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    • 1. 发明申请
    • Magnetic write head having a shield that extends below the leading edge of the write pole
    • 磁写头具有在写柱的前缘下方延伸的屏蔽
    • US20080100959A1
    • 2008-05-01
    • US11588961
    • 2006-10-27
    • Michael FeldbaumQuang LeAron PentekSue Siyang Zhang
    • Michael FeldbaumQuang LeAron PentekSue Siyang Zhang
    • G11B5/127
    • G11B5/11G11B5/315
    • A magnetic write head for perpendicular magnetic recording that has a write pole and a trailing or side shield that has a leading edge that extends to or beyond the leading edge of write pole, thereby ensuring complete side magnetic shielding. The write head can be formed by forming the write pole on a non-magnetic substrate that is constructed of a material that can be readily removed by reactive ion etching (RIE). The write pole can be formed by depositing a layer of magnetic write pole material over the substrate and then forming a mask over the magnetic write pole material. An ion mill can be performed to define the write pole, and then a reactive ion etch can be performed to notch the substrate, so that when a non-magnetic shield gap material is deposited it will be below or at the bottom of the write pole. Then a magnetic shield material can be deposited to form a shield having a leading edge that extends beyond the leading edge of the write pole.
    • 一种用于垂直磁记录的磁写头,具有写磁极和后屏蔽或侧屏蔽,其具有延伸到或超过写极的前沿的前沿,从而确保完全的侧磁屏蔽。 写头可以通过在由可以通过反应离子蚀刻(RIE)容易地去除的材料构成的非磁性衬底上形成写极来形成。 可以通过在衬底上沉积一层磁性写入磁极材料,然后在磁性写入磁极材料上形成掩模来形成写入极。 可以执行离子磨以限定写入极,然后可以执行反应离子蚀刻以蚀刻衬底,使得当非磁性屏蔽间隙材料沉积时,它将在写入极的下方或底部 。 然后,可以沉积磁屏蔽材料以形成具有延伸超过写柱的前缘的前缘的屏蔽。
    • 2. 发明授权
    • Magnetic write head having a shield that extends below the leading edge of the write pole
    • 磁写头具有在写柱的前缘下方延伸的屏蔽
    • US07715147B2
    • 2010-05-11
    • US11588961
    • 2006-10-27
    • Michael FeldbaumQuang LeAron PentekSue Siyang Zhang
    • Michael FeldbaumQuang LeAron PentekSue Siyang Zhang
    • G11B5/187G11B5/11
    • G11B5/11G11B5/315
    • A magnetic write head for perpendicular magnetic recording that has a write pole and a trailing or side shield that has a leading edge that extends to or beyond the leading edge of write pole, thereby ensuring complete side magnetic shielding. The write head can be formed by forming the write pole on a non-magnetic substrate that is constructed of a material that can be readily removed by reactive ion etching (RIE). The write pole can be formed by depositing a layer of magnetic write pole material over the substrate and then forming a mask over the magnetic write pole material. An ion mill can be performed to define the write pole, and then a reactive ion etch can be performed to notch the substrate, so that when a non-magnetic shield gap material is deposited it will be below or at the bottom of the write pole. Then a magnetic shield material can be deposited to form a shield having a leading edge that extends beyond the leading edge of the write pole.
    • 一种用于垂直磁记录的磁写头,具有写磁极和后屏蔽或侧屏蔽,其具有延伸到或超过写极的前沿的前沿,从而确保完全的侧磁屏蔽。 写头可以通过在由可以通过反应离子蚀刻(RIE)容易地去除的材料构成的非磁性衬底上形成写极来形成。 可以通过在衬底上沉积一层磁性写入磁极材料,然后在磁性写入磁极材料上形成掩模来形成写入极。 可以执行离子磨以限定写入极,然后可以执行反应离子蚀刻以蚀刻衬底,使得当非磁性屏蔽间隙材料沉积时,它将在写入极的下方或底部 。 然后,可以沉积磁屏蔽材料以形成具有延伸超过写柱的前缘的前缘的屏蔽。
    • 6. 发明申请
    • Process to open connection vias on a planarized surface
    • 在平坦化表面上打开连接通孔的过程
    • US20070245557A1
    • 2007-10-25
    • US11411555
    • 2006-04-25
    • Amanda BaerHamid BalamaneMichael FeldbaumMing JiangAron Pentek
    • Amanda BaerHamid BalamaneMichael FeldbaumMing JiangAron Pentek
    • H01K3/10
    • G11B5/3163G11B5/1278G11B5/3116Y10T29/49021Y10T29/49032Y10T29/49044Y10T29/49126Y10T29/49139Y10T29/49153Y10T29/49155Y10T29/49165Y10T29/49169
    • A method for forming a via in an alumina protective layer on a structure such as a magnetic write head for use in perpendicular magnetic recording. A substrate such as an alumina fill layer, magnetic shaping layer, etc. is formed with region having a contact pad formed therein. A structure such as a magnetic pole, and or magnetic trailing shield, is formed over the substrate and is covered with a thick layer of alumina. The alumina can be applied by a high deposition rate process that does not form voids or seams in the alumina layer. The alumina layer can then be planarized by a chemical mechanical polishing process (CMP) and then a mask structure, such as a photoresist mask, is formed over the alumina layer. The mask structure is formed with an opening disposed over the contact pad. A reactive ion mill is then performed to remove portions of the alumina layer that are exposed at the opening in the mask, thereby forming a via in the alumina layer. The mask can then be lifted off and an electrically conductive material can be deposited into the via. Forming the via by a subtractive method rather than by a liftoff process allows the alumina to be deposited in a manner that does not result in voids. The use of reactive ion milling allows the via to be well defined and formed with substantially vertical side walls rather than in a conical or outward spreading fashion as would be formed by other material removal processes such as wet etching.
    • 在用于垂直磁记录的诸如磁写头的结构上的氧化铝保护层中形成通孔的方法。 在其中形成有形成有接触垫的区域形成诸如氧化铝填充层,磁性成形层等的基板。 诸如磁极和/或磁性后屏蔽的结构形成在衬底之上,并被厚层氧化铝覆盖。 可以通过在氧化铝层中不形成空隙或接缝的高沉积速率工艺来施加氧化铝。 然后可以通过化学机械抛光工艺(CMP)将氧化铝层平坦化,然后在氧化铝层上形成诸如光致抗蚀剂掩模的掩模结构。 掩模结构形成有设置在接触垫上方的开口。 然后执行反应离子研磨机以除去在掩模中的开口处暴露的部分氧化铝层,从而在氧化铝层中形成通孔。 然后可以将掩模剥离,并且可以将导电材料沉积到通孔中。 通过减法法而不是通过剥离工艺形成通孔允许以不会导致空隙的方式沉积氧化铝。 使用反应离子研磨允许通孔被良好地限定并且形成有基本垂直的侧壁,而不是以其它材料去除工艺(例如湿蚀刻)形成的锥形或向外扩展方式。