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1. 发明授权

US06937406B2 Optical module and method for manufacturing optical module 失效
标题翻译：光模块及其制造方法
公开(公告)号：US06937406B2
公开(公告)日：2005-08-30
申请号：US10645986
申请日：2003-08-22
申请人： Naoki Matsushima , Hideo Sotokawa , Hideyuki Kuwano , Yoshiaki Niwa , Keiichi Yamada , Masahiro Hirai , Kazumi Kawamoto , Shohei Hata , Toshiaki Takai
发明人： Naoki Matsushima , Hideo Sotokawa , Hideyuki Kuwano , Yoshiaki Niwa , Keiichi Yamada , Masahiro Hirai , Kazumi Kawamoto , Shohei Hata , Toshiaki Takai
IPC分类号： G02B6/42 , G02B7/00 , G02B7/02
CPC分类号： G02B6/4204 , G02B6/423 , G02B6/4239 , G02B7/025
摘要： The present invention provides an optical module and a method for manufacturing the optical module, in which a V-shaped or trapezoidal groove having a first slope and a second slope facing to the first slope is formed at the surface of a silicon substrate by anisotropic etching, an adhesive is applied to a portion of at least the second slope in a region except the first slope of the groove, and lens is fixedly put in the groove.
摘要翻译：本发明提供了一种光学模块及其制造方法，其中通过各向异性蚀刻在硅衬底的表面上形成具有第一斜面和第一斜面的第一斜面的V形或梯形槽在除了槽的第一斜面之外的区域中，至少第二斜面的一部分施加粘合剂，并且将透镜固定地放入槽中。

2. 发明授权

US06813419B2 Optical transmission module and optical communication system using the same 失效
标题翻译：光传输模块和光通信系统使用相同
公开(公告)号：US06813419B2
公开(公告)日：2004-11-02
申请号：US09793901
申请日：2001-02-28
申请人： Naoki Matsushima , Kazumi Kawamoto , Hideo Sotokawa
发明人： Naoki Matsushima , Kazumi Kawamoto , Hideo Sotokawa
IPC分类号： G02B626
CPC分类号： G02B6/14 , G02B6/10 , G02B6/122 , G02B6/1228 , G02B6/132 , G02B6/42 , G02B2006/12102 , G02B2006/12195
摘要： An optical transmission module includes a beam spot size expanding waveguide and a beam spot size reducing waveguide adjoining in the light propagating direction, or includes a beam spot size expanding waveguide, a beam spot size retaining waveguide and a beam spot size reducing waveguide aligning in the light propagating direction. Each waveguide has laminated core layers which are formed of materials of different refractive indexes.
摘要翻译：光传输模块包括光束尺寸扩展波导和在光传播方向上邻接的束斑尺寸减小波导，或包括光斑尺寸扩大波导，光束斑点尺寸保持波导和光束尺寸减小波导光传播方向。每个波导具有由不同折射率的材料形成的层叠芯层。

3. 发明授权

US07153758B2 Anodic bonding method and electronic device having anodic bonding structure 有权
标题翻译：阳极接合方法和具有阳极结合结构的电子器件
公开(公告)号：US07153758B2
公开(公告)日：2006-12-26
申请号：US10786106
申请日：2004-02-26
申请人： Shohei Hata , Hideo Sotokawa , Hiroaki Furuichi
发明人： Shohei Hata , Hideo Sotokawa , Hiroaki Furuichi
IPC分类号： H01L21/326 , B32B37/00
CPC分类号： H01L21/2007 , C03C27/00 , C03C27/02
摘要： In anodic bonding between a conductor or semiconductor and glass, in order to attain good adhesion at a lower bonding temperature than usual and improve the toughness at its boundary to obtain higher reliability for a bonded portion even in a case where bonded members are warped or dust is present at the bonding boundary, a soft metal film is formed on the surface of a conductor or semiconductor on which an active metal film having high reactivity with oxygen is formed, whereby a warp or dust, if any, can be absorbed by the deformation of the soft metal film, thereby to improve the adhesion at the boundary. Adhesion at the bonding boundary is improved even at a low bonding temperature of, e.g., about 200° C. Further, the toughness at the bonding boundary can be improved to increase reliability by roughening the bonded surface on the side of the glass.
摘要翻译：在导体或半导体与玻璃之间的阳极接合中，为了在比通常更低的接合温度下获得良好的粘附性，并且即使在接合部件翘曲或灰尘的情况下也能够提高其边界处的韧性以获得更高的接合部的可靠性存在于接合边界处，在形成有与氧反应性高的活性金属膜的导体或半导体的表面上形成软金属膜，由此可以通过变形来吸收翘曲或灰尘（如果有的话）的软金属膜，从而提高边界的粘附性。即使在例如约200℃的低接合温度下，接合边界处的粘附性也得到改善。此外，通过使玻璃侧的接合面粗糙化，可以提高接合边界的韧性，提高可靠性。

4. 发明授权

US06635971B2 Electronic device and optical transmission module 有权
公开(公告)号：US06635971B2
公开(公告)日：2003-10-21
申请号：US10042270
申请日：2002-01-11
申请人： Toyoki Asada , Yuji Fujita , Hideo Sotokawa , Kazumi Kawamoto , Kunio Matsumoto , Shinya Hamagishi , Mari Matsuyoshi
发明人： Toyoki Asada , Yuji Fujita , Hideo Sotokawa , Kazumi Kawamoto , Kunio Matsumoto , Shinya Hamagishi , Mari Matsuyoshi
IPC分类号： H01L2329
CPC分类号： H01L24/31 , G02B6/4232 , G02B6/4246 , H01L21/563 , H01L24/29 , H01L24/83 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/83192 , H01L2224/83951 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01033 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/12042 , H01L2924/14 , H01L2924/15151 , H01L2924/351 , H01L2924/00 , H01L2224/0401
摘要： An electronic device, in which terminals of a semiconductor integrated circuit chip and terminals of a circuit substrate are mounted with solder so as to face one another. The electronic device includes a first resin, which is disposed between the circuit substrate and a terminal formation face of the semiconductor integrated circuit chip and a second resin, which is disposed at the outer perimeter of the semiconductor integrated circuit chip or is disposed laterally thereon. The modulus of elasticity of the second resin is smaller than the modulus of elasticity of the first resin, the modulus of elasticity of the second resin is at least 0.5 GPa but not more than 28 GPa at room temperature.

5. 发明授权

US5753372A Wiring structures and method of manufacturing the same 失效
标题翻译：接线结构及其制造方法
公开(公告)号：US5753372A
公开(公告)日：1998-05-19
申请号：US500157
申请日：1995-07-10
申请人： Hideo Sotokawa , Miharu Otani , Fumio Kataoka , Fusaji Shoji , Haruhiko Matsuyama , Eiji Matsuzaki , Shogi Ikeda , Hidetaka Shigi , Tetsuya Yamazaki , Naoki Matsushima , Shirou Akamatsu
发明人： Hideo Sotokawa , Miharu Otani , Fumio Kataoka , Fusaji Shoji , Haruhiko Matsuyama , Eiji Matsuzaki , Shogi Ikeda , Hidetaka Shigi , Tetsuya Yamazaki , Naoki Matsushima , Shirou Akamatsu
IPC分类号： H01L21/312 , H01L21/3205 , H01L21/768 , H01L23/532 , H05K1/00 , H05K1/03 , H05K3/46 , B32B9/04
CPC分类号： H01L21/76801 , H01L21/312 , H01L21/32056 , H01L21/76838 , H01L23/5329 , H01L2924/0002 , H05K1/0346 , H05K3/4647 , H05K3/4676 , Y10T428/24802 , Y10T428/31504 , Y10T428/31678 , Y10T428/31721
摘要： The present invention provides the wiring structure having a wiring layer and insulation layer and the method of manufacturing the same, wherein at least a part of the wiring of said wiring layer comprises copper, and said insulation layer comprises the polyimide obtained by heating the polyimide precursor composition containing the polyimide precursor having the repeating unit which can be represented by the following general formula (Chemical formula 15). ##STR1## (In this formula, R.sup.1 is at least one type of quadrivalent organic group selected from among the Chemical formulae 16, while R.sup.2 is a bivalent organic group containing aromatic ring).
摘要翻译：本发明提供具有布线层和绝缘层的布线结构及其制造方法，其中所述布线层的布线的至少一部分包括铜，并且所述绝缘层包括通过加热聚酰亚胺前体获得的聚酰亚胺含有具有可以由以下通式表示的重复单元的聚酰亚胺前体的组合物（化学式15）。（化学式15）（化学式16）选自化学式16中的四价有机基团的类型，而R2是含有芳香环的二价有机基团）。

6. 发明授权

US06554491B2 Optical module 失效
标题翻译：光模块
公开(公告)号：US06554491B2
公开(公告)日：2003-04-29
申请号：US09740610
申请日：2000-12-18
申请人： Hideo Sotokawa , Toshimasa Miura
发明人： Hideo Sotokawa , Toshimasa Miura
IPC分类号： G02B636
CPC分类号： G02B6/42 , G02B1/046 , G02B1/048 , G02B6/1221 , G02B6/30 , G02B6/424 , G02B6/4253 , G02B2006/12176
摘要： The present invention provides an optical module and apparatus and forming method that can reduce problems in the setting of a silicone-based resin. In one embodiment of the present invention an optical module is provided. The optical module includes: an optical waveguide formed from a first resin, the first resin having fluorine; an intermediary layer above the optical waveguide; and a silicone-based resin layer above the intermediary layer. The intermediary layer may include: a metal, a dielectric, an inorganic compound, or a second resin having a fluorine content of less than 10 percent.
摘要翻译：本发明提供一种能够减少硅树脂树脂的凝固的问题的光学模块及其制造方法。在本发明的一个实施例中，提供了一种光学模块。光学模块包括：由第一树脂形成的光波导，第一树脂具有氟; 在光波导上方的中间层; 和中间层上方的硅氧烷类树脂层。中间层可以包括：金属，电介质，无机化合物或氟含量小于10％的第二树脂。

7. 发明授权

US5958600A Circuit board and method of manufacturing the same 失效
标题翻译：电路板及其制造方法
公开(公告)号：US5958600A
公开(公告)日：1999-09-28
申请号：US981835
申请日：1998-01-09
申请人： Hideo Sotokawa , Akira Yabushita , Takashi Inoue , Hidetaka Shigi , Mamoru Ogihara , Haruhiko Matsuyama , Minoru Tanaka , Yasunori Narizuka
发明人： Hideo Sotokawa , Akira Yabushita , Takashi Inoue , Hidetaka Shigi , Mamoru Ogihara , Haruhiko Matsuyama , Minoru Tanaka , Yasunori Narizuka
IPC分类号： H01L23/498 , H01L23/538 , B32B15/08 , G03C3/00 , H05K1/09
CPC分类号： H01L23/5384 , H01L23/49866 , H01L23/49894 , H01L23/5385 , H01L2224/16225 , H01L2924/09701 , H01L2924/15312 , Y10S428/901 , Y10T428/24917 , Y10T428/31681 , Y10T428/31721
摘要： Disclosed are a highly reliable circuit board and a method of stably manufacturing the circuit board, wherein an insulator made from a specific organic insulating material is provided under a highly stressed conductor for preventing occurrence of cracks in the insulator. In addition, a method of correcting a wiring of a ceramic board is additionally adopted. The circuit board includes a thick film wiring board 1 having a first conductor pattern 2 and a thin film layer laminated on the first conductor pattern 2. The thin film layer includes a first insulator 5 on the first conductor pattern 2; a second insulator 10 on the first insulator 5; a second conductor pattern 8 formed on the first insulator 5 in such a manner as to partially pass through the first insulator 5 and to be electrically connected to the first conductor pattern 2; a wiring pattern 9 for circuit correction formed on the first insulator 5; and a third conductor pattern 11 passing through the first insulator 5 and the second insulator 10 and electrically connected to the second conductor pattern 8.
摘要翻译： PCT No.PCT / JP96 / 01909 Sec。 371日期1998年1月9日 102（e）1998年1月9日PCT PCT 1996年7月10日PCT公布。出版物WO97 / 03542 日期1997年1月30日公开是一种高度可靠的电路板和稳定制造电路板的方法，其中由特定有机绝缘材料制成的绝缘体设置在高应力导体下面，以防止在绝缘体中发生裂纹。此外，另外采用校正陶瓷板的布线的方法。电路板包括具有层叠在第一导体图案2上的第一导体图案2和薄膜层的厚膜布线板1.薄膜层包括在第一导体图案2上的第一绝缘体5; 第一绝缘体5上的第二绝缘体10; 形成在第一绝缘体5上的部分地通过第一绝缘体5并与第一导体图案2电连接的第二导体图案8; 在第一绝缘体5上形成用于电路校正的布线图案9; 以及穿过第一绝缘体5和第二绝缘体10并电连接到第二导体图案8的第三导体图案11。

8. 发明授权

US5939789A Multilayer substrates methods for manufacturing multilayer substrates and electronic devices 失效
标题翻译：用于制造多层基板和电子器件的多层基板方法
公开(公告)号：US5939789A
公开(公告)日：1999-08-17
申请号：US893323
申请日：1997-07-16
申请人： Michifumi Kawai , Ryohei Satoh , Osamu Yamada , Eiji Matsuda , Masakazu Ishino , Takashi Inoue , Hideo Sotokawa , Masayuki Kyoui
发明人： Michifumi Kawai , Ryohei Satoh , Osamu Yamada , Eiji Matsuda , Masakazu Ishino , Takashi Inoue , Hideo Sotokawa , Masayuki Kyoui
IPC分类号： H05K3/46 , H01L21/48 , H05K3/28 , H05K3/42 , H01L23/485
CPC分类号： H01L21/4857 , H05K3/4617 , H01L2924/0002 , H05K1/0272 , H05K2201/0195 , H05K2201/09563 , H05K2203/1189 , H05K3/28 , H05K3/423
摘要： A multilayer substrate which is fabricated by laminating a plurality of substrates, each comprising an insulation film, a plurality of via holes which pass through the upper surface to the lower surface of the insulation film, a wiring which is provided on the upper surface of the insulation film and the upper surface of the via holes and electrically connected with the via holes, a bonding member which is provided on the lower surfaces of the via holes and electrically connected with the via holes, and a bonding layer which is provided on the upper surface of the insulation film where the wiring is formed and the method of fabrication thereof whereby large costs reduction and high density effect can be obtained.
摘要翻译：一种多层基板，其通过层叠多个基板而制造，所述多个基板包括绝缘膜，穿过所述上表面的绝缘膜的下表面的多个通孔，设置在所述绝缘膜的上表面上的布线绝缘膜和通孔的上表面并与通孔电连接;接合构件，其设置在通孔的下表面上并与通孔电连接;以及接合层，其设置在上部形成布线的绝缘膜的表面及其制造方法，从而可以获得大量的成本降低和高密度效果。

9. 发明申请

US20080128839A1 Electronic Apparatus Applied Anodic Bonding 审中-公开
标题翻译：电子仪器应用阳极接合
公开(公告)号：US20080128839A1
公开(公告)日：2008-06-05
申请号：US11573371
申请日：2005-08-30
申请人： Hideo Sotokawa , Hiroaki Huruichi
发明人： Hideo Sotokawa , Hiroaki Huruichi
IPC分类号： H01L29/84
CPC分类号： B81C1/00269
摘要： An electronic apparatus suppressing damages to a device not having high durability to a high voltage of a structure including a first member having a first electrode and a device, and a second member having a second electrode in which the first electrode and the second electrode, are formed in a region not overlapping the device, the first member and the second member are anodically bonded by the application of a voltage between the first electrode and the second electrode and the device is encapsulated between the first member and the second member.
摘要翻译：一种电子设备，其抑制对具有第一电极和器件的第一元件的结构的高电压不具有高耐久性的器件的损坏，以及具有第二电极的第二元件，其中第一电极和第二电极是形成在不与装置重叠的区域中，第一构件和第二构件通过在第一电极和第二电极之间施加电压而阳极结合，并且装置封装在第一构件和第二构件之间。

10. 发明申请

US20060161940A1 Optical disk drive apparatus 失效
标题翻译：光盘驱动装置
公开(公告)号：US20060161940A1
公开(公告)日：2006-07-20
申请号：US11333171
申请日：2006-01-18
申请人： Satoshi Arai , Hiroaki Furuichi , Yoshio Oozeki , Hideo Sotokawa , Mitsuo Satake , Kazuhiko Ito , Masayoshi Watanabe
发明人： Satoshi Arai , Hiroaki Furuichi , Yoshio Oozeki , Hideo Sotokawa , Mitsuo Satake , Kazuhiko Ito , Masayoshi Watanabe
IPC分类号： G11B7/09 , G11B7/085 , G11B7/08
CPC分类号： G11B7/08582 , G11B7/22 , H05K1/147 , H05K2201/0191
摘要： In order to improve reliability of an optical disk drive apparatus at low cost, a flexible substrate for making connection between an optical pick-up device incorporated in the optical disk drive apparatus and a drive side is divided into a first flexible substrate fixed to the optical pick-up body (for example, upper surface), and a second flexible substrate connected to the first flexible substrate and extending to the drive, wiring conductors formed on a connection end portion of the first flexible substrate and wiring conductors formed on a connection end portion of the second flexible substrate are superposed at a region adjacent an end of the case of the optical pick-up device body, and connected to each other by joining material, and a connection section between the wiring conductors is held down by a cover for protecting the optical pick-up device body.
摘要翻译：为了以低成本提高光盘驱动装置的可靠性，用于连接在光盘驱动装置中的光学拾取装置与驱动侧之间的连接的柔性基板被分成固定到光学器件的第一柔性基板以及连接到第一柔性基板并延伸到驱动器的第二柔性基板，形成在第一柔性基板的连接端部上的布线导体和形成在连接端上的布线导体第二柔性基板的一部分重叠在与光拾取装置主体的壳体的端部相邻的区域处，并且通过接合材料彼此连接，并且布线导体之间的连接部分被盖盖住保护光学拾取装置主体。

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