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1. 发明授权

US08633596B2 Semiconductor package with bonding wires of reduced loop inductance 有权
标题翻译：具有降低环路电感的接合线的半导体封装
公开(公告)号：US08633596B2
公开(公告)日：2014-01-21
申请号：US13291740
申请日：2011-11-08
申请人： Mitsuaki Katagiri , Ken Iwakura , Yutaka Uematsu
发明人： Mitsuaki Katagiri , Ken Iwakura , Yutaka Uematsu
IPC分类号： H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H01L23/498 , G11C5/06 , H01L23/525 , H01L24/05 , H01L24/06 , H01L24/48 , H01L24/49 , H01L25/0657 , H01L2223/6611 , H01L2224/04042 , H01L2224/05013 , H01L2224/05553 , H01L2224/48091 , H01L2224/48137 , H01L2224/48145 , H01L2224/48227 , H01L2224/48463 , H01L2224/49175 , H01L2224/49176 , H01L2224/49431 , H01L2225/06506 , H01L2225/0651 , H01L2225/06527 , H01L2924/00014 , H01L2924/01005 , H01L2924/01013 , H01L2924/0102 , H01L2924/01023 , H01L2924/01033 , H01L2924/014 , H01L2924/15173 , H01L2924/181 , H01L2924/30107 , H01L2924/00 , H01L2224/45099 , H01L2924/00012
摘要： A semiconductor package includes a semiconductor device including a plurality of signal pads and a plurality of auxiliary pads which are alternatively arranged in a predetermined direction, and a package board including a plurality of signal bond fingers, a plurality of first power supply voltage bond fingers, and a plurality of second power supply voltage bond fingers. The signal pads are connected respectively to the signal bond fingers by first wires. The first power supply voltage bond fingers and the second power supply voltage bond fingers are connected respectively to the auxiliary pads by second wires. The first wires are disposed between those of the second wires which are connected to the first power supply voltage bond fingers and those of the second wires which are connected to the second power supply voltage bond fingers.
摘要翻译：半导体封装包括：半导体器件，包括多个信号焊盘和沿预定方向交替布置的多个辅助焊盘;以及封装板，包括多个信号键合指，多个第一电源电压键合指，以及多个第二电源电压接合指。信号焊盘通过第一线分别连接到信号键指。第一电源电压键指和第二电源电压键合指通过第二线分别连接到辅助焊盘。第一导线设置在连接到第一电源电压接合指的第二配线和连接到第二电源电压接合指的第二配线之间。

2. 发明申请

US20120200159A1 SEMICONDUCTOR DEVICE 审中-公开
标题翻译：半导体器件
公开(公告)号：US20120200159A1
公开(公告)日：2012-08-09
申请号：US13366717
申请日：2012-02-06
申请人： Mitsuaki KATAGIRI , Ken Iwakura , Yutaka Uematsu
发明人： Mitsuaki KATAGIRI , Ken Iwakura , Yutaka Uematsu
IPC分类号： H02J4/00
CPC分类号： H03K19/00361 , G11C7/02 , G11C11/4074 , G11C11/4076 , G11C11/4096 , Y10T307/50
摘要： A semiconductor device includes: first and second power supply wirings VDDQ and VSSQ, respectively; an output circuit 12 arranged between VDDQ and VSSQ; and a noise cancellation circuit 13 arranged between VDDQ and VSSQ. The noise cancellation circuit 13 produces a damped oscillation for the SSN oscillation noise that is generated when a logic level outputted to an output node of the output circuit is switched and that exponentially damps and oscillates at a predetermined period. The damped oscillation produced by the noise cancellation circuit 13 is delayed by half a period of the SSN oscillation noise and has a direction opposite to that of the SSN oscillation noise and hence the damped oscillation and the SSN oscillation noise counteract each other.
摘要翻译：半导体器件分别包括：第一和第二电源配线VDDQ和VSSQ; 布置在VDDQ和VSSQ之间的输出电路12; 以及布置在VDDQ和VSSQ之间的噪声消除电路13。噪声消除电路13产生用于当输出到输出电路的输出节点的逻辑电平被切换并且以预定周期指数衰减和振荡时产生的SSN振荡噪声的阻尼振荡。由噪声消除电路13产生的阻尼振荡被延迟SSN振荡噪声的一半周期，并且具有与SSN振荡噪声相反的方向，因此阻尼振荡和SSN振荡噪声相互抵消。

3. 发明授权

US08680881B2 Test method and interposer used therefor 失效
标题翻译：用于此的测试方法和插入器
公开(公告)号：US08680881B2
公开(公告)日：2014-03-25
申请号：US13044717
申请日：2011-03-10
申请人： Yutaka Uematsu , Hideki Osaka , Satoshi Nakamura , Satoshi Muraoka , Mitsuaki Katagiri , Ken Iwakura , Yukitoshi Hirose
发明人： Yutaka Uematsu , Hideki Osaka , Satoshi Nakamura , Satoshi Muraoka , Mitsuaki Katagiri , Ken Iwakura , Yukitoshi Hirose
IPC分类号： G01R31/00
CPC分类号： G01R31/2889
摘要： An interposer to be mounted with an integrated circuit to be a test object is provided with a switch and a probe to detect an electric current corresponding to individual terminals of the integrated circuit. A test pattern signal is then inputted to the integrated circuit through a test substrate as a switch that is connected to a power supply terminal of the integrated circuit and that is turned off. If the integrated circuit normally operates and the current values of all the terminals of the integrated circuit are within a tolerance, the power supply terminal connected to the turned-off switch is identified as a terminal that may be removed.
摘要翻译：安装有作为测试对象的集成电路的插入器设置有用于检测与集成电路的各个端子相对应的电流的开关和探头。然后，通过作为与集成电路的电源端子连接并断开的开关的测试基板将测试图形信号输入到集成电路。如果集成电路正常工作，并且集成电路的所有端子的电流值都在容差内，则连接到关断开关的电源端子被识别为可以被去除的端子。

4. 发明申请

US20120119387A1 SEMICONDUCTOR PACKAGE WITH BONDING WIRES OF REDUCED LOOP INDUCTANCE 有权
标题翻译：具有减少环路电感的连接线的半导体封装
公开(公告)号：US20120119387A1
公开(公告)日：2012-05-17
申请号：US13291740
申请日：2011-11-08
申请人： Mitsuaki KATAGIRI , Ken Iwakura , Yutaka Uematsu
发明人： Mitsuaki KATAGIRI , Ken Iwakura , Yutaka Uematsu
IPC分类号： H01L23/50 , H01L23/522
CPC分类号： H01L23/498 , G11C5/06 , H01L23/525 , H01L24/05 , H01L24/06 , H01L24/48 , H01L24/49 , H01L25/0657 , H01L2223/6611 , H01L2224/04042 , H01L2224/05013 , H01L2224/05553 , H01L2224/48091 , H01L2224/48137 , H01L2224/48145 , H01L2224/48227 , H01L2224/48463 , H01L2224/49175 , H01L2224/49176 , H01L2224/49431 , H01L2225/06506 , H01L2225/0651 , H01L2225/06527 , H01L2924/00014 , H01L2924/01005 , H01L2924/01013 , H01L2924/0102 , H01L2924/01023 , H01L2924/01033 , H01L2924/014 , H01L2924/15173 , H01L2924/181 , H01L2924/30107 , H01L2924/00 , H01L2224/45099 , H01L2924/00012
摘要： A semiconductor package includes a semiconductor device including a plurality of signal pads and a plurality of auxiliary pads which are alternatively arranged in a predetermined direction, and a package board including a plurality of signal bond fingers, a plurality of first power supply voltage bond fingers, and a plurality of second power supply voltage bond fingers. The signal pads are connected respectively to the signal bond fingers by first wires. The first power supply voltage bond fingers and the second power supply voltage bond fingers are connected respectively to the auxiliary pads by second wires. The first wires are disposed between those of the second wires which are connected to the first power supply voltage bond fingers and those of the second wires which are connected to the second power supply voltage bond fingers.
摘要翻译：半导体封装包括：半导体器件，包括多个信号焊盘和沿预定方向交替布置的多个辅助焊盘;以及封装板，包括多个信号键合指，多个第一电源电压键合指，以及多个第二电源电压接合指。信号焊盘通过第一线分别连接到信号键指。第一电源电压键指和第二电源电压键合指通过第二线分别连接到辅助焊盘。第一导线设置在连接到第一电源电压接合指的第二配线和连接到第二电源电压接合指的第二配线之间。

5. 发明申请

US20140103542A1 SEMICONDUCTOR PACKAGE WITH BONDING WIRES OF REDUCED LOOP INDUCTANCE 有权
标题翻译：具有减少环路电感的连接线的半导体封装
公开(公告)号：US20140103542A1
公开(公告)日：2014-04-17
申请号：US14109618
申请日：2013-12-17
申请人： Mitsuaki KATAGIRI , Ken Iwakura , Yutaka Uematsu
发明人： Mitsuaki KATAGIRI , Ken Iwakura , Yutaka Uematsu
IPC分类号： H01L23/498
CPC分类号： H01L23/498 , G11C5/06 , H01L23/525 , H01L24/05 , H01L24/06 , H01L24/48 , H01L24/49 , H01L25/0657 , H01L2223/6611 , H01L2224/04042 , H01L2224/05013 , H01L2224/05553 , H01L2224/48091 , H01L2224/48137 , H01L2224/48145 , H01L2224/48227 , H01L2224/48463 , H01L2224/49175 , H01L2224/49176 , H01L2224/49431 , H01L2225/06506 , H01L2225/0651 , H01L2225/06527 , H01L2924/00014 , H01L2924/01005 , H01L2924/01013 , H01L2924/0102 , H01L2924/01023 , H01L2924/01033 , H01L2924/014 , H01L2924/15173 , H01L2924/181 , H01L2924/30107 , H01L2924/00 , H01L2224/45099 , H01L2924/00012
摘要： A semiconductor package includes a semiconductor device including a plurality of signal pads and a plurality of auxiliary pads which are alternatively arranged in a predetermined direction, and a package board including a plurality of signal bond fingers, a plurality of first power supply voltage bond fingers, and a plurality of second power supply voltage bond fingers. The signal pads are connected respectively to the signal bond fingers by first wires. The first power supply voltage bond fingers and the second power supply voltage bond fingers are connected respectively to the auxiliary pads by second wires. The first wires are disposed between those of the second wires which are connected to the first power supply voltage bond fingers and those of the second wires which are connected to the second power supply voltage bond fingers.
摘要翻译：半导体封装包括：半导体器件，包括多个信号焊盘和沿预定方向交替布置的多个辅助焊盘;以及封装板，包括多个信号键合指，多个第一电源电压键合指，以及多个第二电源电压接合指。信号焊盘通过第一线分别连接到信号键指。第一电源电压键指和第二电源电压键合指通过第二线分别连接到辅助焊盘。第一导线设置在连接到第一电源电压接合指的第二配线和连接到第二电源电压接合指的第二配线之间。

6. 发明申请

US20130307582A1 SEMICONDUCTOR DEVICE 有权
标题翻译：半导体器件
公开(公告)号：US20130307582A1
公开(公告)日：2013-11-21
申请号：US13512465
申请日：2012-05-16
申请人： Yasuhiro Ikeda , Yutaka Uematsu , Satoshi Muraoka
发明人： Yasuhiro Ikeda , Yutaka Uematsu , Satoshi Muraoka
IPC分类号： H03K17/16
CPC分类号： G11C7/10 , G11C7/1057 , G11C7/1084
摘要： To suppress power consumption and enhance signal quality as compared with the case where first and second semiconductor elements are terminated only by on-chip input termination resistor circuits. A first semiconductor element with a switching function and a second semiconductor element with a switching function are connected to each other with a substrate interconnection, and a resistor element is connected in parallel with the substrate interconnection. The resistor element is placed at an arbitrary position or a branch point on the signal interconnection.
摘要翻译：与第一和第二半导体元件仅由片上输入终端电阻电路端接的情况相比，抑制功耗和提高信号质量。具有开关功能的第一半导体元件和具有开关功能的第二半导体元件通过衬底互连彼此连接，并且电阻元件与衬底互连并联连接。电阻元件放置在信号互连的任意位置或分支点处。

7. 发明申请

US20130112390A1 VEHICLE HEATING AND AIR CONDITIONING SYSTEM 有权
标题翻译：车辆加热和空调系统
公开(公告)号：US20130112390A1
公开(公告)日：2013-05-09
申请号：US13810673
申请日：2011-08-01
申请人： Fujio Arai , Yutaka Uematsu , Takayoshi Matsuoka
发明人： Fujio Arai , Yutaka Uematsu , Takayoshi Matsuoka
IPC分类号： B60H1/00
CPC分类号： B60H1/00764 , B60H1/00771 , B60H1/00785 , B60H1/00849
摘要： A vehicle heating and air conditioning system basically includes an interior/exterior air introducing structure, a heating device, a driving end time acquiring section and an interior/exterior air switching control section. The interior/exterior air introducing structure switches the flow of cabin intake air between an interior air recirculation mode and an exterior air introducing mode. The heating device heats the cabin intake air being introduced by the interior/exterior air introducing structure. The driving end time acquiring section estimates a driving end time corresponding to a point in time at which driving of a vehicle is predicted to end. The interior/exterior air switching control section switches the interior/exterior air introducing structure from the exterior air introducing mode to the interior air recirculation mode during a period of time from a prescribed point in time until the driving end time to restrict windshield fogging while in the interior air recirculation mode.
摘要翻译：车辆加热和空调系统基本上包括内部/外部空气引入结构，加热装置，行驶结束时间获取部分和内部/外部空气切换控制部分。内部/外部空气引入结构在室内空气再循环模式和外部空气引入模式之间切换机舱进气的流动。加热装置加热由内部/外部空气引入结构引入的舱室进气。驾驶结束时间获取部估计对应于预测车辆行驶结束的时间点的驾驶结束时间。内/外部空气切换控制部分在内部/外部空气引入结构从外部空气引入模式切换到内部空气再循环模式期间，从规定的时间点到驱动结束时间，以限制挡风玻璃起雾，同时在内部空气再循环模式。

8. 发明申请

US20120262885A1 SIGNAL TRANSFER CIRCUIT 审中-公开
标题翻译：信号传输电路
公开(公告)号：US20120262885A1
公开(公告)日：2012-10-18
申请号：US13358540
申请日：2012-01-26
申请人： Yasuhiro IKEDA , Yutaka Uematsu , Satoshi Muraoka
发明人： Yasuhiro IKEDA , Yutaka Uematsu , Satoshi Muraoka
IPC分类号： H05K1/18
CPC分类号： H05K1/0243 , H05K1/0251 , H05K1/115 , H05K2201/09227 , H05K2201/09772 , H05K2201/10545 , H05K2201/10689
摘要： Provided is a signal transfer circuit which uses a low cost circuit board with a high packing density but is capable of reducing a crosstalk noise between signal lines and also reducing a reflection noise due to a stub. A signal transfer circuit of the present invention is configured such that lead terminals of electronic components and through-hole vias are connected to each other by surface wirings, respectively, to allow no branching from the middle of the through-hole vias. Further, first wirings connecting a first electronic component are each arranged between a corresponding pair of second wirings connecting a second electronic component, and signals are transmitted through the first wirings and the second wirings by interleaved transmission.
摘要翻译：提供了一种使用具有高包装密度的低成本电路板的信号传输电路，但是能够减少信号线之间的串扰噪声并且还减少由于短截线引起的反射噪声。本发明的信号传输电路被配置为使得电子部件和通孔过孔的引线端子分别通过表面布线彼此连接，以便不允许从通孔过孔的中间分支。此外，连接第一电子部件的第一布线分别布置在连接第二电子部件的相应的一对第二布线之间，并且信号通过交错传输通过第一布线和第二布线传输。

9. 发明授权

US07319267B2 Semiconductor device 失效
标题翻译：半导体器件
公开(公告)号：US07319267B2
公开(公告)日：2008-01-15
申请号：US11712440
申请日：2007-03-01
申请人： Yutaka Uematsu , Hideki Osaka , Yoji Nishio , Yukitoshi Hirose
发明人： Yutaka Uematsu , Hideki Osaka , Yoji Nishio , Yukitoshi Hirose
IPC分类号： H01L23/02 , H01L23/34
CPC分类号： H01L23/642 , H01L23/5223 , H01L23/5228 , H01L23/5286 , H01L23/647 , H01L25/105 , H01L2224/73204 , H01L2924/19105 , H01L2924/3011
摘要： In a prior art, there has been a method in which a power supply line of an output buffer and that of a control circuit are independently provided so that the power supply noise occurring in the control circuit will not affect the output buffer. However, this method has had the problems that it increases both the number of power supply/grounding pins and power feed line inductance.The present invention provides a technique which, without causing the above two problems, i.e., (1) increased number of power supply/grounding pins and (2) increased power feed line inductance, prevents the noise causing a problem in a control circuit, from becoming routed around and induced into an output buffer. More specifically, the above can be realized by using either of two methods: (A) providing an on-chip bypass capacitor for the control circuit and isolating a power feed route of the control circuit from that of the output buffer in an AC-like manner, or (B) designing electrical parameters (inserting resistors) such that the oscillation mode of any electrical parameter noise induced into the power feed routes will change to overdamping.
摘要翻译：在现有技术中，存在一种方法，其中独立地提供输出缓冲器的电源线和控制电路的电源线，使得控制电路中出现的电源噪声不会影响输出缓冲器。然而，该方法存在增加电源/接地引脚数和馈电线电感的问题。本发明提供一种技术，其不会引起上述两个问题，即（1）增加电源/接地引脚数量和（2）增加的馈电线电感，防止在控制电路中引起问题的噪声变成路由并感应到输出缓冲区。更具体地，可以通过以下两种方法之一来实现上述：（A）为控制电路提供片上旁路电容器，并将控制电路的馈电路径与AC类似的输出缓冲器的馈电路径隔离方式或（B）设计电参数（插入电阻），使得引入馈电路径的任何电参数噪声的振荡模式将变为过阻尼。

10. 发明授权

US07168242B2 NOx catalyst regeneration method for NOx purifying system and NOx purifying system 有权
标题翻译： NOx净化系统和NOx净化系统的NOx催化剂再生方法
公开(公告)号：US07168242B2
公开(公告)日：2007-01-30
申请号：US10774490
申请日：2004-02-10
申请人： Yutaka Uematsu , Jin Yokoyama
发明人： Yutaka Uematsu , Jin Yokoyama
IPC分类号： F01N3/00
CPC分类号： F02D41/0275 , B01D53/9495 , F02D2200/0802
摘要： This is a method for regenerating the NOx catalyst in a NOx purifying system provided in the exhaust passage with a direct reduction type NOx catalyst which directly decomposes the NOx during lean-condition operation and is regenerated at rich-condition operation, and the method prohibiting the rich-condition control when the temperature detected by a catalyst temperature detecting means is within the predetermined temperature range.Thus, when the exhaust gas are temporarily made rich-condition for catalyst regeneration which means recovering the NOx purifying ability of the direct reduction type NOx catalyst arranged in the exhaust passage of the engine, the NOx is prohibited from being discharged into the atmospheric air, and also the purifying ability can surely be recovered.
摘要翻译：这是在排气通路内设置的NOx净化系统中，使用直接还原型NOx催化剂再生NO x催化剂的方法，所述直接还原型NOx催化剂在稀薄状态运行中直接分解NOx并在富氧运行时再生，并且该方法禁止当由催化剂温度检测装置检测到的温度在预定温度范围内时，进行浓缩状态控制。因此，当废气临时处于催化剂再生的浓缩状态时，这意味着回收排放在发动机排气通道中的直接还原型NOx催化剂的NOx净化能力，可以禁止NOx排入大气中，净化能力也可以肯定地恢复。

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