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    • 1. 发明申请
    • Method of Manufacturing Semiconductor Device
    • 制造半导体器件的方法
    • US20080138969A1
    • 2008-06-12
    • US11948344
    • 2007-11-30
    • Akio KanekoMotoyuki SatoKatsuyuki SekineTomohiro SaitoKazuaki NakajimaTomonori Aoyama
    • Akio KanekoMotoyuki SatoKatsuyuki SekineTomohiro SaitoKazuaki NakajimaTomonori Aoyama
    • H01L21/28
    • H01L29/517H01L21/28097H01L21/3215H01L21/823814H01L21/823835H01L21/823842H01L29/66507
    • A method of manufacturing a semiconductor device having a MOSFET of a first conductivity type and a MOSFET of a second conductivity type different from the first conductivity type formed on a semiconductor substrate, the method has: forming a gate insulating film; forming a first gate electrode layer, and forming a second gate electrode layer; forming a first metal containing layer on said first gate electrode layer and said second gate electrode layer; forming a second metal containing layer for preventing diffusion of a metal on said first metal containing layer; forming a third metal containing layer on said second gate electrode layer from which said first metal containing layer and said second metal containing layer are selectively removed, the third metal containing layer having a thickness different from the thickness of said first metal containing layer in a case where the third metal containing layer contains the same metal or alloy as the metal or alloy contained in said first metal containing layer; and performing a thermal processing, thereby causing reaction between the metal contained in said first metal containing layer and said first gate electrode layer to convert said first gate electrode layer into an alloy and causing reaction between the metal contained in said third metal containing layer and said second gate electrode layer to convert said second gate electrode layer into an alloy, thereby forming gate electrodes of different compositions.
    • 一种制造具有第一导电类型的MOSFET的半导体器件的方法和形成在半导体衬底上的与第一导电类型不同的第二导电类型的MOSFET,该方法具有:形成栅极绝缘膜; 形成第一栅电极层,形成第二栅电极层; 在所述第一栅电极层和所述第二栅电极层上形成第一含金属层; 形成用于防止金属在所述第一金属含有层上的扩散的第二含金属层; 在所述第二栅电极层上形成第三金属含有层,从所述第二金属含有层和所述第二金属含有层选择性地除去所述第三金属含有层,所述第三金属含有层的厚度与所述第一金属含有层的厚度不同 其中所述第三含金属层包含与所述第一含金属层中所含的金属或合金相同的金属或合金; 并进行热处理,从而使包含在所述第一金属含有层中的金属与所述第一栅极电极层之间产生反应,将所述第一栅电极层转换成合金,并引起所述第三金属含有层中含有的金属与所述 第二栅极电极层,以将所述第二栅电极层转换成合金,从而形成不同组成的栅极。
    • 5. 发明授权
    • Method of manufacturing semiconductor device
    • 制造半导体器件的方法
    • US07521309B2
    • 2009-04-21
    • US11948344
    • 2007-11-30
    • Akio KanekoMotoyuki SatoKatsuyuki SekineTomohiro SaitoKazuaki NakajimaTomonori Aoyama
    • Akio KanekoMotoyuki SatoKatsuyuki SekineTomohiro SaitoKazuaki NakajimaTomonori Aoyama
    • H01L21/336
    • H01L29/517H01L21/28097H01L21/3215H01L21/823814H01L21/823835H01L21/823842H01L29/66507
    • A method of manufacturing a semiconductor device having a MOSFET of a first conductivity type and a MOSFET of a second conductivity type different from the first conductivity type formed on a semiconductor substrate, the method has: forming a gate insulating film; forming a first gate electrode layer, and forming a second gate electrode layer; forming a first metal containing layer on said first gate electrode layer and said second gate electrode layer; forming a second metal containing layer for preventing diffusion of a metal on said first metal containing layer; forming a third metal containing layer on said second gate electrode layer from which said first metal containing layer and said second metal containing layer are selectively removed, the third metal containing layer having a thickness different from the thickness of said first metal containing layer in a case where the third metal containing layer contains the same metal or alloy as the metal or alloy contained in said first metal containing layer; and performing a thermal processing, thereby causing reaction between the metal contained in said first metal containing layer and said first gate electrode layer to convert said first gate electrode layer into an alloy and causing reaction between the metal contained in said third metal containing layer and said second gate electrode layer to convert said second gate electrode layer into an alloy, thereby forming gate electrodes of different compositions.
    • 一种制造具有第一导电类型的MOSFET的半导体器件的方法和形成在半导体衬底上的与第一导电类型不同的第二导电类型的MOSFET,该方法具有:形成栅极绝缘膜; 形成第一栅电极层,形成第二栅电极层; 在所述第一栅电极层和所述第二栅电极层上形成第一含金属层; 形成用于防止金属在所述第一金属含有层上的扩散的第二含金属层; 在所述第二栅电极层上形成第三金属含有层,从所述第二金属含有层和所述第二金属含有层被选择性地除去,所述第三金属含有层的厚度与所述第一金属含有层的厚度不同 其中所述第三含金属层包含与所述第一含金属层中所含的金属或合金相同的金属或合金; 并进行热处理,从而使包含在所述第一金属含有层中的金属与所述第一栅极电极层之间产生反应,将所述第一栅电极层转换成合金,并引起所述第三金属含有层中含有的金属与所述 第二栅极电极层,以将所述第二栅电极层转换成合金,从而形成不同组成的栅电极。
    • 7. 发明授权
    • Luminous flux control member and light-emitting apparatus including the same
    • 光通量控制部件和包括该光通量控制部件的发光装置
    • US08905593B2
    • 2014-12-09
    • US13601735
    • 2012-08-31
    • Tomohiro Saito
    • Tomohiro Saito
    • F21V13/04G02B19/00F21V5/02F21V7/00F21Y101/02F21V3/04
    • F21V5/02F21V3/04F21V7/0091F21Y2115/10G02B19/0009G02B19/0028G02B19/0061
    • A luminous flux control member that controls travelling direction of light emitted from a light source includes an incident area, an emission area, and a plurality of projecting sections. The plurality of projecting sections are constituted by an inner area, an intermediate area, and a peripheral area defined in the radial direction, and a first specific projecting section disposed in the inner area is configured such that a planar section that is used to measure the height of the first specific projecting section and is perpendicular to the optical axis is connected to an inner peripheral end and an outer peripheral end of a base end portion of the first specific projecting section. The projecting sections other than the first specific projecting section, in principle, come into contact internally or externally with another projecting section other than the first specific projecting section.
    • 控制从光源射出的光的行进方向的光束控制部件具有入射面积,发光面积,以及多个突出部。 多个突出部分由沿径向限定的内部区域,中间区域和周边区域构成,并且设置在内部区域中的第一特定突出部分被构造成使得用于测量 第一特定突出部的高度,与光轴垂直的高度与第一特定突出部的基端部的内周端和外周端连接。 原理上,除了第一特定突出部分之外的突出部分在内部或外部与除第一特定突出部分之外的另一个突出部分接触。
    • 8. 发明授权
    • Manufacturing method of hermetic container
    • 密封容器的制造方法
    • US08475618B2
    • 2013-07-02
    • US13198867
    • 2011-08-05
    • Mamo MatsumotoTomohiro SaitoNobuhiro Ito
    • Mamo MatsumotoTomohiro SaitoNobuhiro Ito
    • B32B37/16
    • H01L51/5246H01J9/241H01L51/525
    • A manufacturing method of a hermetic container includes an assembling step of assembling the hermetic container and a sealing step of sealing by first and second sealing materials. Thus, in a case where local heating light is scanned toward an already-sealed portion of the second sealing material, since a separation portion of an unsealed state is located between the already-sealed portion and a downstream end of scanning, a load due to expansion/contraction of a frame body is applied to the first sealing material which is present in the separation portion of the unsealed state. After then, since the local heating light is irradiated to the first sealing material to which the load has been applied so as to heat and melt it, the load is relieved, whereby it is possible to suppress deterioration of joining strength and airtightness of the hermetic container.
    • 密封容器的制造方法包括组装密封容器的组装步骤和通过第一和第二密封材料密封的密封步骤。 因此,在向第二密封材料的已经密封的部分扫描局部加热光的情况下,由于未密封状态的分离部位于已经密封的部分和扫描的下游端之间,所以由于 将框体的伸缩进行施加到存在于未密封状态的分离部中的第一密封材料。 然后,由于局部加热光被照射到已经施加负载的第一密封材料上以加热和熔化,所以负载被释放,从而可以抑制密封件的接合强度和气密性的劣化 容器。