may move along with the second seal. A light source shines light onto the first side of the wafer. The processor may be pivotable from a substantially horizontal orientation, for loading and unloading a wafer, to a substantially vertical orientation, for processing a wafer.
摘要翻译：用于制造多孔硅或处理其它衬底的处理器具有第一和第二室组件。第一和第二室组件包括分别用于密封晶片的第一和第二密封件以及第一和第二电极。第一和/或第二密封件可朝向和远离处理器中的晶片移动，以在晶片装载/卸载位置与晶片工艺位置之间移动。第一电极可以与第一密封件一起移动，并且第二电极可以与第二密封件一起移动。光源将光照射到晶片的第一面上。处理器可以从用于加载和卸载晶片的基本上水平的方向枢转到基本垂直的取向，用于处理晶片。

2. 发明授权

US07927469B2 Electro-chemical processor 有权
标题翻译：电化学处理器
公开(公告)号：US07927469B2
公开(公告)日：2011-04-19
申请号：US11467232
申请日：2006-08-25
申请人： Nigel Stewart , Daniel J. Woodruff , Paul R. McHugh , Gregory J. Wilson , Kyle M. Hanson , Erik Lund , Steven L. Peace
发明人： Nigel Stewart , Daniel J. Woodruff , Paul R. McHugh , Gregory J. Wilson , Kyle M. Hanson , Erik Lund , Steven L. Peace
IPC分类号： C25F7/00
CPC分类号： H01L21/6719 , H01L21/67115 , H01L21/67126
摘要： A processor for making porous silicon or processing other substrates has first and second chamber assemblies. The first and second chamber assemblies include first and second seals for sealing against a wafer, and first and second electrodes, respectively. The second seal is moveable towards and away from a wafer in the processor, to move between a wafer load/unload position, and a wafer process position. The second electrode may move with the second seal. A light source shines light onto the first side of the wafer. The processor may be pivotable from a substantially horizontal orientation, for loading and unloading a wafer, to a substantially vertical orientation, for processing a wafer.
摘要翻译：用于制造多孔硅或处理其它衬底的处理器具有第一和第二室组件。第一和第二室组件包括分别用于密封晶片的第一和第二密封件以及第一和第二电极。第二密封件可朝向和远离处理器中的晶片移动，以在晶片装载/卸载位置与晶片工艺位置之间移动。第二电极可以与第二密封件一起移动。光源将光照射到晶片的第一面上。处理器可以从用于加载和卸载晶片的基本上水平的方向枢转到基本垂直的取向，用于处理晶片。

3. 发明申请

US20080003781A1 ELECTRO-CHEMICAL PROCESSOR 有权
标题翻译：电化学处理器
公开(公告)号：US20080003781A1
公开(公告)日：2008-01-03
申请号：US11608151
申请日：2006-12-07
申请人： Daniel J. Woodruff , Paul R. McHugh , Gregory J. Wilson , Kyle M. Hanson , Nigel Stewart , Erik Lund , Steven L. Peace
发明人： Daniel J. Woodruff , Paul R. McHugh , Gregory J. Wilson , Kyle M. Hanson , Nigel Stewart , Erik Lund , Steven L. Peace
IPC分类号： H01L21/326
CPC分类号： C25D17/001 , C25D17/004
摘要： A processor for making porous silicon or processing other substrates has first and second chamber assemblies. The first and second chamber assemblies include first and second seals for sealing against a wafer, and first and second electrodes, respectively. The first and/or second seal is moveable towards and away from a wafer in the processor, to move between a wafer load/unload position, and a wafer process position. The first electrode may move along with the first seal, and the second electrode may move along with the second seal. A light source shines light onto the first side of the wafer. The processor may be pivotable from a substantially horizontal orientation, for loading and unloading a wafer, to a substantially vertical orientation, for processing a wafer.
摘要翻译：用于制造多孔硅或处理其它衬底的处理器具有第一和第二室组件。第一和第二室组件包括分别用于密封晶片的第一和第二密封件以及第一和第二电极。第一和/或第二密封件可朝向和远离处理器中的晶片移动，以在晶片装载/卸载位置与晶片工艺位置之间移动。第一电极可以与第一密封件一起移动，并且第二电极可以与第二密封件一起移动。光源将光照射到晶片的第一面上。处理器可以从用于加载和卸载晶片的基本上水平的方向枢转到基本垂直的取向，用于处理晶片。

4. 发明申请

US20080048306A1 ELECTRO-CHEMICAL PROCESSOR 有权
标题翻译：电化学处理器
公开(公告)号：US20080048306A1
公开(公告)日：2008-02-28
申请号：US11467232
申请日：2006-08-25
申请人： Nigel Stewart , Daniel J. Woodruff , Paul R. McHugh , Gregory J. Wilson , Kyle M. Hanson , Erik Lund , Steven L. Peace
发明人： Nigel Stewart , Daniel J. Woodruff , Paul R. McHugh , Gregory J. Wilson , Kyle M. Hanson , Erik Lund , Steven L. Peace
IPC分类号： H01L23/06
CPC分类号： H01L21/6719 , H01L21/67115 , H01L21/67126
摘要： A processor for making porous silicon or processing other substrates has first and second chamber assemblies. The first and second chamber assemblies include first and second seals for sealing against a wafer, and first and second electrodes, respectively. The second seal is moveable towards and away from a wafer in the processor, to move between a wafer load/unload position, and a wafer process position. The second electrode may move with the second seal. A light source shines light onto the first side of the wafer. The processor may be pivotable from a substantially horizontal orientation, for loading and unloading a wafer, to a substantially vertical orientation, for processing a wafer.
摘要翻译：用于制造多孔硅或处理其它衬底的处理器具有第一和第二室组件。第一和第二室组件包括分别用于密封晶片的第一和第二密封件以及第一和第二电极。第二密封件可朝向和远离处理器中的晶片移动，以在晶片装载/卸载位置与晶片工艺位置之间移动。第二电极可以与第二密封件一起移动。光源将光照射到晶片的第一面上。处理器可以从用于加载和卸载晶片的基本上水平的方向枢转到基本垂直的取向，用于处理晶片。

5. 发明申请

US20100078334A1 ELECTRO-CHEMICAL PROCESSOR 失效
标题翻译：电化学处理器
公开(公告)号：US20100078334A1
公开(公告)日：2010-04-01
申请号：US11457192
申请日：2006-07-13
申请人： Daniel J. Woodruff , Paul R. McHugh , Gregory J. Wilson , Kyle M. Hanson , Erik Lund , Steven L. Peace
发明人： Daniel J. Woodruff , Paul R. McHugh , Gregory J. Wilson , Kyle M. Hanson , Erik Lund , Steven L. Peace
IPC分类号： C25F3/00 , C25F7/00 , C25B9/00 , C25D17/00 , C25C7/00
CPC分类号： C25F7/00
摘要： An electro-chemical processor for making porous silicon or processing other substrates has first and second chamber assemblies. The first and second chamber assemblies include first and second seals for sealing against a wafer, and first and second electrodes, respectively. The first seal is moveable towards and away from a wafer in the processor, to move between a wafer load/unload position, and a wafer process position. The first electrode may move along with the first seal. The processor may be pivotable from a substantially horizontal orientation, for loading and unloading a wafer, to a substantially vertical orientation, for processing a wafer.
摘要翻译：用于制造多孔硅或处理其它衬底的电化学处理器具有第一和第二室组件。第一和第二室组件包括分别用于密封晶片的第一和第二密封件以及第一和第二电极。第一密封件可朝向和远离处理器中的晶片移动，以在晶片装载/卸载位置与晶片工艺位置之间移动。第一电极可以与第一密封件一起移动。处理器可以从用于加载和卸载晶片的基本上水平的方向枢转到基本垂直的取向，用于处理晶片。

6. 发明授权

US07909967B2 Electro-chemical processor 失效
标题翻译：电化学处理器
公开(公告)号：US07909967B2
公开(公告)日：2011-03-22
申请号：US11457192
申请日：2006-07-13
申请人： Daniel J. Woodruff , Paul R. McHugh , Gregory J. Wilson , Kyle M. Hanson , Erik Lund , Steven L. Peace
发明人： Daniel J. Woodruff , Paul R. McHugh , Gregory J. Wilson , Kyle M. Hanson , Erik Lund , Steven L. Peace
IPC分类号： C25F7/00
CPC分类号： C25F7/00
摘要： An electro-chemical processor for making porous silicon or processing other substrates has first and second chamber assemblies. The first and second chamber assemblies include first and second seals for sealing against a wafer, and first and second electrodes, respectively. The first seal is moveable towards and away from a wafer in the processor, to move between a wafer load/unload position, and a wafer process position. The first electrode may move along with the first seal. The processor may be pivotable from a substantially horizontal orientation, for loading and unloading a wafer, to a substantially vertical orientation, for processing a wafer.
摘要翻译：用于制造多孔硅或处理其它衬底的电化学处理器具有第一和第二室组件。第一和第二室组件包括分别用于密封晶片的第一和第二密封件以及第一和第二电极。第一密封件可朝向和远离处理器中的晶片移动，以在晶片装载/卸载位置与晶片工艺位置之间移动。第一电极可以与第一密封件一起移动。处理器可以从用于加载和卸载晶片的基本上水平的方向枢转到基本垂直的取向，用于处理晶片。

7. 发明授权

US07102763B2 Methods and apparatus for processing microelectronic workpieces using metrology 有权
公开(公告)号：US07102763B2
公开(公告)日：2006-09-05
申请号：US09902491
申请日：2001-07-09
申请人： Thomas L. Ritzdorf , Steve L. Eudy , Gregory J. Wilson , Paul R. McHugh , Robert A. Weaver , Brian Aegerter , Curt Dundas , Steven L. Peace
发明人： Thomas L. Ritzdorf , Steve L. Eudy , Gregory J. Wilson , Paul R. McHugh , Robert A. Weaver , Brian Aegerter , Curt Dundas , Steven L. Peace
IPC分类号： G01B11/28 , H01L21/306 , B05C11/00
CPC分类号： H01L21/67173 , H01L21/67103 , H01L21/67178 , H01L21/6719 , H01L21/67219 , H01L21/6723 , H01L21/67751
摘要： A method and apparatus for processing a microelectronic workpiece using metrology. The apparatus can include one or more processing or transport units, a metrology unit, and a control unit coupled to the metrology unit and at least one of the processing or transport units. The control unit can modify a process recipe or a process sequence of the processing unit based on a feed forward or a feed back signal from the metrology unit. The control unit can also provide instructions to the transport unit to move the workpiece to a selected processing unit. The processing unit can include, inter alia, a seed layer deposition unit, a process layer electrochemical deposition unit, a seed layer enhancement unit, a chemical mechanical polishing unit, and/or an annealing chamber arranged for sequential processing of a workpiece. The processing units can be controlled as an integrated system using one or more metrology units, or a separate metrology unit can provide input to the processing units.

8. 发明申请

US20120052204A1 WORKPIECE WETTING AND CLEANING 审中-公开
标题翻译：工作湿润和清洁
公开(公告)号：US20120052204A1
公开(公告)日：2012-03-01
申请号：US12873002
申请日：2010-08-31
申请人： Bryan Puch , Kyle M. Hanson , Marvin Bernt , Paul R. McHugh , Gregory J. Wilson
发明人： Bryan Puch , Kyle M. Hanson , Marvin Bernt , Paul R. McHugh , Gregory J. Wilson
IPC分类号： C23C16/56
CPC分类号： H01L21/6719 , H01L21/67057 , H01L21/67126
摘要： In a workpiece processor, a head is moveable onto a bowl to form a process chamber. A workpiece can be cleaned in the processor by immersing the workpiece into a liquid bath in the bowl and then boiling the liquid. Vacuum may be applied to the chamber to reduce the pressure within the chamber, thereby reducing the boiling temperature of the liquid and allowing processing at lower temperatures. In a separate method for prewetting a workpiece, a humid gas is provided into the process chamber and condenses on the workpiece. In another separate method for wetting a workpiece, liquid water is provided into the bowl, with the workpiece above the liquid water. Water vapor is created in the process chamber by applying vacuum to the process chamber. The vapor wets the workpiece. The workpiece is then further wetted by submerging the workpiece into the liquid water.
摘要翻译：在工件处理器中，头可移动到碗上以形成处理室。工件可以通过将工件浸入碗中的液体浴中，然后煮沸液体而在处理器中进行清洁。真空可以施加到室以减小室内的压力，从而降低液体的沸腾温度并允许在较低温度下进行加工。在用于预润湿工件的单独方法中，将湿气提供到处理室中并在工件上冷凝。在用于润湿工件的另一种分开的方法中，液体水被提供到碗中，工件在液态水上方。通过对处理室施加真空，在处理室中产生水蒸汽。蒸汽润湿工件。然后通过将工件浸入液体水中来进一步润湿工件。

9. 发明授权

US07566386B2 System for electrochemically processing a workpiece 有权
公开(公告)号：US07566386B2
公开(公告)日：2009-07-28
申请号：US10975154
申请日：2004-10-28
申请人： Gregory J. Wilson , Paul R. McHugh , Kyle M. Hanson
发明人： Gregory J. Wilson , Paul R. McHugh , Kyle M. Hanson
IPC分类号： C25D17/02 , C25F7/00 , C25D7/12
CPC分类号： C25D17/02 , C25D5/08 , C25D17/001 , Y10S204/07
摘要： A reactor for electrochemically processing at least one surface of a microelectronic workpiece is set forth. The reactor comprises a reactor head including a workpiece support that has one or more electrical contacts positioned to make electrical contact with the microelectronic workpiece. The reactor also includes a processing container having a plurality of nozzles angularly disposed in a sidewall of a principal fluid flow chamber at a level within the principal fluid flow chamber below a surface of a bath of processing fluid normally contained therein during electrochemical processing. A plurality of anodes are disposed at different elevations in the principal fluid flow chamber so as to place them at difference distances from a microelectronic workpiece under process without an intermediate diffuser between the plurality of anodes and the microelectronic workpiece under process. One or more of the plurality of anodes may be in close proximity to the workpiece under process. Still further, one or more of the plurality of anodes may be a virtual anode. The present invention also related to multi-level anode configurations within a principal fluid flow chamber and methods of using the same.

10. 发明授权

US07857958B2 Method and apparatus for controlling vessel characteristics, including shape and thieving current for processing microfeature workpieces 有权
标题翻译：用于控制容器特性的方法和装置，包括加工微型工件的形状和盗窃电流
公开(公告)号：US07857958B2
公开(公告)日：2010-12-28
申请号：US11776918
申请日：2007-07-12
申请人： Paul R. McHugh , Gregory J. Wilson , Kyle M. Hanson
发明人： Paul R. McHugh , Gregory J. Wilson , Kyle M. Hanson
IPC分类号： C25D5/00 , C25D21/12
CPC分类号： C25D21/12 , C25D5/18 , C25D7/123 , C25D17/001 , C25D17/007 , C25D17/02 , C25D17/10 , C25D17/12 , H01L21/6723
摘要： A method and apparatus for processing a microfeature workpiece. In one embodiment, the apparatus includes a support member configured to carry a microfeature workpiece at a workpiece plane, and a vessel positioned at least proximate to the support member. The vessel has a vessel surface facing toward the support member and positioned to carry a processing liquid. The vessel surface is shaped to provide an at least approximately uniform current density at the workpiece plane. At least one electrode, such as a thieving electrode, is disposed within the vessel. In a further aspect of this embodiment, the thieving electrode can be easily removable along with conductive material it attracts from the processing liquid. The shape of the vessel surface, the current supplied to the thieving electrode and/or the diameter of an aperture upstream of the workpiece are changed dynamically in other embodiments.
摘要翻译：一种用于处理微特征工件的方法和装置。在一个实施例中，该装置包括构造成在工件平面处承载微特征工件的支撑构件和至少靠近支撑构件定位的容器。容器具有面向支撑构件的容器表面并且定位成承载处理液体。容器表面成形为在工件平面处提供至少近似均匀的电流密度。至少一个电极，例如电极，设置在容器内。在该实施例的另一方面，该窃电电极可以容易地从其从处理液体吸引的导电材料移除。在其他实施例中，容器表面的形状，提供给电极的电流和/或工件上游的孔的直径被动态地改变。

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