会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 5. 发明申请
    • Resist Reactive Ion Etch (RIE) Process for Plating
    • 电镀反应离子蚀刻(RIE)工艺
    • US20170011756A1
    • 2017-01-12
    • US15222431
    • 2016-07-28
    • Headway Technologies, Inc.
    • Hironori ArakiYoshitaka SasakiHiroyuki ItoSeiichiro TomitaKazuki SatoHideo Mamiya
    • G11B5/31G11B5/39
    • G11B5/3123G11B5/17G11B5/3906G11B2005/0021
    • A magnetic write head has a plated coil with narrow pitch and is suitable for writing at high frequencies on magnetic media with high coercivity. The narrow pitch is obtained without such disadvantages as overplating that has adversely affected prior art attempts to produce such narrow pitches. The process that produces the magnetic write head is characterized by an RIE plasma etch using O2/N2 to etch plating trenches into a baked layer of photoresist with the ratio of gases being 5/45 sccm so that a dilute O2 concentration does not create unwanted side etching of the plating trenches. In addition, a Cu seed layer is coated with an insulating layer of Al2O3 which redeposits on the trench sidewalls to inhibit redeposition of any Cu from the seed layer and prevent outward growth of the plated Cu that would result in overplating.
    • 磁写头具有窄间距的电镀线圈,适用于高矫顽磁性介质的高频写入。 获得窄的间距没有诸如对现有技术尝试产生这种窄间距产生不利影响的过度镀敷的缺点。 产生磁写头的过程的特征在于使用O 2 / N 2的RIE等离子体蚀刻将电镀沟槽蚀刻成光致抗蚀剂的烘烤层,其中气体比例为5/45sccm,使得稀的O 2浓度不会产生不期望的侧面 蚀刻电镀槽。 此外,Cu籽晶层涂覆有Al 2 O 3的绝缘层,其重新沉积在沟槽侧壁上以抑制任何Cu从种子层的再沉积,并防止导致过镀的镀覆Cu的向外生长。