会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 5. 发明授权
    • Photosensitive resin composition and printed wiring board
    • 感光树脂组合物和印刷线路板
    • US06756166B2
    • 2004-06-29
    • US10252200
    • 2002-09-23
    • Takao OnoIchiro Miura
    • Takao OnoIchiro Miura
    • G03F7038
    • G03F7/038H05K3/287
    • Disclosed is a photosensitive resin composition which can be developed using a dilute aqueous alkaline solution after ultraviolet ray exposure, is excellent in pot life, capable of preventing deposits from being generated in a cured coated film, capable of widening heat control tolerance, and is excellent in sensitivity, in heat resistance, in chemical resistance and in electric insulating properties, thereby rendering the composition suitable for use as a solder resist for producing a printed wiring board. This photosensitive resin composition comprises (A) an active energy ray-curable resin having at least two ethylenic unsaturated linkages per molecule thereof, (B) at least one kind material selected from acid salts of N-substituted melamine compound and acid salts of guanamine compound, (C) a photopolymerization initiator, (D) a diluent, and (E) a thermosetting compound. There is also disclosed a printed wiring board where this photosensitive resin composition is employed.
    • 公开了一种感光性树脂组合物,其可以在紫外线照射后使用稀碱水溶液显影,具有优异的适用期,能够防止在固化涂膜中产生沉积物,能够扩大耐热耐受性,并且优异 敏感性,耐热性,耐化学性和电绝缘性,从而使组合物适合用作制造印刷线路板的阻焊剂。 该感光性树脂组合物包含(A)每分子具有至少2个烯键式不饱和键的活性能量射线固化性树脂,(B)选自N-取代三聚氰胺化合物的酸式盐和胍胺化合物的酸盐中的至少一种 ,(C)光聚合引发剂,(D)稀释剂和(E)热固化性化合物。 还公开了使用该感光性树脂组合物的印刷电路板。