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    • 5. 发明授权
    • Connecting apparatus
    • 连接装置
    • US5017738A
    • 1991-05-21
    • US483170
    • 1990-02-22
    • Hiroki TsujiKyoichiro KawanoTeruo Murase
    • Hiroki TsujiKyoichiro KawanoTeruo Murase
    • H01R4/02H05K3/24H05K3/34H05K3/36H05K3/40
    • H05K3/244H01R4/02H05K3/3463H05K2201/0116H05K2201/0373H05K2201/2036H05K2203/0723H05K3/3431H05K3/36H05K3/4007Y10T428/12681
    • A connecting apparatus wherein a porous silver plating layers are provided on surface pads of a printed circuit board and on a surface of a contact provided on the pads of a mother board. The plating layers are respectively impregnated with tin-zinc alloy and gallium. The electrical connection is established between the pads of the printed circuit board and the pads of the mother board through a liquid alloy by placing the plating layers in contact with each other. For the first printed circuit board having the pads and spacer, the gallium particles are adhered to the pads, while solder is temporarily adhered to the spacer. For the second printed circuit board having the pads and the connecting pads, tin or indium layer is provided on the surface of the pads, then the spacer of the first printed circuit board is positioned and fixed to the connecting pad of the second printed circuit board. Thus, electrical connection can be formed by way of the contact of gallium-tin or gallium-indium liquid alloy between the pads of both the printed circuit boards.
    • 一种连接装置,其中在印刷电路板的表面焊盘上和设置在母板的焊盘上的触点的表面上提供多孔银镀层。 镀层分别浸渍有锡 - 锌合金和镓。 通过使电镀层彼此接触,通过液体合金在印刷电路板的焊盘和母板的焊盘之间建立电连接。 对于具有焊盘和间隔物的第一印刷电路板,镓颗粒粘附到焊盘,而焊料暂时粘附到间隔件上。 对于具有焊盘和连接焊盘的第二印刷电路板,在焊盘的表面上设置锡或铟层,然后将第一印刷电路板的间隔件定位并固定到第二印刷电路板的连接焊盘 。 因此,可以通过在两个印刷电路板的焊盘之间接合镓锡或镓铟液体合金来形成电连接。