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    • 6. 发明授权
    • Solid state imaging device with low trap density
    • 具有低陷阱密度的固态成像装置
    • US5591988A
    • 1997-01-07
    • US477104
    • 1995-06-07
    • Michio AraiTakashi InushimaMitsufumi CodamaKazushi SugiuraIchiro TakayamaIsamu KoboriYukio YamauchiNaoya Sakamoto
    • Michio AraiTakashi InushimaMitsufumi CodamaKazushi SugiuraIchiro TakayamaIsamu KoboriYukio YamauchiNaoya Sakamoto
    • H01L21/84H01L27/12H01L27/146H01L31/113H01L29/04H01L31/036H01L31/0376H01L31/20
    • H01L27/14643H01L21/84H01L27/1237H01L31/1133
    • A substrate (1) has a surface covered with an insulation layer (2), on which an active layer (3') made of non-single crystal silicon through thin film technique is provided. A gate electrode layer (5') is partially provided on said active layer through a gate insulation layer (4). Said active layer (3') is subject to injection of P-type or N-type impurities to provide an image sensor of MOS structure. Bias potential is applied to a gate electrode so that a circuit between a source and a drain is in an On state, so that input light through said substrate or said gate electrode is applied to said active layer, and electrical output depending upon said input light is obtained from said source electrode or said drain electrode. Other MOS transistors for switching element and/or shift registers for operating said image sensor are provided on said substrate (1). Said active layer (3') is obtained by crystallizing said amorphous silicon layer through a laser anneal process or a high temperature anneal process, and hydrogenation process, and the trap density of said active layer is less than 5.times.10.sup.11 /cm.sup.2. Optical response time is short, less than 500 .mu.sec, so, high speed operation ten times as high as that of a prior image sensor is possible.
    • 基板(1)具有被绝缘层(2)覆盖的表面,在其上提供通过薄膜技术由非单晶硅制成的有源层(3')。 栅极电极层(5')通过栅极绝缘层(4)部分地设置在所述有源层上。 所述有源层(3')经受注入P型或N型杂质以提供MOS结构的图像传感器。 将偏置电位施加到栅电极,使得源极和漏极之间的电路处于导通状态,使得通过所述衬底或所述栅电极的输入光被施加到所述有源层,并且根据所述输入光输出电输出 从所述源电极或所述漏电极获得。 用于操作所述图像传感器的用于开关元件和/或移位寄存器的其它MOS晶体管设置在所述基板(1)上。 所述有源层(3')是通过激光退火工艺或高温退火工艺和氢化工艺使所述非晶硅层结晶而获得的,并且所述有源层的陷阱密度小于5×10 11 / cm 2。 光学响应时间短,小于500μs,因此可以实现高于现有图像传感器的10倍的高速度运行。