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    • 9. 发明授权
    • Method to control mask profile for read sensor definition
    • 用于控制读取传感器定义的掩模简档的方法
    • US08393073B2
    • 2013-03-12
    • US12177069
    • 2008-07-21
    • Richard Jule ContrerasMichael FeldbaumMustafa Michael Pinarbasi
    • Richard Jule ContrerasMichael FeldbaumMustafa Michael Pinarbasi
    • G11B5/187C23F1/12
    • B82Y25/00B82Y10/00G11B5/3163G11B5/3903G11B5/398G11B2005/3996Y10T29/49021Y10T29/49032Y10T29/49041Y10T29/49043Y10T29/49044Y10T29/49046Y10T29/49048Y10T29/49052
    • A method for constructing a magnetoresistive sensor that avoids shadowing effects of a mask structure during sensor definition. The method includes the use of an antireflective coating (ARC) and a photosensitive mask deposited there over. The photosensitive mask is formed to cover a desired sensor area, leaving non-sensor areas exposed. A reactive ion etch is performed to transfer the pattern of the photosensitive mask onto the underlying ARC layer. The reactive ion etch (RIE) is performed with a relatively high amount of platen power. The higher platen power increases ion bombardment of the wafer, thereby increasing the physical (ie mechanical) component of material removal relative to the chemical component. This increase in the physical component of material removal result in an increased rate of removal of the photosensitive mask material relative to the ion mill resistant mask. This avoids the formation of a bulbous or mushroom shaped photoresist mask and therefore, avoids shadowing effects during subsequent manufacturing processes.
    • 一种用于构造磁阻传感器的方法,其在传感器定义期间避免掩模结构的遮蔽效应。 该方法包括使用沉积在其上的抗反射涂层(ARC)和感光掩模。 形成光敏掩模以覆盖所需的传感器区域,使非传感器区域暴露。 执行反应离子蚀刻以将感光掩模的图案转移到下面的ARC层上。 反应离子蚀刻(RIE)以相对高的压板功率进行。 较高的压板功率增加晶片的离子轰击,从而增加相对于化学组分的材料去除的物理(即机械)组分。 材料去除的物理组分的这种增加导致感光掩模材料相对于耐磨离子磨损掩模的去除速率增加。 这避免了球形或蘑菇状光致抗蚀剂掩模的形成,因此避免了后续制造过程中的阴影效应。