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1. 发明授权

US5496971A Circuit arrangement for multilayer printed circuit board 失效
标题翻译：多层印刷电路板的电路布置
公开(公告)号：US5496971A
公开(公告)日：1996-03-05
申请号：US297419
申请日：1994-08-29
申请人： Kiyokazu Moriizumi , Mikio Nishihara
发明人： Kiyokazu Moriizumi , Mikio Nishihara
IPC分类号： H05K1/11 , H01L23/538 , H05K1/00 , H05K1/02 , H05K3/46
CPC分类号： H01L23/5386 , H05K1/0289 , H01L2924/0002 , H05K2201/10689
摘要： In a circuit arrangement for a multilayer printed circuit board, a first circuit layer is formed on a substrate, and comprises a dielectric layer having a circuit pattern formed thereon. A second circuit layer is further formed on the first circuit layer, and comprises a dielectric layer having a circuit pattern formed thereon. The first circuit pattern includes conductive segments having only an X-directional component, and the second circuit pattern includes conductive segments having only an Y-directional component perpendicular to the X-directional component. Electric connections between the X-directional segments and the Y-directional segments are suitably established by vias provided in the second layer. The first circuit pattern further includes slant conductive segments having both the X- and Y-directional components and arranged in a blank zone not occupied by the X-directional segments, and the second circuit pattern further includes slant conductive segments having both the X- and Y-directional components and arranged in a blank zone not occupied by the Y-directional segments. Electric connections between the slant segments of the first pattern and the slant segments of the second pattern are suitably established by vias provided in the second layer.
摘要翻译：在多层印刷电路板的电路装置中，在基板上形成第一电路层，并且包括其上形成有电路图案的电介质层。第二电路层还形成在第一电路层上，并且包括其上形成有电路图案的电介质层。第一电路图案包括仅具有X方向分量的导电段，并且第二电路图案包括仅具有垂直于X方向分量的Y方向分量的导电段。 X方向段和Y方向段之间的电连接通过设置在第二层中的通孔适当地建立。第一电路图案还包括具有X方向和Y方向分量两者并且布置在未被X方向段占据的空白区域中的倾斜导电段，并且第二电路图案还包括倾斜的导电段，其具有X和 Y方向组件并且布置在未被Y方向段占据的空白区域中。第一图案的倾斜段与第二图案的倾斜段之间的电连接通过设置在第二层中的通孔适当地建立。

2. 发明授权

US5354209A Connector and method of assembling the same 失效
标题翻译：连接器及其组装方法
公开(公告)号：US5354209A
公开(公告)日：1994-10-11
申请号：US98852
申请日：1993-07-29
申请人： Akira Tamura , Hidehisa Sakai , Mikio Nishihara , Kyoichiro Kawano
发明人： Akira Tamura , Hidehisa Sakai , Mikio Nishihara , Kyoichiro Kawano
IPC分类号： H01R13/193 , H01R13/41 , H01R24/00 , H01R33/76 , H01R43/16 , H01R43/20
CPC分类号： H01R13/41 , H01R13/193 , H01R43/20 , H01R43/16 , Y10T29/49217 , Y10T29/49218 , Y10T29/4979
摘要： A contact pin includes: a pin terminal secured to a stationary base art by press-fitting a press-fitted part into the stationary base part, the pin terminal projecting from the stationary base part and being joined to the board; a contact part inserted into a contact pin through-hole of a movable lock part so that a plug pin terminal is fitted into the contact part; and an auxiliary plate 6 reinforcing the press-fitted part, engaged with the movable lock part and transmitting a force caused by a movement of the movable lock part to the press-fitted part. A connector constructed in the described manner includes a plurality of above-mentioned contact pins.
摘要翻译：接触销包括：通过将压配合部压入固定基部而固定在固定基座上的销端子，该销端子从固定基部突出并与板接合; 插入到可动锁定部的接触销通孔中的接触部，使得插销端子嵌入到接触部中; 以及辅助板6，其加强压配合部分，与可移动的锁定部分接合并且将由可移动的锁定部件的运动引起的力传递到压配部件。以所述方式构造的连接器包括多个上述接触销。

3. 发明授权

US4785141A Wiring structure of termination circuit 失效
标题翻译：端接电路接线结构
公开(公告)号：US4785141A
公开(公告)日：1988-11-15
申请号：US124418
申请日：1987-11-18
申请人： Mikio Nishihara , Kiyoshi Kuwabara
发明人： Mikio Nishihara , Kiyoshi Kuwabara
IPC分类号： H05K1/02 , H01L23/538 , H05K1/11 , H05K3/46
CPC分类号： H01L23/5383 , H05K1/112 , H01L2924/0002 , H01L2924/15192 , H01L2924/3011 , H05K1/115 , H05K2201/09227 , H05K2201/09627 , H05K2201/10522 , H05K2201/10689 , H05K3/4623
摘要： A wiring structure for a termination circuit in which a termination circuit is connected to an integrated circuit through a fixed wiring pattern provided in a leadout layer closest to the mounting surface.
摘要翻译：一种用于终端电路的布线结构，其中终端电路通过设置在最靠近安装表面的引出层中的固定布线图案连接到集成电路。

4. 发明授权

US4692843A Multilayer printed wiring board 失效
标题翻译：多层印刷线路板
公开(公告)号：US4692843A
公开(公告)日：1987-09-08
申请号：US929819
申请日：1986-11-13
申请人： Masaru Matsumoto , Mikio Nishihara , Kiyoshi Kuwabara
发明人： Masaru Matsumoto , Mikio Nishihara , Kiyoshi Kuwabara
IPC分类号： H05K3/46 , H05K1/14
CPC分类号： H05K3/462 , H05K1/0272 , H05K2201/09536 , H05K2201/096 , H05K2201/1025 , H05K2201/2036 , H05K3/4623 , H05K3/4647
摘要： A multilayer printed wiring board having an air gap between neighboring printed wiring boards of the multilayer printed wiring board by inserting plated spacers to both end faces of through-hole pads which are provided to each printed wiring board so that each through-hole pad opposes to another through-hole pad on the neighboring printed wiring board. The spacers opposed to each other are joined together by solder, and each spacer has an end surface having a size being smaller than a size of the end surface of each through-hole pad to provide a drop part at the joint part of the spacers, so that melted solder stays at the drop part not flowing toward the board through the side surface of the through-hole pad when the printed wiring boards are integrated to the multilayer printed wiring board under pressure and high temperature.
摘要翻译：一种多层印刷线路板，其通过将设置在每个印刷线路板上的通孔焊盘的两个端面插入电镀间隔件，使得每个通孔焊盘与所述多层印刷线路板的相邻的印刷线路板之间具有气隙，相邻印刷电路板上的另一个通孔焊盘。彼此相对的间隔件通过焊料接合在一起，并且每个间隔件具有尺寸小于每个通孔焊盘的端面的尺寸的端面，以在间隔件的接合部分处提供液滴部分，使得当印刷线路板在压力和高温下与多层印刷线路板集成在一起时，熔融的焊料停留在通过通孔焊盘的侧表面而不流向板的液滴部分。

5. 发明授权

US5475922A Method of assembling a connector using frangible contact parts 失效
标题翻译：使用易碎接触部件组装连接器的方法
公开(公告)号：US5475922A
公开(公告)日：1995-12-19
申请号：US306474
申请日：1994-09-15
申请人： Akira Tamura , Hidehisa Sakai , Mikio Nishihara , Kyoichiro Kawano
发明人： Akira Tamura , Hidehisa Sakai , Mikio Nishihara , Kyoichiro Kawano
IPC分类号： H01R13/193 , H01R13/41 , H01R24/00 , H01R33/76 , H01R43/16 , H01R43/20
CPC分类号： H01R13/41 , H01R13/193 , H01R43/20 , H01R43/16 , Y10T29/49217 , Y10T29/49218 , Y10T29/4979
摘要： A contact pin includes: a pin terminal secured to a stationary base art by press-fitting a press-fitted part into the stationary base part, the pin terminal projecting from the stationary base part and being joined to the board; a contact part inserted into a contact pin through-hole of a movable lock part so that a plug pin terminal is fitted into the contact part; and an auxiliary plate 6 reinforcing the press-fitted part, engaged with the movable lock part and transmitting a force caused by a movement of the movable lock part to the press-fitted part. A connector constructed in the described manner includes a plurality of above-mentioned contact pins.
摘要翻译：接触销包括：通过将压配合部压入固定基部而固定在固定基座上的销端子，该销端子从固定基部突出并与板接合; 插入到可动锁定部的接触销通孔中的接触部，使得插销端子嵌入到接触部中; 以及辅助板6，其加强压配合部分，与可移动的锁定部分接合并且将由可移动的锁定部件的运动引起的力传递到压配部件。以所述方式构造的连接器包括多个上述接触销。

6. 发明授权

US4159508A Multilayer printed wiring board 失效
标题翻译：多层印刷线路板
公开(公告)号：US4159508A
公开(公告)日：1979-06-26
申请号：US750818
申请日：1976-12-15
申请人： Masahiro Oda , Mikio Nishihara
发明人： Masahiro Oda , Mikio Nishihara
IPC分类号： H01R12/51 , H05K1/00 , H05K1/11 , H05K3/22 , H05K3/42 , H05K1/04
CPC分类号： H05K1/115 , H05K1/0292 , H05K1/0298 , H05K1/112 , H05K2201/09627 , H05K2203/0455 , H05K2203/175 , H05K3/429
摘要： This application discloses a multilayer printed wiring board having a plurality of pattern layers. Said printed wiring board has at least one pair of plated through holes, i.e. a first and a second plated through hole. The first plated through hole is directly connected to said patterns. The second plated through hole is not directly connected to said patterns. An electronic element terminal is connected to said second plated through hole. The first and second plated through holes are electrically connected to each other on a surface opposite an element mounting surface of the printed wiring board.
摘要翻译：本申请公开了具有多个图案层的多层印刷线路板。所述印刷线路板具有至少一对电镀通孔，即第一和第二电镀通孔。第一电镀通孔直接连接到所述图案。第二电镀通孔不直接连接到所述图案。电子元件端子连接到所述第二电镀通孔。第一和第二电镀通孔在与印刷线路板的元件安装表面相对的表面上彼此电连接。

7. 发明授权

US06485814B1 High density thin film circuit board and method of production thereof 失效
标题翻译：高密度薄膜电路板及其制造方法
公开(公告)号：US06485814B1
公开(公告)日：2002-11-26
申请号：US09513162
申请日：2000-02-25
申请人： Kiyokazu Moriizumi , Mikio Nishihara
发明人： Kiyokazu Moriizumi , Mikio Nishihara
IPC分类号： B32B300
CPC分类号： H01L23/49811 , H01L2224/1147 , H01L2224/16225 , H01L2224/16237 , H01L2224/73253 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/15311 , H01L2924/15312 , H01L2924/16152 , H05K1/0306 , H05K3/4038 , H05K3/4605 , H05K3/467 , H05K2201/0154 , H05K2201/0305 , H05K2201/09472 , H05K2201/09509 , H05K2201/10318 , H05K2203/1581 , Y10T428/24926 , H01L2224/0401
摘要： To provide electrical conduction between front and back surfaces of a thin film multi-layered circuit board, such as an MCM, at low cost without using a simultaneous firing process for ceramic. The thin film multi-layered circuit board has at least one thin film circuit layer on a first surface of a substrate, wherein a conductor layer is disposed in the lowermost layer of the thin film circuit layer in contact with the first surface of the substrate, and is characterized in that holes for providing the electrical conduction between front and back surfaces of the substrate are formed through the substrate from the first surface to a second surface thereof so that the conductor layer is exposed in the hole, wherein the diameter of the hole is gradually enlarged from the first surface to the second surface.
摘要翻译：以低成本提供薄膜多层电路板（例如MCM）的前后表面之间的导电，而不需要使用陶瓷的同时烧制工艺。薄膜多层电路板在基板的第一表面上具有至少一个薄膜电路层，其中导体层设置在与基板的第一表面接触的薄膜电路层的最下层中，并且其特征在于，通过基板从基板的第一表面到第二表面形成用于提供基板的前表面和后表面之间的导电的孔，使得导体层暴露在孔中，其中孔的直径从第一表面逐渐增大到第二表面。

8. 发明授权

US5181317A Method of making an engineering change to a printed wiring board 失效
标题翻译：对印刷电路板进行工程变更的方法
公开(公告)号：US5181317A
公开(公告)日：1993-01-26
申请号：US766244
申请日：1991-09-27
申请人： Mikio Nishihara , Teruo Murase , Kiyotaka Seyama , Kiyoshi Kuwabara , Osamu Ohshima
发明人： Mikio Nishihara , Teruo Murase , Kiyotaka Seyama , Kiyoshi Kuwabara , Osamu Ohshima
IPC分类号： H05K7/06 , H01L21/48 , H05K1/11 , H05K3/22 , H05K3/40 , H05K3/46
CPC分类号： H01L21/485 , H01L21/4853 , H05K3/225 , H05K1/111 , H05K2201/10287 , H05K2201/10704 , H05K3/4015 , Y10T29/49144 , Y10T29/49716 , Y10T29/4981
摘要： A method of making an engineering change to a printed wiring board changes connection for a terminal of an electronic component which is mounted on the printed wiring board through a terminal pad. The terminal is electrically connected to a destination through the terminal pad and wiring within the printed wiring board. The present invention places an insulator, including an insulating material and a conductive layer formed thereon, between the terminal and the terminal pad. The electronic component is mounted on the printed wiring board and the terminal is electrically connected to the conductive layer. A discrete wire is placed between the conductive layer and the destination.
摘要翻译：对印刷电路板进行工程变更的方法通过端子焊盘改变安装在印刷电路板上的电子部件的端子的连接。端子通过端子焊盘电连接到目的地和印刷线路板内的布线。本发明在端子和终端焊盘之间设置绝缘体，包括绝缘材料和形成在其上的导电层。电子部件安装在印刷线路板上，并且端子电连接到导电层。分立导线放置在导电层和目的地之间。

9. 发明授权

US4675789A High density multilayer printed circuit board 失效
标题翻译：高密度多层印刷电路板
公开(公告)号：US4675789A
公开(公告)日：1987-06-23
申请号：US811355
申请日：1985-12-20
申请人： Kiyoshi Kuwabara , Mikio Nishihara , Kazuhisa Tsunoi
发明人： Kiyoshi Kuwabara , Mikio Nishihara , Kazuhisa Tsunoi
IPC分类号： H05K3/46 , H05K1/11 , H05K3/42 , H05K1/14
CPC分类号： H05K1/116 , H05K2201/09327 , H05K2201/09454 , H05K3/429
摘要： A high density multilayer printed circuit board comprising generally parallel signal layers, electric source layers, and ground layers, with insulating layers arranged between the signal layers and the electric source layers, between the electric source layers and the ground layers, and between the ground layers and the signal layers respectively. Conductor portions are formed in through holes which are opened in a direction transverse to the signal layers, electric source layers, and ground layers. The conductor portions are electrically connected to the signal layers and/or the electric source layers, and/or the ground layers, through the lands thereof, the connections of the lands being substantially equally distributed among the conductor portions.
摘要翻译：一种高密度多层印刷电路板，包括大致平行的信号层，电源层和接地层，绝缘层布置在信号层和电源层之间，电源层和接地层之间，以及接地层之间和信号层。导体部分形成在与信号层，电源层和接地层横向的方向上开放的通孔中。导体部分通过其平台与信号层和/或电源层和/或接地层电连接，焊盘的连接基本上均匀分布在导体部分之间。

10. 发明授权

US4298770A Printed board 失效
标题翻译：印刷板
公开(公告)号：US4298770A
公开(公告)日：1981-11-03
申请号：US69346
申请日：1979-08-24
申请人： Mikio Nishihara , Masahiro Oda , Takamitsu Tsuchimoto
发明人： Mikio Nishihara , Masahiro Oda , Takamitsu Tsuchimoto
IPC分类号： H05K1/02 , H05K1/00 , H05K1/11 , H05K3/42 , H05K3/46
CPC分类号： H05K1/116 , H05K1/0289 , H05K2201/09381 , H05K2201/09609 , H05K3/429
摘要： A printed board comprising a plurality of through holes formed therein and located on intersecting points of an X-Y orthogonal basic grid, and an oblique conductor pattern, wherein conductors are formed along channels arranged in accordance with a principle that one conductor passes between adjacent grid points arranged in the X direction, while two or more conductors pass between adjacent grid points arranged in the Y direction, and each conductor obliquely extends in a zigzag line without contacting the grid points. Such conductor pattern ensures a high density and minimum length of wiring.
摘要翻译：一种印刷电路板，包括形成在其中并位于XY正交基本栅极的交叉点上的多个通孔和倾斜导体图案，其中导体沿着沿着布置的通道形成，该导体根据一个导体在相邻的格栅点之间通过的原理布置在X方向上，当两个或多个导体在沿Y方向布置的相邻栅格点之间通过时，并且每个导体以Z字形线倾斜地延伸而不接触网格点。这种导体图形确保了高密度和最小布线长度。

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