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1. 发明授权

US06975026B2 Package for mounting semiconductor device 有权
标题翻译：用于安装半导体器件的封装
公开(公告)号：US06975026B2
公开(公告)日：2005-12-13
申请号：US10409929
申请日：2003-04-10
申请人： Morihiko Mouri , Sadayuki Okuma , Yasushi Takahashi , Takao Ono , Yosihiro Sakaguchi , Atsushi Nakamura , Toshio Miyazawa
发明人： Morihiko Mouri , Sadayuki Okuma , Yasushi Takahashi , Takao Ono , Yosihiro Sakaguchi , Atsushi Nakamura , Toshio Miyazawa
IPC分类号： H01L23/29 , H01L23/31 , H01L23/34 , H01L23/373 , H01L23/10
CPC分类号： H01L23/3135 , H01L23/3164 , H01L23/3737 , H01L2924/0002 , H01L2924/00
摘要： A package for mounting a semiconductor device has a surface exposed to an atmosphere. The exposed surface is covered with a covering material such as a paint, a tape or a seal.
摘要翻译：用于安装半导体器件的封装具有暴露于大气的表面。暴露的表面被覆盖材料覆盖，例如涂料，胶带或密封件。

2. 发明授权

US07633147B2 Semiconductor unit having two device terminals for every one input/output signal 失效
标题翻译：半导体单元具有用于每一个输入/输出信号的两个器件端子
公开(公告)号：US07633147B2
公开(公告)日：2009-12-15
申请号：US10672551
申请日：2003-09-26
申请人： Seiji Funaba , Hisashi Abo , Takao Ono , Koji Hosokawa , Yoji Nishio , Atsushi Nakamura , Tomohiko Sato
发明人： Seiji Funaba , Hisashi Abo , Takao Ono , Koji Hosokawa , Yoji Nishio , Atsushi Nakamura , Tomohiko Sato
IPC分类号： H01L23/538
CPC分类号： H01L25/105 , H01L23/50 , H01L23/552 , H01L23/60 , H01L23/64 , H01L24/06 , H01L24/48 , H01L24/49 , H01L2223/6627 , H01L2224/04042 , H01L2224/05553 , H01L2224/05554 , H01L2224/05599 , H01L2224/06136 , H01L2224/48091 , H01L2224/4824 , H01L2224/49171 , H01L2224/85399 , H01L2225/1023 , H01L2225/1058 , H01L2225/107 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/0102 , H01L2924/01029 , H01L2924/01033 , H01L2924/014 , H01L2924/13091 , H01L2924/15173 , H01L2924/15192 , H01L2924/15311 , H01L2924/1532 , H01L2924/15331 , H01L2924/19032 , H01L2924/19041 , H01L2924/19051 , H01L2924/19106 , H01L2924/30107 , H01L2924/3011 , H01L2924/30111 , H01L2924/3025 , H05K1/112 , H05K1/14 , H05K1/181 , H05K2201/09236 , H05K2201/10159 , H05K2201/10545 , Y02P70/611 , H01L2224/45099 , H01L2924/00
摘要： A semiconductor unit constituting a memory device has a memory chip, a package substrate having three wiring layers. Power-supply surfaces (VDD surface) and (GND surface) are wired on the package substrate while an intra-package DQ bus is wired on an intermediate layer between both of the power-supply surfaces. The memory device has two DQ pins every one intra-package DQ bus. The intra-package DQ bus is connected to a signal terminal pad of the memory chip through a via hole. In view of the two DW pins, a via hole for connecting the intra-package DQ bus with the signal terminal pad constitutes a branch wire.
摘要翻译：构成存储器件的半导体单元具有存储芯片，具有三个布线层的封装基板。电源表面（VDD表面）和（GND表面）被布线在封装衬底上，而封装内的DQ总线布线在两个电源表面之间的中间层上。存储器件每一个封装内DQ总线具有两个DQ引脚。封装内的DQ总线通过通孔连接到存储器芯片的信号端子焊盘。鉴于两个DW引脚，用于将封装内DQ DQ总线与信号端子焊盘连接的通孔构成分支线。

3. 发明申请

US20110055616A1 Memory module 有权
标题翻译：内存模块
公开(公告)号：US20110055616A1
公开(公告)日：2011-03-03
申请号：US12805689
申请日：2010-08-13
申请人： Yoji Nishio , Takao Ono
发明人： Yoji Nishio , Takao Ono
IPC分类号： G06F1/04 , G06F12/00 , G06F1/12
CPC分类号： G11C5/04 , G06F13/1673
摘要： A memory buffer mounted on a memory module includes a pre-launch function of advancing outputs of address/command signal and a post-launch function of delaying outputs of control signal. A time step increment for pre/post-launch time adjustment is set to be equal to or finer than tCK/32 where tCK is one clock cycle.
摘要翻译：安装在存储器模块上的存储器缓冲器包括推进地址/命令信号输出的预启动功能和延迟控制信号输出的发射后功能。预启动/启动后时间调整的时间步长增量设置为等于或更小于tCK / 32，其中tCK是一个时钟周期。

4. 发明授权

US07763971B2 Circuit module and electrical component 有权
标题翻译：电路模块和电气元件
公开(公告)号：US07763971B2
公开(公告)日：2010-07-27
申请号：US12175574
申请日：2008-07-18
申请人： Takao Ono
发明人： Takao Ono
IPC分类号： H01L23/053
CPC分类号： H05K1/181 , H01L23/3114 , H01L23/3128 , H01L24/48 , H01L25/0657 , H01L25/105 , H01L2224/16 , H01L2224/48091 , H01L2225/0651 , H01L2225/06517 , H01L2225/06527 , H01L2225/06582 , H01L2225/06586 , H01L2924/00014 , H01L2924/15311 , H01L2924/181 , H01L2924/19041 , H01L2924/30107 , H01L2924/3011 , H05K2201/09709 , H05K2201/10515 , Y02P70/611 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： In an electrical component including a solid-state circuit portion and a substrate connecting portion, the solid-state circuit portion includes: a supporting surface faced to and supported by the substrate connecting portion; and an opposing surface which is widened outside the supporting surface and which has an area enough to be opposed to another solid-state circuit portion. This structure makes it possible to arrange, on a circuit board, a plurality of the electrical components in a staggered manner in a height direction.
摘要翻译：在包括固态电路部分和基板连接部分的电气部件中，固态电路部分包括：面对并由基板连接部分支撑的支撑表面; 以及相对的表面，其在支撑表面的外侧加宽，并且具有足以与另一固态电路部分相对的面积。这种结构使得可以在电路板上沿高度方向以交错的方式布置多个电气部件。

5. 发明授权

US06726780B2 Lead-free solder, and paste solder composition 有权
标题翻译：无铅焊料和焊膏组成
公开(公告)号：US06726780B2
公开(公告)日：2004-04-27
申请号：US10384829
申请日：2003-03-10
申请人： Takao Ono , Mitsuru Iwabuchi , Kenji Fujimori , Hiroaki Koyahara
发明人： Takao Ono , Mitsuru Iwabuchi , Kenji Fujimori , Hiroaki Koyahara
IPC分类号： B23K3522
CPC分类号： C22C13/00 , B23K35/025 , B23K35/262 , H05K3/3463 , H05K3/3484
摘要： There is provided a lead-free solder which makes it possible to reliably and accurately perform the inspection of various kinds of defective soldering in the inspection using an image inspection apparatus after the reflow soldering. According to this lead-free solder, the delustering of the metallic luster of fillet is realized in order to minimize the probability of generating a dark portion at the area where no defective soldering is existed and instead to increase the area of whitish portion which can be generated through the irregular reflection of beam. Specifically, this invention provides a lead-free solder comprising an Sn—Ag—Cu-based lead-free solder containing a small quantity of Bi and Sb as an element which is capable of generating a delustering component for minimizing metallic luster of the fillet.
摘要翻译：提供了一种无铅焊料，其使得可以在回流焊接之后使用图像检查装置可靠且准确地执行检查中的各种不良焊接。根据这种无铅焊料，实现了圆角金属光泽的消光，以便在不存在有缺陷焊接的区域处产生暗部的可能性最小化，而是增加发白部分的面积通过梁的不规则反射产生。具体而言，本发明提供了一种无铅焊料，其包含含有少量Bi和Sb作为元素的Sn-Ag-Cu系无铅焊料，其能够产生用于使金属丝的金属光泽最小化的消光部件。

6. 发明授权

US08347057B2 Memory module 有权
标题翻译：内存模块
公开(公告)号：US08347057B2
公开(公告)日：2013-01-01
申请号：US12805689
申请日：2010-08-13
申请人： Yoji Nishio , Takao Ono
发明人： Yoji Nishio , Takao Ono
IPC分类号： G06F12/00
CPC分类号： G11C5/04 , G06F13/1673
摘要： A memory buffer mounted on a memory module includes a pre-launch function of advancing outputs of address/command signal and a post-launch function of delaying outputs of control signal. A time step increment for pre/post-launch time adjustment is set to be equal to or finer than tCK/32 where tCK is one clock cycle.
摘要翻译：安装在存储器模块上的存储器缓冲器包括推进地址/命令信号输出的预启动功能和延迟控制信号输出的发射后功能。预启动/启动后时间调整的时间步长增量设置为等于或更小于tCK / 32，其中tCK是一个时钟周期。

7. 发明申请

US20070090534A1 Semiconductor module including a plurality of IC chips therein 审中-公开
标题翻译：半导体模块包括多个IC芯片
公开(公告)号：US20070090534A1
公开(公告)日：2007-04-26
申请号：US11582958
申请日：2006-10-19
申请人： Hironori Iwasaki , Takao Ono
发明人： Hironori Iwasaki , Takao Ono
IPC分类号： H01L23/52
CPC分类号： H01L23/5385 , H01L25/0652 , H01L2224/05571 , H01L2224/05573 , H01L2224/16225 , H01L2924/00014 , H01L2924/3011 , H05K1/0237 , H05K1/181 , H05K2201/049 , H05K2201/10159 , H05K2201/10378 , H05K2201/10734 , H05K2203/1572 , Y02P70/611 , H01L2224/05599
摘要： A semiconductor module includes a driver IC chip and a plurality of memory IC chips on a common wiring board. Some of the memory IC chips nearer to the driver IC chip than the other memory IC chips are mounted on an interposer substrate mounted on the wiring board, providing a uniform line length among a species of signal lines for the memory IC chips.
摘要翻译：半导体模块包括驱动IC芯片和公共布线板上的多个存储IC芯片。一些比其他存储器IC芯片更靠近驱动器IC芯片的存储器IC芯片安装在安装在布线板上的插入器基板上，在用于存储器IC芯片的各种信号线之间提供均匀的线路长度。

8. 发明申请

US20050001502A1 DC brushless motor 审中-公开
标题翻译：直流无刷电机
公开(公告)号：US20050001502A1
公开(公告)日：2005-01-06
申请号：US10868792
申请日：2004-06-17
申请人： Hiroyuki Yamazaki , Takao Ono
发明人： Hiroyuki Yamazaki , Takao Ono
IPC分类号： H02K1/22 , H02K1/27 , H02K15/03 , H02K29/00 , H02K29/03 , H02K21/12
CPC分类号： H02K29/03
摘要： The DC brushless motor is capable of increasing an output power and reducing vibrations and noise. The DC brushless motor comprises: a magnet rotor, in which magnetic poles are polar-anisotropically oriented, wherein the magnetic poles are skewed with respect to an axial line of the magnet rotor.
摘要翻译：直流无刷电机能够增加输出功率，减少振动和噪音。 DC无刷电动机包括：磁极，其中磁极是极各向异性取向的，其中磁极相对于磁体转子的轴线倾斜。

9. 发明申请

US20050248010A1 Semiconductor package and system module 审中-公开
标题翻译：半导体封装和系统模块
公开(公告)号：US20050248010A1
公开(公告)日：2005-11-10
申请号：US11080545
申请日：2005-03-16
申请人： Takao Ono , Tomohiko Sato , Hironori Iwasaki
发明人： Takao Ono , Tomohiko Sato , Hironori Iwasaki
IPC分类号： H01L23/12 , H01L23/02 , H01L23/13 , H01L23/498 , H01L25/10 , H01L25/11 , H01L25/18 , H05K1/02 , H05K3/34
CPC分类号： H01L23/49816 , H01L23/13 , H01L25/105 , H01L2225/1023 , H01L2225/1058 , H01L2924/0002 , H01L2924/15311 , H01L2924/15321 , H01L2924/15331 , H05K1/0271 , H05K3/3436 , H05K2201/09172 , H05K2201/10159 , H05K2201/10515 , Y02P70/613 , H01L2924/00
摘要： A thermal expansion coefficient of a module substrate 8 is different from that of a package substrate. There is not any place where stresses generated in Interfaces between soldering balls 5 and the substrate are released. These stresses are largely applied to soldering bond, the soldering balls are strained, deformed, or cracked, and there has been a problem in long-time reliability. Slits are disposed on opposite sides of each soldering ball in a vertical direction to a side in an outer peripheral side of the package substrate, accordingly the stresses applied to the soldering balls are weakened, and the soldering balls are prevented from being strained, deformed, or cracked. When soldering strains are reduced in this manner, there can be provided a surface mounting type semiconductor package and system module having high reliability, low cost, and satisfactory electric characteristics such as low capacitance and low inductance.
摘要翻译：模块基板8的热膨胀系数与封装基板的热膨胀系数不同。没有任何地方在焊球5和基板之间的接口中产生应力释放。这些应力主要用于焊接，焊球变形，变形或破裂，长时间的可靠性存在问题。在每个焊球的相对侧，在与封装基板的外周侧的一侧的垂直方向上配置有狭缝，因此施加于焊球的应力变弱，防止焊球发生变形，或破裂。当以这种方式减小焊接应变时，可以提供具有高可靠性，低成本和令人满意的电特性如低电容和低电感的表面安装型半导体封装和系统模块。

10. 发明授权

US06756166B2 Photosensitive resin composition and printed wiring board 失效
标题翻译：感光树脂组合物和印刷线路板
公开(公告)号：US06756166B2
公开(公告)日：2004-06-29
申请号：US10252200
申请日：2002-09-23
申请人： Takao Ono , Ichiro Miura
发明人： Takao Ono , Ichiro Miura
IPC分类号： G03F7038
CPC分类号： G03F7/038 , H05K3/287
摘要： Disclosed is a photosensitive resin composition which can be developed using a dilute aqueous alkaline solution after ultraviolet ray exposure, is excellent in pot life, capable of preventing deposits from being generated in a cured coated film, capable of widening heat control tolerance, and is excellent in sensitivity, in heat resistance, in chemical resistance and in electric insulating properties, thereby rendering the composition suitable for use as a solder resist for producing a printed wiring board. This photosensitive resin composition comprises (A) an active energy ray-curable resin having at least two ethylenic unsaturated linkages per molecule thereof, (B) at least one kind material selected from acid salts of N-substituted melamine compound and acid salts of guanamine compound, (C) a photopolymerization initiator, (D) a diluent, and (E) a thermosetting compound. There is also disclosed a printed wiring board where this photosensitive resin composition is employed.
摘要翻译：公开了一种感光性树脂组合物，其可以在紫外线照射后使用稀碱水溶液显影，具有优异的适用期，能够防止在固化涂膜中产生沉积物，能够扩大耐热耐受性，并且优异敏感性，耐热性，耐化学性和电绝缘性，从而使组合物适合用作制造印刷线路板的阻焊剂。该感光性树脂组合物包含（A）每分子具有至少2个烯键式不饱和键的活性能量射线固化性树脂，（B）选自N-取代三聚氰胺化合物的酸式盐和胍胺化合物的酸盐中的至少一种，（C）光聚合引发剂，（D）稀释剂和（E）热固化性化合物。还公开了使用该感光性树脂组合物的印刷电路板。

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