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    • 10. 发明授权
    • Radio frequency identification (RFID) tag and manufacturing methods thereof
    • 射频识别(RFID)标签及其制造方法
    • US08919655B2
    • 2014-12-30
    • US13884969
    • 2011-03-14
    • Chen LiYong WangShoumian Chen
    • Chen LiYong WangShoumian Chen
    • G06K19/02G06K19/077
    • G06K19/07771G06K19/0775G06K19/07775
    • A radio frequency identification (RFID) device is disclosed. The RFID device includes a silicon substrate having a top side and a bottom side. The RFID device also includes a plurality of circuitry layers formed on the top side of the substrate, and the plurality of circuitry layers include at least a core circuitry and an on-chip antenna. Further, the RFID device includes a plurality of deep openings formed in the substrate on the bottom side under the plurality of circuitry layers. The plurality of deep openings are arranged in an array and through a substantial portion of the substrate, and a remaining portion of the substrate unreached by the plurality of deep openings separates the plurality of deep openings and the plurality of circuitry layers.
    • 公开了射频识别(RFID)设备。 RFID装置包括具有顶侧和底侧的硅衬底。 RFID设备还包括形成在衬底的顶侧上的多个电路层,并且多个电路层至少包括核心电路和片上天线。 此外,RFID装置包括在多个电路层下方的底侧上的基板中形成的多个深开口。 多个深开口以阵列布置并且穿过基底的大部分,并且未被多个深开口未被接触的基底的剩余部分分离出多个深开口和多个电路层。