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1. 发明申请

US20120292775A1 MOUNTING METHOD AND MOUNTING DEVICE 失效
标题翻译：安装方法和安装设备
公开(公告)号：US20120292775A1
公开(公告)日：2012-11-22
申请号：US13519243
申请日：2010-12-24
申请人： Michikazu Nakamura , Masahiko Sugiyama , Dai Shinozaki , Naoki Akiyama
发明人： Michikazu Nakamura , Masahiko Sugiyama , Dai Shinozaki , Naoki Akiyama
IPC分类号： H01L23/48 , H01L21/60
CPC分类号： H01L24/83 , H01L21/67132 , H01L21/67144 , H01L21/6835 , H01L24/27 , H01L24/29 , H01L24/743 , H01L24/75 , H01L24/97 , H01L2221/68313 , H01L2224/27312 , H01L2224/7565 , H01L2224/83002 , H01L2224/83143 , H01L2224/83192 , H01L2224/83193 , H01L2224/838 , H01L2224/92 , H01L2224/97 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01033 , H01L2924/01047 , H01L2924/01073 , H01L2924/14 , H01L2924/15788 , H01L2224/27 , H01L2224/83 , H01L2924/00
摘要： A mounting method of sequentially mounting elements on a substrate includes a mounting process of mounting one element, which is taken out by a take-out part from an accommodating part in which the elements are accommodated, on a first contact region of the surface of the substrate where a liquid is coated. The method further includes a coating process of coating a liquid, by a coating part movably provided together with the take-out part, on a contact region of the surface of the substrate different from the first contact region when the one element is mounted on the first region.
摘要翻译：将元件依次安装在基板上的安装方法包括安装过程，该安装方法将一个元件安装在一个元件的表面的第一接触区域上，该元件由取出部分从容纳元件被容纳的容纳部分中取出，衬底，其中涂布液体。该方法还包括一种涂覆方法，该涂覆方法通过可移动地与取出部分一起设置的涂层部分涂覆在与该第一接触区域不同的第一接触区域的基板的表面的接触区域上，第一区。

2. 发明授权

US09263312B2 Joining device and joining position adjustment method using joining device 有权
标题翻译：使用接合装置的接合装置和接合位置调整方法
公开(公告)号：US09263312B2
公开(公告)日：2016-02-16
申请号：US14351425
申请日：2012-09-13
申请人： Michikazu Nakamura , Masahiko Sugiyama , Hajime Furuya , Naoki Akiyama , Yosuke Omori
发明人： Michikazu Nakamura , Masahiko Sugiyama , Hajime Furuya , Naoki Akiyama , Yosuke Omori
IPC分类号： B32B41/00 , H01L21/68 , H01L21/67
CPC分类号： H01L21/68 , H01L21/67092 , Y10T156/1744
摘要： A joining device includes a first holding unit configured to load and hold the first member on its top surface; a second holding unit disposed above the first holding unit while facing the first holding unit and configured to hold the second member; and a position adjustment mechanism configured to adjust a joining position between the first member held by the first holding unit and the second member held by the second holding unit. The second holding unit is of a circular plate shape, and the position adjustment mechanism includes four position-adjusting cam members disposed at equal intervals along an outer peripheral surface of the second holding unit, and moves the second holding unit in a horizontal direction.
摘要翻译：接合装置包括：第一保持单元，其构造成在其顶表面上加载和保持第一构件; 第二保持单元，其设置在所述第一保持单元的上方，同时面向所述第一保持单元并且构造成保持所述第二构件; 以及位置调整机构，其构造成调整由所述第一保持单元保持的所述第一构件与由所述第二保持单元保持的所述第二构件之间的接合位置。第二保持单元是圆板形状，并且位置调节机构包括沿着第二保持单元的外周表面等间隔设置的四个位置调节凸轮构件，并且使第二保持单元沿水平方向移动。

3. 发明授权

US08749068B2 Mounting method and mounting device 失效
标题翻译：安装方法和安装装置
公开(公告)号：US08749068B2
公开(公告)日：2014-06-10
申请号：US13519243
申请日：2010-12-24
申请人： Michikazu Nakamura , Masahiko Sugiyama , Dai Shinozaki , Naoki Akiyama
发明人： Michikazu Nakamura , Masahiko Sugiyama , Dai Shinozaki , Naoki Akiyama
IPC分类号： H01L23/48
CPC分类号： H01L24/83 , H01L21/67132 , H01L21/67144 , H01L21/6835 , H01L24/27 , H01L24/29 , H01L24/743 , H01L24/75 , H01L24/97 , H01L2221/68313 , H01L2224/27312 , H01L2224/7565 , H01L2224/83002 , H01L2224/83143 , H01L2224/83192 , H01L2224/83193 , H01L2224/838 , H01L2224/92 , H01L2224/97 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01033 , H01L2924/01047 , H01L2924/01073 , H01L2924/14 , H01L2924/15788 , H01L2224/27 , H01L2224/83 , H01L2924/00
摘要： A mounting method of sequentially mounting elements on a substrate includes a mounting process of mounting one element, which is taken out by a take-out part from an accommodating part in which the elements are accommodated, on a first contact region of the surface of the substrate where a liquid is coated. The method further includes a coating process of coating a liquid, by a coating part movably provided together with the take-out part, on a contact region of the surface of the substrate different from the first contact region when the one element is mounted on the first region.
摘要翻译：将元件依次安装在基板上的安装方法包括安装过程，该安装方法将一个元件安装在一个元件的表面的第一接触区域上，该元件由取出部分从容纳元件被容纳的容纳部分中取出，衬底，其中涂布液体。该方法还包括一种涂覆方法，该涂覆方法通过可移动地与取出部分一起设置的涂层部分涂覆在与该第一接触区域不同的第一接触区域的基板的表面的接触区域上，第一区。

4. 发明申请

US20120291950A1 MOUNTING METHOD AND MOUNTING DEVICE 审中-公开
标题翻译：安装方法和安装设备
公开(公告)号：US20120291950A1
公开(公告)日：2012-11-22
申请号：US13519237
申请日：2010-12-24
申请人： Masahiko Sugiyama , Michikazu Nakamura , Dai Shinozaki , Naoki Akiyama
发明人： Masahiko Sugiyama , Michikazu Nakamura , Dai Shinozaki , Naoki Akiyama
IPC分类号： B32B38/00 , B32B38/18
CPC分类号： H01L21/6835 , H01L24/75 , H01L24/81 , H01L24/83 , H01L24/97 , H01L25/0655 , H01L25/50 , H01L2221/68354 , H01L2221/68359 , H01L2221/68368 , H01L2221/68381 , H01L2224/32225 , H01L2224/75102 , H01L2224/75272 , H01L2224/75745 , H01L2224/75753 , H01L2224/7598 , H01L2224/81005 , H01L2224/81201 , H01L2224/83 , H01L2224/83907 , H01L2224/95001 , H01L2224/95146 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01073 , H01L2924/14 , H01L2924/15788 , H01L2924/3512 , Y10T156/10 , Y10T156/1744 , H01L2924/00014 , H01L2924/00011 , H01L2924/00
摘要： A mounting method of mounting an element on a substrate, includes a first hydrophilization process of hydrophilizing a region on a surface of the substrate where the element is to be joined; a second hydrophilization process of hydrophilizing the surface of the element; a mounting process of mounting the element on a mounting part such that the hydrophilized surface of the element faces upwards; a coating process of coating a liquid on the hydrophilized surface of the element; and an arrangement process of arranging the substrate above the mounting part such that the region on the surface of the substrate where the element is to be joined faces downwards. The method further includes a contact process of bringing the substrate arranged above the mounting part close to the mounting part on which the element is mounted to bring the liquid into contact with the surface of the substrate.
摘要翻译：将元件安装在基板上的安装方法包括使基板的要被接合的基板的表面上的区域亲水化的第一亲水化工序; 使元件的表面亲水化的第二亲水化工序; 将元件安装在安装部分上使得元件的亲水化表面面向上的安装过程; 在所述元件的亲水化表面上涂布液体的涂布方法; 以及将基板布置在安装部分上方以使得要被接合的基板的表面上的区域面向下的布置过程。该方法还包括将安装在安装部分上方的基板靠近安装有元件的安装部分以使液体与基板的表面接触的接触过程。

5. 发明授权

US08286853B2 Bonding apparatus and bonding method 失效
标题翻译：接合装置和接合方法
公开(公告)号：US08286853B2
公开(公告)日：2012-10-16
申请号：US13275843
申请日：2011-10-18
申请人： Naoki Akiyama , Masahiko Sugiyama , Michikazu Nakamura
发明人： Naoki Akiyama , Masahiko Sugiyama , Michikazu Nakamura
IPC分类号： B23K31/02 , B23K37/04
CPC分类号： H01L24/81 , H01L21/67092 , H01L24/05 , H01L24/13 , H01L24/75 , H01L24/94 , H01L25/0657 , H01L25/50 , H01L2224/0401 , H01L2224/05624 , H01L2224/13117 , H01L2224/16145 , H01L2224/75102 , H01L2224/7525 , H01L2224/75251 , H01L2224/75252 , H01L2224/7526 , H01L2224/75283 , H01L2224/75303 , H01L2224/75312 , H01L2224/75314 , H01L2224/755 , H01L2224/75501 , H01L2224/7565 , H01L2224/757 , H01L2224/75901 , H01L2224/75985 , H01L2224/81001 , H01L2224/81204 , H01L2224/8122 , H01L2225/06513 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01074 , H01L2924/01082 , H01L2924/00014 , H01L2924/01032
摘要： A bonding apparatus includes a thermal treating unit and a bonding unit that are integrally bonded together. The thermal treating unit includes a first thermal treating plate for supporting and thermally processing a superimposed substrate. The bonding unit includes a second thermal treating plate for supporting and thermally processing the superimposed substrate processed in thermal treating unit, and a pressing mechanism for pressing the superimposed substrate against the second thermal treating plate. The first thermal treating plate includes a cooling mechanism for cooling the superimposed substrate placed on the first heating plate. Each unit can depressurize the internal atmosphere to a specified degree of vacuum. The thermal treating unit has a plurality of carrying mechanisms for conveying the wafers between the two units.
摘要翻译：接合装置包括一体地结合在一起的热处理单元和接合单元。热处理单元包括用于支撑和热处理叠加的基板的第一热处理板。接合单元包括用于支撑和热处理在热处理单元中处理的叠加基板的第二热处理板，以及用于将叠置的基板压靠在第二热处理板上的按压机构。第一热处理板包括用于冷却放置在第一加热板上的重叠基板的冷却机构。每个单元可以将内部气氛减压到一定的真空度。热处理单元具有用于在两个单元之间输送晶片的多个承载机构。

6. 发明授权

US08210417B2 Bonding apparatus 失效
标题翻译：接合装置
公开(公告)号：US08210417B2
公开(公告)日：2012-07-03
申请号：US13275866
申请日：2011-10-18
申请人： Naoki Akiyama , Masahiko Sugiyama , Hajime Furuya
发明人： Naoki Akiyama , Masahiko Sugiyama , Hajime Furuya
IPC分类号： B23K37/04
CPC分类号： H01L24/81 , H01L21/67092 , H01L24/05 , H01L24/13 , H01L24/75 , H01L24/94 , H01L25/0657 , H01L25/50 , H01L2224/0401 , H01L2224/05624 , H01L2224/13117 , H01L2224/16145 , H01L2224/75102 , H01L2224/7525 , H01L2224/75251 , H01L2224/75252 , H01L2224/7526 , H01L2224/75283 , H01L2224/753 , H01L2224/75303 , H01L2224/75312 , H01L2224/75314 , H01L2224/755 , H01L2224/75501 , H01L2224/7565 , H01L2224/757 , H01L2224/75901 , H01L2224/75985 , H01L2224/81001 , H01L2224/81204 , H01L2224/8122 , H01L2225/06513 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01074 , H01L2924/01082 , H01L2924/00014 , H01L2924/01032
摘要： A bonding apparatus for bonding substrates having metal bonding portions, includes: a processing container having an opening formed on the bottom of the processing container; a thermal treating plate disposed within the processing container, the thermal treating plate allowing for substrates to be mounted thereon and allowing for thermal treatment of the substrates; a pressing mechanism disposed within the processing container opposite the thermal treating plate and which presses the substrates to the thermal treating plate; an annular supporter which is disposed in an inner side of the processing container along the opening of the processing container, the annular supporter providing an airtight seal between the processing container and the thermal treating plate, and supporting the thermal treating plate; and a cooling mechanism which is disposed in an inner side of the supporter below the thermal treating plate, the cooling mechanism cooling the thermal treating plate.
摘要翻译：一种用于接合具有金属接合部分的基底的接合装置，包括：处理容器，其具有形成在处理容器的底部上的开口; 设置在处理容器内的热处理板，所述热处理板允许将基板安装在其上并允许对基板进行热处理; 加压机构，设置在与热处理板相对的处理容器内，并将基板压入热处理板; 沿处理容器的开口设置在处理容器的内侧的环形支撑件，环形支撑件，在处理容器和热处理板之间提供气密密封，并支撑热处理板; 以及冷却机构，其设置在所述支撑体的位于所述热处理板的下方的内侧，所述冷却机构冷却所述热处理板。

7. 发明授权

US08434538B2 Bonding apparatus and bonding method 失效
标题翻译：接合装置和接合方法
公开(公告)号：US08434538B2
公开(公告)日：2013-05-07
申请号：US13284434
申请日：2011-10-28
申请人： Naoki Akiyama , Masahiko Sugiyama , Yosuke Omori
发明人： Naoki Akiyama , Masahiko Sugiyama , Yosuke Omori
IPC分类号： B32B37/00
CPC分类号： H01L21/67092
摘要： A bonding apparatus has an upper chuck and a lower chuck for holding wafers. The upper chuck is configured such that the center portion is bent to be convex when pressurized with a predetermined pressure. On the bottom surface of the lower chuck, there is an insulating ring formed of a combination of a plurality of insulating members to support the periphery of the lower chuck. The bottom surface of the insulating ring is supported by a support ring formed of a combination of a plurality of supporting members. The supporting members and the lower chuck are fixed by a bolt provided for each of the supporting members. The bolt is inserted through a through hole and a through hole which are formed in the insulating members and the supporting members, respectively, the through holes having a diameter larger than a diameter of the bolt.
摘要翻译：接合装置具有用于保持晶片的上卡盘和下卡盘。上卡盘构造成使得当以预定压力加压时，中心部分弯曲成凸起。在下卡盘的底表面上，存在由多个绝缘构件的组合形成的绝缘环，以支撑下卡盘的周边。绝缘环的底表面由多个支撑构件的组合形成的支撑环支撑。支撑构件和下卡盘通过为每个支撑构件设置的螺栓来固定。螺栓穿过分别形成在绝缘构件和支撑构件中的通孔和通孔，直径大于螺栓直径的通孔。

8. 发明授权

US5679617A Agent and method for preserving freshness of cut flowers 失效
标题翻译：保鲜切花新鲜的代理和方法
公开(公告)号：US5679617A
公开(公告)日：1997-10-21
申请号：US590904
申请日：1996-01-24
申请人： Miho Hanafusa , Naoki Akiyama , Toshitake Kawakami
发明人： Miho Hanafusa , Naoki Akiyama , Toshitake Kawakami
IPC分类号： A01N3/02
CPC分类号： A01N3/02
摘要： An agent for preserving freshness of cut flowers, which contains, as an active ingredient, at least one water-soluble polymer selected from the group consisting of: i) a polycondensation product obtained by a reaction of (a) at least one compound selected from the group consisting of an epihalohydrin, an alkylene dihalide, a diepoxide and a dihalogenoalkyl ether, with (b) at least one compound selected from the group consisting of an amine, a diamine and a polyamine, ii) an alkyleneimine polymer, and iii) a mixture of the polymers i) and ii).
摘要翻译：一种保鲜切花的新鲜剂，其含有至少一种选自以下的水溶性聚合物作为活性成分：i）通过（a）至少一种选自以下的化合物的反应获得的缩聚产物：由（b）至少一种选自胺，二胺和多胺的化合物组成的组，ii）亚烷基亚胺聚合物，以及iii）由式聚合物i）和ii）的混合物。

9. 发明授权

US5087793A Process for preparing inner olefines 失效
标题翻译：制备内脂的方法
公开(公告)号：US5087793A
公开(公告)日：1992-02-11
申请号：US476433
申请日：1990-05-24
申请人： Naoki Akiyama , Masaharu Mori
发明人： Naoki Akiyama , Masaharu Mori
IPC分类号： C07C5/25
CPC分类号： C07C5/2518
摘要： Inner olefines are prepared by using 1-olefines having 6 to 34 carbon atoms as a starting material and isomerizing them at temperatures ranging from 130.degree. to 270.degree. C. in the presence of mordenite type zeolites. Optionally, unreacted 1-olefines can be separated and reused as a starting material.

10. 发明授权

US4656377A Tachogenerator having a magnetoresistance stator coil 失效
标题翻译：具有磁阻定子线圈的测速发电机
公开(公告)号：US4656377A
公开(公告)日：1987-04-07
申请号：US695816
申请日：1985-01-28
申请人： Naoki Akiyama , Kenichi Kitamura , Eiichi Kotake
发明人： Naoki Akiyama , Kenichi Kitamura , Eiichi Kotake
IPC分类号： G01D5/242 , G01B7/24 , H01L43/08 , H02K11/00
CPC分类号： G01D5/242
摘要： A tachogenerator has a magnetoresistance film coil formed on a stator surface along a circular path concentric with a rotor axis. The coil has a spatially periodic structure, with multiple spaced-apart lateral components series connected with longitudinal components. The stator surface is opposite to a rotor surface having multiple equiangularly spaced magnetic pole faces with alternately opposite polarities. Current passed through the coil develops voltage variations. Undesirable small voltage variations resulting from manufacturing tolerances are averaged to zero at the coil output terminals.
摘要翻译：测速发电机具有沿着与转子轴线同心的圆形路径在定子表面上形成的磁阻膜线圈。线圈具有空间周期性结构，具有与纵向部件连接的多个间隔开的侧向部件。定子表面与具有交替相反极性的多个等角间隔磁极面的转子表面相对。通过线圈的电流产生电压变化。在线圈输出端子处，由制造公差引起的不希望的小电压变化平均为零。

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