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1. 发明授权

US4554184A Method for plating from an electroless plating bath 失效
标题翻译：从化学镀浴中镀覆的方法
公开(公告)号：US4554184A
公开(公告)日：1985-11-19
申请号：US626961
申请日：1984-07-02
申请人： Michael J. Canestaro , Ronald A. Kaschak , Donald G. McBride , Donald P. Seraphim
发明人： Michael J. Canestaro , Ronald A. Kaschak , Donald G. McBride , Donald P. Seraphim
IPC分类号： C23C18/16 , C23C18/31 , C23C18/34 , C23C18/40 , C23C18/44 , H05K3/18
CPC分类号： C23C18/1617 , C23C18/1676 , C23C18/168 , C23C18/405 , H05K3/187
摘要： A method for plating a metal from an electroless plating bath onto a substrate is provided which includes providing a source of an electroless plating bath at a non-plating temperature in a master mixing tank; transferring at least a portion of the plating bath to at least one plating cell, changing the bath temperature to a plating temperature, and contacting the substrate to be plated with the bath at a plating temperature.
摘要翻译：提供了一种从化学镀浴中将金属镀覆到基底上的方法，其包括在主混合槽中提供非电镀温度下的无电镀浴源; 将至少一部分电镀槽转移到至少一个电镀单元，将电镀温度改变为电镀温度，并在电镀温度下使待镀衬底与镀液接触。

2. 发明授权

US4707377A Copper plating 失效
标题翻译：镀铜
公开(公告)号：US4707377A
公开(公告)日：1987-11-17
申请号：US925511
申请日：1986-10-27
申请人： Robert J. Capwell , Ronald A. Kaschak , Donald G. McBride , Robert G. Rickert , Donald P. Seraphim
发明人： Robert J. Capwell , Ronald A. Kaschak , Donald G. McBride , Robert G. Rickert , Donald P. Seraphim
IPC分类号： C23C18/40 , H05K3/18
CPC分类号： C23C18/40 , H05K3/187
摘要： Copper is plated onto a substrate from an electroless plating bath having a mix potential relative to a saturated calomel electrode of about minus 630 to about minus 675 millivolts at a temperature of about 73.degree. C. The mix potential of the bath is monitored and adjusted during the plating to maintain it at about minus 630 to about minus 675 millivolts with respect to a calomel electrode at a temperature of about 73.degree. C. The number of of plating void defects is thereby reduced.
摘要翻译：在约73℃的温度下，将铜从具有相对于饱和甘汞电极的混合电位的化学镀浴镀在大约-630至大约-675毫伏之间的基底上。监测并调节浴的混合电位电镀使其在约73℃的温度下相对于甘汞电极保持在约减去630至约-675毫伏。由此减少了电镀空隙缺陷的数量。

3. 发明授权

US4855867A Full panel electronic packaging structure 失效
标题翻译：全面板电子封装结构
公开(公告)号：US4855867A
公开(公告)日：1989-08-08
申请号：US151382
申请日：1988-02-02
申请人： Charles E. Gazdik , Donald G. McBride , Donald P. Seraphim , Patrick A. Toole
发明人： Charles E. Gazdik , Donald G. McBride , Donald P. Seraphim , Patrick A. Toole
IPC分类号： H01L21/60 , H01L23/538 , H01L25/065
CPC分类号： H01L24/82 , H01L23/5387 , H01L24/24 , H01L25/0655 , H01L2224/24226 , H01L2924/01006 , H01L2924/01013 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/19041 , H01L2924/19043 , H01L2924/351
摘要： An electronic packaging structure, and a method of making this structure, are disclosed. The electronic packaging structure comprises a full panel, circuitized flexible film semiconductor chip carrier mounted on a circuitized substrate such as a printed circuit board. A plurality of semiconductor chips are mounted on the carrier in a selected pattern, and the carrier, with the chips, is mounted on a matching pattern of bonding sites on the circuitized substrate. Preferably, the circuitized flexible film semiconductor chip carrier is manufactured on a support structure used to facilitate handling of the circuitized flexible film and to facilitate heat transfer from the semiconductor chips mounted on the carrier to a heat sink which is part of the circuitized substrate. Also, the semiconductor chips mounted on the flexible film chip carrier may be tested, and burned in, while on the support structure before the chip carrier, with the chips, is mounted on the circuitized substrate.
摘要翻译：公开了一种电子封装结构及其制造方法。电子封装结构包括安装在诸如印刷电路板的电路化基板上的全面板，电路化的柔性膜半导体芯片载体。多个半导体芯片以所选择的图案安装在载体上，并且具有芯片的载体安装在电路化基板上的匹配图案上的结合位置。优选地，电路化柔性膜半导体芯片载体制造在用于便于处理电路化柔性膜的支撑结构上，并且促进从安装在载体上的半导体芯片到作为电路化基板的一部分的散热器的热传递。此外，安装在柔性膜芯片载体上的半导体芯片可以在芯片载体之前在芯片载体上被安装在电路化基板上的同时被测试和烧毁。

4. 发明授权

US4766670A Full panel electronic packaging structure and method of making same 失效
标题翻译：全面板电子封装结构及其制作方法
公开(公告)号：US4766670A
公开(公告)日：1988-08-30
申请号：US9981
申请日：1987-02-02
申请人： Charles E. Gazdik , Donald G. McBride , Donald P. Seraphim , Patrick A. Toole
发明人： Charles E. Gazdik , Donald G. McBride , Donald P. Seraphim , Patrick A. Toole
IPC分类号： H01L21/60 , H01L23/538 , H01L25/04 , H01L25/065 , H01L25/18 , H05K3/34
CPC分类号： H01L24/24 , H01L23/5387 , H01L24/82 , H01L25/0655 , H01L2224/2402 , H01L2224/24226 , H01L2924/01006 , H01L2924/01013 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/19041 , H01L2924/19043 , H01L2924/351 , Y10T29/49004 , Y10T29/49126 , Y10T29/49144
摘要： An electronic packaging structure, and a method of making this structure, are disclosed. The electronic packaging structure comprises a full panel, circuitized flexible film semiconductor chip carrier mounted on a circuitized substrate such as a printed circuit board. A plurality of semiconductor chips are mounted on the carrier in a selected pattern, and the carrier, with the chips, is mounted on a matching pattern of bonding sites on the circuitized substrate. Preferably, the circuitized flexible film semiconductor chip carrier is manufactured on a support structure used to facilitate handling of the circuitized flexible film and to facilitate heat transfer from the semiconductor chips mounted on a carrier to a heat sink which is part of the circuitized substrate. Also, the semiconductor chip mounted on the flexible film chip carrier may be tested, and burned in, while on the support structure before the chip carrier, with the chips, is mounted on the circuitized substrate.

5. 发明授权

US5427627A Method for treating substrates 失效
标题翻译：处理底物的方法
公开(公告)号：US5427627A
公开(公告)日：1995-06-27
申请号：US179653
申请日：1994-01-05
申请人： Michael J. Canestaro , Donald G. McBride , Louis J. Konrad, III , Ronald J. Moore
发明人： Michael J. Canestaro , Donald G. McBride , Louis J. Konrad, III , Ronald J. Moore
IPC分类号： C23F1/08 , B05C3/12 , B05C3/18 , B05C5/02 , C23G3/00 , H05K3/00 , H05K3/06 , H05K3/18 , H05K3/26 , H05K3/42 , B08B3/02
CPC分类号： B05C3/18 , B05C3/125 , H05K3/0085
摘要： A device for applying fluid to a substrate which includes a head member having first and second opposed portions adapted for being fixedly positioned relative to each other. The device is particularly suited for treating a substrate as the substrate moves between the first and second portions. Each portion may in turn include a first channel located at a predetermined distance from the substrate for having a first fluid impinge on the substrate at a first velocity. Additionally, each portion may include a weir adjacent the first channel for having fluid pass thereover at an accelerated rate and thus at a greater velocity than the first fluid, this weir being located at a lesser distance than the first channel. Fluid inlet means is coupled to the respective portions to provide the fluid thereto at desired velocities. Significantly, a fluid blocking means (e.g., an elongated bar) is also included as part of the structure for maintaining the fluids at pre-established levels.
摘要翻译：一种用于向衬底施加流体的装置，其包括具有适于相对于彼此固定定位的第一和第二相对部分的头部构件。当衬底在第一和第二部分之间移动时，该器件特别适用于处理衬底。每个部分还可以包括位于距衬底预定距离的第一通道，以使第一流体以第一速度冲击在衬底上。另外，每个部分可以包括邻近第一通道的堰，用于使流体以加速的速度传递到其上，因此以比第一流体更大的速度传递，该堰位于比第一通道更小的距离处。流体入口装置联接到相应的部分，以期望的速度向其提供流体。重要的是，还包括流体阻塞装置（例如，细长条）作为用于将流体保持在预先确定的水平的结构的一部分。

6. 发明授权

US4431685A Decreasing plated metal defects 失效
标题翻译：减少电镀金属缺陷
公开(公告)号：US4431685A
公开(公告)日：1984-02-14
申请号：US394588
申请日：1982-07-02
申请人： Michael J. Canestaro , Donald G. McBride , John A. Welsh
发明人： Michael J. Canestaro , Donald G. McBride , John A. Welsh
IPC分类号： C23C18/18 , C23C18/16 , C23C18/38 , C23C18/42 , C25D5/02 , G03F7/11 , H01L21/70 , H05K3/10 , H05K3/24 , H05K3/38 , G03C5/00
CPC分类号： H05K3/244 , C23C18/1605 , C23C18/1651 , C23C18/54 , G03F7/11 , H01L21/707 , H05K3/384 , H05K2201/0347 , H05K2203/072 , H05K3/108 , H05K3/382
摘要： A method of decreasing plated metal defects by applying a layer of a noble metal such as palladium, platinum, gold, iridium, rhodium, or mixtures thereof between a photoresist and a metallic surface.
摘要翻译：一种通过在光致抗蚀剂和金属表面之间施加一层贵金属如钯，铂，金，铱，铑或其混合物来减少电镀金属缺陷的方法。

7. 发明授权

US5294259A Fluid treatment device 失效
标题翻译：流体处理装置
公开(公告)号：US5294259A
公开(公告)日：1994-03-15
申请号：US884818
申请日：1992-05-18
申请人： Michael J. Canestaro , Donald G. McBride , Louis J. Konrad, III , Ronald J. Moore
发明人： Michael J. Canestaro , Donald G. McBride , Louis J. Konrad, III , Ronald J. Moore
IPC分类号： C23F1/08 , B05C3/12 , B05C3/18 , B05C5/02 , C23G3/00 , H05K3/00 , H05K3/06 , H05K3/18 , H05K3/26 , H05K3/42 , B05C3/02
CPC分类号： B05C3/18 , B05C3/125 , H05K3/0085
摘要： A device for applying fluid to a substrate which includes a head member having first and second opposed portions adapted for being fixedly positioned relative to each other. The device is particularly suited for treating a substrate as the substrate moves between the first and second portions. Each portion may in turn include a first channel located at a predetermined distance from the substrate for having a first fluid impinge on the substrate at a first velocity. Additionally, each portion may include a weir adjacent the first channel for having fluid pass thereover at an accelerated rate and thus at a greater velocity than the first fluid, this weir being located at a lesser distance than the first channel. Fluid inlet means is coupled to the respective portions to provide the fluid thereto at desired velocities. Significantly, a fluid blocking means (e.g., an elongated bar) is also included as part of the structure for maintaining the fluids at pre-established levels.
摘要翻译：一种用于向衬底施加流体的装置，其包括具有适于相对于彼此固定定位的第一和第二相对部分的头部构件。当衬底在第一和第二部分之间移动时，该器件特别适用于处理衬底。每个部分还可以包括位于距衬底预定距离的第一通道，以使第一流体以第一速度冲击在衬底上。另外，每个部分可以包括与第一通道相邻的堰，用于使流体以加速的速度通过，因此以比第一流体更大的速度传递，该堰位于比第一通道更小的距离处。流体入口装置联接到相应的部分，以期望的速度向其提供流体。重要的是，还包括流体阻塞装置（例如，细长条）作为用于将流体保持在预先确定的水平的结构的一部分。

8. 发明授权

US4681654A Flexible film semiconductor chip carrier 失效
标题翻译：柔性薄膜半导体芯片载体
公开(公告)号：US4681654A
公开(公告)日：1987-07-21
申请号：US865316
申请日：1986-05-21
申请人： Robert J. Clementi , Charles E. Gazdik , William Lafer , Roy L. Lovesky , Donald G. McBride , Joel V. Munson , Eugene P. Skarvinko
发明人： Robert J. Clementi , Charles E. Gazdik , William Lafer , Roy L. Lovesky , Donald G. McBride , Joel V. Munson , Eugene P. Skarvinko
IPC分类号： H01L21/60 , H01L21/48 , H01L23/498 , H01L23/538 , H05K1/00 , H05K3/00 , H05K3/38 , C23F1/02 , B29C37/00 , B44C1/22 , C03C15/00
CPC分类号： H01L21/4846 , H01L23/4985 , H01L23/5387 , H05K1/0271 , H05K3/0097 , H01L2924/0002 , H05K1/0393 , H05K2201/0154 , H05K2201/0317 , H05K2203/0156 , H05K2203/066 , H05K2203/1152 , H05K2203/1545 , H05K3/002 , H05K3/007 , H05K3/388 , Y10T156/1057 , Y10T29/49121 , Y10T29/49126 , Y10T29/49155 , Y10T428/12396
摘要： A method is disclosed for making circuitized, flexible film substrates in a continuous tape format using a transfer technique. The tape is made with window-like openings having a relatively thin layer of polyimide spanning the openings. The relatively thin layer of polyimide is transferred to the tape from a metal carrier foil, preferably by using a special adhesive system. After the polyimide is transferred to the tape, the polyimide spanning the window-like openings in the tape is circuitized to form individual, circuitized, flexible film substrates which may be handled in the tape format for further processing. Preferably, the tape includes perforations for engaging sprockets of automated manufacturing equipment, or the like.
摘要翻译：公开了一种使用转移技术制造连续磁带格式的电路化柔性薄膜基片的方法。胶带由具有相对薄的聚酰亚胺层横跨开口的窗口状开口制成。优选通过使用特殊的粘合剂系统将相对薄的聚酰亚胺层从金属载体箔转移到带上。在将聚酰亚胺转移到带之后，跨过带中的窗口状开口的聚酰亚胺被电路化以形成可以以带格式处理以进一步处理的单独的，电路化的柔性膜基底。优选地，带包括用于接合自动化制造设备的链轮等的穿孔。

9. 发明授权

US4639380A Process for preparing a substrate for subsequent electroless deposition of a metal 失效
标题翻译：制备用于金属的随后无电沉积的衬底的方法
公开(公告)号：US4639380A
公开(公告)日：1987-01-27
申请号：US730918
申请日：1985-05-06
申请人： William J. Amelio , David W. Hume , Donald G. McBride , Robert G. Rickert
发明人： William J. Amelio , David W. Hume , Donald G. McBride , Robert G. Rickert
IPC分类号： H05K3/18 , C23C18/20 , C23C18/24 , H05K3/42
CPC分类号： C23C18/24 , H05K3/422
摘要： A substrate is prepared for subsequent electroless deposition of a metal by contacting the substrate with a surfactant and with an organic carboxylic acid, and subsequently contacting the substrate with sulfuric acid.
摘要翻译：制备用于随后通过使基底与表面活性剂和有机羧酸接触的化学沉积金属，然后使基底与硫酸接触的基底。

10. 发明授权

US4421608A Method for stripping peel apart conductive structures 失效
标题翻译：剥离导电结构剥离方法
公开(公告)号：US4421608A
公开(公告)日：1983-12-20
申请号：US353310
申请日：1982-03-01
申请人： Donald G. McBride
发明人： Donald G. McBride
IPC分类号： H05K3/38 , B29C63/00 , H05K3/00 , H05K3/02 , C25D1/04 , C23F1/02 , C25D7/06
CPC分类号： H05K3/00 , B29C63/0013 , H05K3/025 , H05K2203/0152 , H05K2203/0726 , H05K2203/0786 , Y10T156/1111
摘要： A fluid is applied between the carrier member and the conductive member of a peel apart structure during the peel apart operation between the carrier member and the conductive member. The fluid reduces the bonding strength between the carrier member and the conductive member and thus maintains the integrity of the conductive member as the carrier member is peeled away.
摘要翻译：在载体构件和导电构件之间的剥离操作期间，在载体构件和剥离结构的导电构件之间施加流体。流体降低了承载构件和导电构件之间的结合强度，并因此在承载构件被剥离时保持导电构件的完整性。

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