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1. 发明申请

US20120236076A1 PRINTHEADS AND METHOD FOR ASSEMBLING PRINTHEADS 有权
标题翻译：用于组装原理的标题和方法
公开(公告)号：US20120236076A1
公开(公告)日：2012-09-20
申请号：US13046845
申请日：2011-03-14
申请人： Michael J. Dixon , Jiandong Fang , Richard Earl Corley, JR. , Jeanne Marie Saldanha Singh , Frank E. Anderson , Xiaoming Wu
发明人： Michael J. Dixon , Jiandong Fang , Richard Earl Corley, JR. , Jeanne Marie Saldanha Singh , Frank E. Anderson , Xiaoming Wu
IPC分类号： B41J2/145 , B23P17/00
CPC分类号： B41J2/1628 , B41J2/1603 , B41J2/1623 , B41J2/1629 , B41J2/1631 , B41J2/1642
摘要： Disclosed is a printhead for a printer that includes a plurality of ejection chip units. Each ejection chip unit of the plurality of ejection chip units is configured to eject at least one fluid. The printhead further includes a plurality of supporting units. Each supporting unit of the plurality of supporting units is fluidly coupled with a corresponding ejection chip unit. The each supporting unit includes a plurality of trenches adapted to receive an adhesive to facilitate attachment of the each supporting unit with the corresponding ejection chip unit. Furthermore, the printhead includes a base unit fluidly coupled with the each supporting unit of the plurality of supporting units. The base unit is adapted to provide the at least one fluid to the each ejection chip unit through a corresponding to supporting unit. Further disclosed is a method for assembling the printhead.
摘要翻译：公开了一种用于打印机的打印头，其包括多个排出芯片单元。多个排出芯片单元中的每个排出芯片单元构造成喷射至少一种流体。打印头还包括多个支撑单元。多个支撑单元的每个支撑单元与相应的排出芯片单元流体耦合。每个支撑单元包括适于接收粘合剂以便于将各个支撑单元与相应的排出芯片单元相连接的多个沟槽。此外，打印头包括与多个支撑单元中的每个支撑单元流体耦合的基座单元。基座单元适于通过对应的支撑单元将至少一个流体提供给每个排出芯片单元。另外公开了一种组装打印头的方法。

2. 发明授权

US08636340B2 Printheads and method for assembling printheads 有权
标题翻译：打印头和组装打印头的方法
公开(公告)号：US08636340B2
公开(公告)日：2014-01-28
申请号：US13046845
申请日：2011-03-14
申请人： Michael J. Dixon , Jiandong Fang , Richard Earl Corley, Jr. , Jeanne Marie Saldanha Singh , Frank E. Anderson , Xiaoming Wu
发明人： Michael J. Dixon , Jiandong Fang , Richard Earl Corley, Jr. , Jeanne Marie Saldanha Singh , Frank E. Anderson , Xiaoming Wu
IPC分类号： B41J2/25
CPC分类号： B41J2/1628 , B41J2/1603 , B41J2/1623 , B41J2/1629 , B41J2/1631 , B41J2/1642
摘要： Disclosed is a printhead for a printer that includes a plurality of ejection chip units. Each ejection chip unit of the plurality of ejection chip units is configured to eject at least one fluid. The printhead further includes a plurality of supporting units. Each supporting unit of the plurality of supporting units is fluidly coupled with a corresponding ejection chip unit. The each supporting unit includes a plurality of trenches adapted to receive an adhesive to facilitate attachment of the each supporting unit with the corresponding ejection chip unit. Furthermore, the printhead includes a base unit fluidly coupled with the each supporting unit of the plurality of supporting units. The base unit is adapted to provide the at least one fluid to the each ejection chip unit through a corresponding to supporting unit. Further disclosed is a method for assembling the printhead.
摘要翻译：公开了一种用于打印机的打印头，其包括多个排出芯片单元。多个排出芯片单元中的每个排出芯片单元构造成喷射至少一种流体。打印头还包括多个支撑单元。多个支撑单元的每个支撑单元与相应的排出芯片单元流体耦合。每个支撑单元包括适于接收粘合剂以便于将各个支撑单元与相应的排出芯片单元相连接的多个沟槽。此外，打印头包括与多个支撑单元中的每个支撑单元流体耦合的基座单元。基座单元适于通过对应的支撑单元将至少一个流体提供给每个排出芯片单元。另外公开了一种组装打印头的方法。

3. 发明申请

US20110318882A1 METHOD OF RESTRICTING CHIP MOVEMENT UPON BONDING TO RIGID SUBSTRATE USING SPRAY COATABLE ADHESIVE 审中-公开
标题翻译：使用喷涂粘合剂粘合到刚性基板上的芯片运动限制方法
公开(公告)号：US20110318882A1
公开(公告)日：2011-12-29
申请号：US13168219
申请日：2011-06-24
申请人： Xiaoming Wu , Paul Dryer , David Rhine , Anne Pearson , Jeanne Marie Saldanha Singh , Richard Wells , Joel Provence
发明人： Xiaoming Wu , Paul Dryer , David Rhine , Anne Pearson , Jeanne Marie Saldanha Singh , Richard Wells , Joel Provence
IPC分类号： H01L21/50
CPC分类号： B41J2/1601 , B41J2/1623 , B41J2/1628 , B41J2/1645
摘要： A method of bonding a chip to a wafer at precise alignment suitable for fabricating a heater chip in an ink jet printhead is provided. The method includes spray coating an adhesive composition on a surface of a substrate, aligning and tacking at least one chip to the substrate coated with the adhesive composition, exposing the substrate tacked with at least one chip coated with the adhesive composition to radiation and heat, and performing thermal compression bonding. The method uses a spray coatable adhesive composition comprising a thermally activated adhesive and a photoacid generator.
摘要翻译：提供了一种以适合于在喷墨打印头中制造加热器芯片的精确对准将芯片结合到晶片的方法。该方法包括将粘合剂组合物喷涂在基材的表面上，将至少一个芯片对准并固定到涂覆有粘合剂组合物的基材上，将涂覆有至少一个涂有粘合剂组合物的芯片的基材暴露于辐射和加热，并进行热压接。该方法使用包含热活化粘合剂和光致酸产生剂的喷涂可涂层粘合剂组合物。

4. 发明授权

US08785524B2 Spray coatable adhesive for bonding silicon dies to rigid substrates 有权
标题翻译：用于将硅模具粘合到刚性基材上的喷涂可涂层粘合剂
公开(公告)号：US08785524B2
公开(公告)日：2014-07-22
申请号：US13168063
申请日：2011-06-24
申请人： Xiaoming Wu , Paul Dryer , David Rhine , Anna Pearson , Jeanne Marie Saldanha Singh , Richard Wells , Joel Provence
发明人： Xiaoming Wu , Paul Dryer , David Rhine , Anna Pearson , Jeanne Marie Saldanha Singh , Richard Wells , Joel Provence
IPC分类号： C08K5/06 , C08K5/07 , C08L63/02
CPC分类号： B41J2/1601 , B41J2/1623 , B41J2/1628 , B41J2/1645
摘要： A spray coatable adhesive composition used for bonding silicon dies to a rigid substrate, preferable a silicon substrate is disclosed. The adhesive composition includes an epoxy based resin, a thermal acid generator, a photoacid generator and a solvent. The epoxy based resin includes a mixture of a solid bisphenol A epoxy resin and a liquid or semi-liquid hydrogenated bisphenol A epoxy resin at a weight ratio ranging from about 80:20 to about 65:35. The adhesive composition has a low viscosity which allows it to be spray coated on a rigid substrate and form thin film adhesive which allows silicon dies to be bonded with precise placement on the silicon substrate.
摘要翻译：公开了一种用于将硅模具接合到刚性基板的喷涂可涂层粘合剂组合物，优选的是硅衬底。粘合剂组合物包括环氧树脂，热酸发生剂，光致酸产生剂和溶剂。环氧基树脂包括固体双酚A环氧树脂和液体或半液体氢化双酚A环氧树脂的混合物，其重量比为约80:20至约65:35。粘合剂组合物具有低粘度，其允许将其喷涂在刚性基材上并形成薄膜粘合剂，其允许将硅模具精确地放置在硅基材上。

5. 发明申请

US20110319513A1 SPRAY COATABLE ADHESIVE FOR BONDING SILICON DIES TO RIGID SUBSTRATES 有权
标题翻译：用于将硅胶粘结到刚性基材上的喷涂胶粘剂
公开(公告)号：US20110319513A1
公开(公告)日：2011-12-29
申请号：US13168063
申请日：2011-06-24
申请人： Xiaoming Wu , Paul Dryer , David Rhine , Anna Pearson , Jeanne Marie Saldanha Singh , Richard Wells , Joel Provence
发明人： Xiaoming Wu , Paul Dryer , David Rhine , Anna Pearson , Jeanne Marie Saldanha Singh , Richard Wells , Joel Provence
IPC分类号： C09J163/00
CPC分类号： B41J2/1601 , B41J2/1623 , B41J2/1628 , B41J2/1645
摘要： A spray coatable adhesive composition used for bonding silicon dies to a rigid substrate, preferable a silicon substrate is disclosed. The adhesive composition includes an epoxy based resin, a thermal acid generator, a photoacid generator and a solvent. The epoxy based resin includes a mixture of a solid bisphenol A epoxy resin and a liquid or semi-liquid hydrogenated bisphenol A epoxy resin at a weight ratio ranging from about 80:20 to about 65:35. The adhesive composition has a low viscosity which allows it to be spray coated on a rigid substrate and form thin film adhesive which allows silicon dies to be bonded with precise placement on the silicon substrate.
摘要翻译：公开了一种用于将硅模具接合到刚性基板的喷涂可涂层粘合剂组合物，优选的是硅衬底。粘合剂组合物包括环氧树脂，热酸发生剂，光致酸产生剂和溶剂。环氧基树脂包括固体双酚A环氧树脂和液体或半液体氢化双酚A环氧树脂的混合物，其重量比为约80:20至约65:35。粘合剂组合物具有低粘度，其允许将其喷涂在刚性基材上并形成薄膜粘合剂，其允许将硅模具精确地放置在硅基材上。

6. 发明申请

US20120293584A1 FLUID EJECTION DEVICES AND METHODS FOR FABRICATING FLUID EJECTION DEVICES 有权
标题翻译：流体喷射装置和用于制造流体喷射装置的方法
公开(公告)号：US20120293584A1
公开(公告)日：2012-11-22
申请号：US13112278
申请日：2011-05-20
申请人： Jiandong Fang , Xiaoming Wu
发明人： Jiandong Fang , Xiaoming Wu
IPC分类号： B41J2/135 , B05D3/10 , C23F1/02
CPC分类号： B41J2/1404 , B41J2/14145 , B41J2/1628 , B41J2/1629 , B41J2/1642 , B41J2/1645 , B41J2/1646
摘要： Disclosed is a fluid ejection device for an inkjet printer that includes a substrate having at least one fluid flow channel configured within a bottom portion of the substrate. Each fluid flow channel of the at least one fluid flow channel is configured by etching the bottom portion. The substrate also includes a plurality of fluid flow vias configured within a top portion of the substrate. Each fluid flow via of the plurality of fluid flow vias is configured by etching the top portion. The each fluid flow via is further configured to be in fluid communication with a corresponding fluid flow channel through an isotropically etched cavity configured below the each fluid flow via and fluidically coupled to the corresponding fluid flow channel. The fluid ejection device also includes a flow feature to layer and a nozzle plate. Further disclosed are methods for fabricating fluid ejection devices.
摘要翻译：公开了一种用于喷墨打印机的流体喷射装置，其包括具有构造在基板的底部内的至少一个流体流动通道的基板。通过蚀刻底部部分来配置至少一个流体流动通道的每个流体流动通道。衬底还包括配置在衬底的顶部部分内的多个流体流动通孔。通过蚀刻顶部部分来配置多个流体流动通孔的每个流体流通道。每个流体流动通道进一步构造成通过各向同性蚀刻的空腔与相应的流体流动通道流体连通，每个流体流动通道配置在每个流体流动下方并流体耦合到相应的流体流动通道。流体喷射装置还包括到层的流动特征和喷嘴板。进一步公开了制造流体喷射装置的方法。

7. 发明申请

US20120274707A1 EJECTION DEVICES FOR INKJET PRINTERS AND METHOD FOR FABRICATING EJECTION DEVICES 审中-公开
标题翻译：用于喷墨打印机的喷射装置和用于制造喷射装置的方法
公开(公告)号：US20120274707A1
公开(公告)日：2012-11-01
申请号：US13097594
申请日：2011-04-29
申请人： Xiaorong Cai , Jiandong Fang , Xiaoming Wu , Elaine Yeap Money , Eunki Hong , Yimin Guan , Burton Joyner, II , Sean Terrance Weaver , David Graham , Zach Reitmeier
发明人： Xiaorong Cai , Jiandong Fang , Xiaoming Wu , Elaine Yeap Money , Eunki Hong , Yimin Guan , Burton Joyner, II , Sean Terrance Weaver , David Graham , Zach Reitmeier
IPC分类号： B41J2/14 , B23P17/00
CPC分类号： B41J2/1628 , B41J2/14032 , B41J2/1603 , B41J2/1606 , B41J2/162 , B41J2/1629 , B41J2/1631 , B41J2/1639 , B41J2/164 , Y10T29/49401
摘要： Disclosed is an ejection device for an inkjet printer that includes an ejection chip having a substrate and at least one fluid ejecting element. The ejection device further includes a fluidic structure configured over the ejection chip. The fluidic structure includes a nozzle plate composed of an organic material and includes a plurality of nozzles. The fluidic structure further includes a flow feature layer configured in between the ejection chip and the nozzle plate. The flow feature layer is composed of an organic material and includes a plurality of flow features. Furthermore, the fluidic structure includes a liner layer encapsulating the nozzle plate. The liner layer further at least partially encapsulates each flow feature of the plurality of flow features. The liner layer is composed of an inorganic material. Further disclosed is a method for fabricating the ejection device.
摘要翻译：公开了一种喷墨打印机的喷射装置，其包括具有基板和至少一个流体喷射元件的喷射芯片。喷射装置还包括配置在喷射芯片上的流体结构。流体结构包括由有机材料构成并包括多个喷嘴的喷嘴板。流体结构还包括配置在喷射芯片和喷嘴板之间的流动特征层。流动特征层由有机材料组成并且包括多个流动特征。此外，流体结构包括封装喷嘴板的衬垫层。衬垫层还至少部分地封装多个流动特征的每个流动特征。衬层由无机材料构成。进一步公开了一种制造喷射装置的方法。

8. 发明授权

US08888242B2 Fluid ejection devices and methods for fabricating fluid ejection devices 有权
标题翻译：流体喷射装置和用于制造流体喷射装置的方法
公开(公告)号：US08888242B2
公开(公告)日：2014-11-18
申请号：US13112278
申请日：2011-05-20
申请人： Jiandong Fang , Xiaoming Wu
发明人： Jiandong Fang , Xiaoming Wu
IPC分类号： B41J2/135
CPC分类号： B41J2/1404 , B41J2/14145 , B41J2/1628 , B41J2/1629 , B41J2/1642 , B41J2/1645 , B41J2/1646
摘要： Disclosed is a fluid ejection device for an inkjet printer that includes a substrate having at least one fluid flow channel configured within a bottom portion of the substrate. Each fluid flow channel of the at least one fluid flow channel is configured by etching the bottom portion. The substrate also includes a plurality of fluid flow vias configured within a top portion of the substrate. Each fluid flow via of the plurality of fluid flow vias is configured by etching the top portion. The each fluid flow via is further configured to be in fluid communication with a corresponding fluid flow channel through an isotropically etched cavity configured below the each fluid flow via and fluidically coupled to the corresponding fluid flow channel. The fluid ejection device also includes a flow feature layer and a nozzle plate. Further disclosed are methods for fabricating fluid ejection devices.
摘要翻译：公开了一种用于喷墨打印机的流体喷射装置，其包括具有构造在基板的底部内的至少一个流体流动通道的基板。通过蚀刻底部部分来配置至少一个流体流动通道的每个流体流动通道。衬底还包括配置在衬底的顶部部分内的多个流体流动通孔。通过蚀刻顶部部分来配置多个流体流动通孔的每个流体流通道。每个流体流动通道进一步构造成通过各向同性蚀刻的空腔与相应的流体流动通道流体连通，每个流体流动通道配置在每个流体流动下方并流体耦合到相应的流体流动通道。流体喷射装置还包括流动特征层和喷嘴板。进一步公开了制造流体喷射装置的方法。

9. 发明授权

US09178683B2 Method and apparatus for parallel demodulation of high symbol rate data streams in a communications system 有权
标题翻译：用于在通信系统中并行解调高符号速率数据流的方法和装置
公开(公告)号：US09178683B2
公开(公告)日：2015-11-03
申请号：US13478744
申请日：2012-05-23
申请人： Krishnaraj Varma , Tony Huang , Xiaoming Wu
发明人： Krishnaraj Varma , Tony Huang , Xiaoming Wu
IPC分类号： H04L7/00 , H04L7/033 , H04L27/26
CPC分类号： H04L7/0008 , H04H40/90 , H04L7/0337 , H04L27/2337 , H04L27/2338 , H04L27/2647 , H04L2027/0067
摘要： A dynamic and flexible architecture and methods for demodulation of high data-rate streams with high symbol-rates, such as in satellite communications systems or computer network communications systems, is provided. A data stream of a data transmission is received, the data stream corresponding to a plurality of data symbols. A plurality of data samples corresponding to each of the data symbols is generated. Further, one or more representative data samples, corresponding each of the data symbols, are generated based at least in part on timing control signals and the generated data samples for the respective data symbol. The generated data samples corresponding to each of the data symbols other than the representative data samples are dropped. The timing control signals are then adjusted based at least in part on the generated representative data samples.
摘要翻译：提供了用于解调具有高符号速率的高数据速率流（如卫星通信系统或计算机网络通信系统）的动态和灵活的架构和方法。接收数据传输的数据流，对应于多个数据符号的数据流。产生与每个数据符号对应的多个数据样本。此外，至少部分地基于定时控制信号和用于各个数据符号的所生成的数据样本来产生对应于每个数据符号的一个或多个代表数据样本。与代表数据样本以外的数据符号相对应的生成数据样本被丢弃。至少部分地基于生成的代表数据样本来调整定时控制信号。

10. 发明申请

US20130315346A1 METHOD AND APPARATUS FOR PARALLEL DEMODULATION OF HIGH SYMBOL RATE DATA STREAMS IN A COMMUNICATIONS SYSTEM 有权
标题翻译：通信系统中高符号速率数据流并行解调的方法与装置
公开(公告)号：US20130315346A1
公开(公告)日：2013-11-28
申请号：US13478744
申请日：2012-05-23
申请人： Krishnaraj Varma , Tony Huang , Xiaoming Wu
发明人： Krishnaraj Varma , Tony Huang , Xiaoming Wu
IPC分类号： H04L27/00
CPC分类号： H04L7/0008 , H04H40/90 , H04L7/0337 , H04L27/2337 , H04L27/2338 , H04L27/2647 , H04L2027/0067
摘要： A dynamic and flexible architecture and methods for demodulation of high data-rate streams with high symbol-rates, such as in satellite communications systems or computer network communications systems, is provided. A data stream of a data transmission is received, the data stream corresponding to a plurality of data symbols. A plurality of data samples corresponding to each of the data symbols is generated. Further, one or more representative data samples, corresponding each of the data symbols, are generated based at least in part on timing control signals and the generated data samples for the respective data symbol. The generated data samples corresponding to each of the data symbols other than the representative data samples are dropped. The timing control signals are then adjusted based at least in part on the generated representative data samples.
摘要翻译：提供了用于解调具有高符号速率的高数据速率流（如卫星通信系统或计算机网络通信系统）的动态和灵活的架构和方法。接收数据传输的数据流，对应于多个数据符号的数据流。产生与每个数据符号对应的多个数据样本。此外，至少部分地基于定时控制信号和用于各个数据符号的所生成的数据样本来产生对应于每个数据符号的一个或多个代表数据样本。与代表数据样本以外的数据符号相对应的生成数据样本被丢弃。至少部分地基于生成的代表数据样本来调整定时控制信号。

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