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    • 6. 发明授权
    • Method for producing a semiconductor integrated circuit device in which
circuit functions can be remedied or changed
    • 制造可补救或改变电路功能的半导体集成电路器件的方法
    • US5279984A
    • 1994-01-18
    • US45161
    • 1993-04-12
    • Mitsuya KinoshitaKazutami ArimotoKiyohiro Furutani
    • Mitsuya KinoshitaKazutami ArimotoKiyohiro Furutani
    • H01L21/768H01L23/525H01L27/118H01L21/70H01L27/00
    • H01L21/76894H01L23/5258H01L27/118H01L2924/0002
    • A semiconductor integrated circuit device in which circuit functions can be remedied or changed by severing at least a portion of a circuit pattern and a method for producing such semiconductor integrated circuit device. The circuit pattern is formed on the semiconductor substrate. A field shield plate is formed on the major surface of the semiconductor substrate for electrically separating respective elements constituting the circuit. The circuit pattern includes a fuse element. The fuse element is provided on the field shield plate. The portion of the field shield plate lying directly below the fuse element is isolated from other portions of the field shield plate. In such semiconductor integrated circuit device, the portion of the field shield plate lying directly below the fuse element is separated from other portions of the field shield plate, so that short-circuiting between the semiconductor substrate and the field shield plate cannot occur even when the laser beam is irradiated with a laser beam deviation at the time of severing of the fuse element.
    • 一种半导体集成电路器件,其中可以通过切断电路图案的至少一部分来补救或改变电路功能,以及用于制造这种半导体集成电路器件的方法。 电路图案形成在半导体衬底上。 在半导体基板的主表面上形成场屏蔽板,用于电分离构成电路的各个元件。 电路图案包括熔丝元件。 保险丝元件设置在场屏蔽板上。 位于保险丝元件正下方的场屏蔽板的部分与场屏蔽板的其它部分隔离。 在这样的半导体集成电路器件中,位于熔丝元件正下方的场屏蔽板的部分与场屏蔽板的其他部分分离,使得半导体衬底和场屏蔽板之间的短路即使在 激光束在熔断元件断开时被激光束的偏离照射。