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1. 发明授权

US5791231A Surgical robotic system and hydraulic actuator therefor 失效
标题翻译：手术机器人系统及其液压执行机构
公开(公告)号：US5791231A
公开(公告)日：1998-08-11
申请号：US62400
申请日：1993-05-17
申请人： Michael B. Cohn , D. Curtis Deno , Jennifer T. Fujii
发明人： Michael B. Cohn , D. Curtis Deno , Jennifer T. Fujii
IPC分类号： A61B17/00 , A61B19/00 , B25J9/14 , B25J15/02 , F01B29/00
CPC分类号： B25J9/144 , A61B34/30 , B25J15/0206 , A61B2017/00539 , A61B2034/741
摘要： A hydraulic actuator is described which has a layered structure and a flattened piston assembly to enhance production speed and reduce the costs of assembly. A system for performing surgery is also described incorporating the hydraulic actuator, having a sensory glove, a computer, and a slender robot manipulator which can be inserted into the human body through a small incision. The robot manipulator has a layered structure with integrated hydraulic pistons. This design allows the use of a novel manufacturing process in which all of the parts are formed from laminated sheets of material. Seals are formed to prevent leakage of hydraulic fluid by introducing castable rubber into enclosed channels in the structure.
摘要翻译：描述了具有分层结构和扁平活塞组件以提高生产速度并降低组装成本的液压致动器。还描述了一种用于执行手术的系统，其包括液压致动器，具有感官手套，计算机和细长的机器人操纵器，其可以通过小切口插入人体。机器人操纵器具有集成液压活塞的分层结构。这种设计允许使用一种新颖的制造工艺，其中所有部件都是由层压材料制成。形成密封件以通过将可浇注橡胶引入结构中的封闭通道中来防止液压流体泄漏。

2. 发明授权

US06853067B1 Microelectromechanical systems using thermocompression bonding 失效
标题翻译：使用热压接的微机电系统
公开(公告)号：US06853067B1
公开(公告)日：2005-02-08
申请号：US10377999
申请日：2003-02-28
申请人： Michael B. Cohn , Joseph T. Kung
发明人： Michael B. Cohn , Joseph T. Kung
IPC分类号： B81B7/00 , B81C1/00 , H01L21/60 , H01L23/10 , H01L23/12
CPC分类号： B81C1/00238 , B81C2203/0109 , B81C2203/0118 , B81C2203/019 , H01L23/10 , H01L24/48 , H01L24/49 , H01L24/75 , H01L24/81 , H01L2224/05553 , H01L2224/13111 , H01L2224/48095 , H01L2224/48137 , H01L2224/49175 , H01L2224/75 , H01L2224/7598 , H01L2224/81801 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01045 , H01L2924/01046 , H01L2924/01049 , H01L2924/0105 , H01L2924/01074 , H01L2924/01075 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/14 , H01L2924/1461 , H01L2924/15788 , H01L2924/19041 , H01L2924/30105 , H01L2924/3011 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： Improved microelectromechanical systems (MEMS), processes and apparatus using thermocompression bonding are disclosed. For example, process embodiments are disclosed in which wafer-scale as well as die-scale thermocompression bonding is utilized to encapsulate MEMS and/or to provide electrical interconnections with MEMS. Apparatus embodiments include apparatus for performing thermocompression bonding and bonded hybrid structures manufactured in accordance with the process embodiments. Devices having various substrate bonding and/or sealing configurations variously offer the advantage of reduced size, higher manufacturing yields, reduced costs, improved reliability, improved compatibility with existing semiconductor manufacturing process and/or greater versatility of applications.
摘要翻译：公开了改进的微机电系统（MEMS），使用热压接的工艺和装置。例如，公开了方法实施例，其中利用晶片尺度以及管芯尺寸的热压粘合来封装MEMS和/或提供与MEMS的电互连。装置实施例包括用于执行根据方法实施例制造的热压接和粘合的混合结构的装置。具有各种基板结合和/或密封结构的装置各不相同地提供了减小尺寸，更高的制造成本，降低的成本，改进的可靠性，改进的与现有半导体制造工艺的兼容性和/或更大的多功能性应用的优点。

3. 发明授权

US07692521B1 High force MEMS device 失效
标题翻译：高力MEMS器件
公开(公告)号：US07692521B1
公开(公告)日：2010-04-06
申请号：US11433044
申请日：2006-05-12
申请人： Michael B. Cohn
发明人： Michael B. Cohn
IPC分类号： H01H51/22
CPC分类号： H01H59/0009
摘要： Problems with the short lifetime of MEMS devices, low actuation forces, contaminant build-up on contacts, etc. are minimized by a MEMS device with an improved cantilever design that enables high force while maintaining large gaps. The improved cantilever design both allows for high force and fast switching while minimizing damage to contacts. The improved design can be fabricated on one or two substrates, which are bonded together with a seal ring to provide a packaged MEMS device.
摘要翻译：通过具有改进的悬臂设计的MEMS装置可以最大程度地减少MEMS器件的短寿命问题，低致动力，触点上的污染物积聚等问题，从而在保持较大间隙的同时实现高强度。改进的悬臂设计允许高强度和快速切换，同时最小化对触点的损坏。改进的设计可以在一个或两个基板上制造，所述基板与密封环结合在一起以提供封装的MEMS器件。

4. 发明授权

US06872902B2 MEMS device with integral packaging 失效
标题翻译：集成封装的MEMS器件
公开(公告)号：US06872902B2
公开(公告)日：2005-03-29
申请号：US10608294
申请日：2003-06-27
申请人： Michael B. Cohn , Ji-Hai Xu
发明人： Michael B. Cohn , Ji-Hai Xu
IPC分类号： B81B3/00 , B81B7/00 , B81C1/00 , H01H59/00 , H01H57/00
CPC分类号： H01H59/0009 , B81B7/0077 , B81B2201/018 , B81B2203/0118 , B81B2207/093 , B81C1/00301 , B81C1/00357 , B81C3/001 , B81C2201/019 , B81C2203/0109 , B81C2203/0118 , B81C2203/019 , H01H2059/0018 , H01H2059/0072
摘要： A MEMS device and method of making same is disclosed. In one embodiment, a micro-switch includes a base assembly comprising a movable structure bearing a contact pad. The base assembly is wafer-scale bonded to a lid assembly comprising an activator and a signal path. The movable structure moves within a sealed cavity formed during the bonding process. The signal path includes an input line and an output line separated by a gap, which prevents signals from propagating through the micro-switch when the switch is deactivated. In operation, a signal is launched into the signal path. When the micro-switch is activated, a force is established by the actuator, which pulls a portion of the movable structure upwards towards the gap in the signal path, until the contact pad bridges the gap between the input line and output line, allowing the signal to propagate through the micro-switch. Prior to bonding, the MEMS structures are annealed on a first wafer and the conductive traces and other metals are annealed on a second wafer to allow each wafer to be processed separately using different processes, e.g., different annealing temperatures.
摘要翻译：公开了MEMS器件及其制造方法。在一个实施例中，微型开关包括基座组件，其包括承载接触垫的可移动结构。基座组件被晶片刻度结合到包括激活器和信号路径的盖组件。可移动结构在接合过程中形成的密封空腔内移动。信号路径包括输入线和由间隙分开的输出线，当开关被去激活时，该线路防止信号通过微型开关传播。在操作中，信号被发送到信号路径中。当微动开关被激活时，致动器建立一个力，致动器将可移动结构的一部分朝向信号路径中的间隙向上拉，直到接触垫桥接输入线和输出线之间的间隙，从而允许信号通过微型开关传播。在结合之前，MEMS结构在第一晶片上退火，并且导电迹线和其它金属在第二晶片上进行退火，以允许使用不同工艺（例如不同的退火温度）分别对每个晶片进行加工。

5. 发明申请

US20080272867A1 MEMS DEVICE WITH INTEGRAL PACKAGING 失效
标题翻译：具有整体封装的MEMS器件
公开(公告)号：US20080272867A1
公开(公告)日：2008-11-06
申请号：US11929245
申请日：2007-10-30
申请人： Michael B. Cohn , Ji-Hai Xu
发明人： Michael B. Cohn , Ji-Hai Xu
IPC分类号： H01L21/48 , H01H51/22
CPC分类号： H01H59/0009 , B81B7/0077 , B81B2201/018 , B81B2203/0118 , B81B2207/093 , B81C1/00301 , B81C1/00357 , B81C3/001 , B81C2201/019 , B81C2203/0109 , B81C2203/0118 , B81C2203/019 , H01H2059/0018 , H01H2059/0072
摘要： A MEMS device and method of making same is disclosed. In one embodiment, a micro-switch includes a base assembly comprising a movable structure bearing a contact pad. The base assembly is wafer-scale bonded to a lid assembly comprising an activator and a signal path. The movable structure moves within a sealed cavity formed during the bonding process. The signal path includes an input line and an output line separated by a gap, which prevents signals from propagating through the micro-switch when the switch is deactivated. In operation, a signal is launched into the signal path. When the micro-switch is activated, a force is established by the actuator, which pulls a portion of the movable structure upwards towards the gap in the signal path, until the contact pad bridges the gap between the input line and output line, allowing the signal to propagate through the micro-switch. Prior to bonding, the MEMS structures are annealed on a first wafer and the conductive traces and other metals are annealed on a second wafer to allow each wafer to be processed separately using different processes, e.g., different annealing temperatures.
摘要翻译：公开了MEMS器件及其制造方法。在一个实施例中，微型开关包括基座组件，其包括承载接触垫的可移动结构。基座组件被晶片刻度结合到包括激活器和信号路径的盖组件。可移动结构在接合过程中形成的密封空腔内移动。信号路径包括输入线和由间隙分开的输出线，当开关被去激活时，该线路防止信号通过微型开关传播。在操作中，信号被发送到信号路径中。当微动开关被激活时，致动器建立一个力，致动器将可移动结构的一部分朝向信号路径中的间隙向上拉，直到接触垫桥接输入线和输出线之间的间隙，从而允许信号通过微型开关传播。在结合之前，MEMS结构在第一晶片上退火，并且导电迹线和其它金属在第二晶片上进行退火，以允许使用不同工艺（例如不同的退火温度）分别对每个晶片进行加工。

6. 发明授权

US07276789B1 Microelectromechanical systems using thermocompression bonding 失效
标题翻译：使用热压接的微机电系统
公开(公告)号：US07276789B1
公开(公告)日：2007-10-02
申请号：US10851751
申请日：2004-05-20
申请人： Michael B. Cohn , Joseph T. Kung
发明人： Michael B. Cohn , Joseph T. Kung
IPC分类号： H01L23/12
CPC分类号： B81C1/00238 , B81C2203/0109 , B81C2203/0118 , B81C2203/019 , H01L23/10 , H01L24/48 , H01L24/49 , H01L24/75 , H01L24/81 , H01L2224/05553 , H01L2224/13111 , H01L2224/48095 , H01L2224/48137 , H01L2224/49175 , H01L2224/75 , H01L2224/7598 , H01L2224/81801 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01045 , H01L2924/01046 , H01L2924/01049 , H01L2924/0105 , H01L2924/01074 , H01L2924/01075 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/14 , H01L2924/1461 , H01L2924/15788 , H01L2924/19041 , H01L2924/30105 , H01L2924/3011 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： Improved microelectromechanical systems (MEMS), processes and apparatus using thermocompression bonding are disclosed. For example, process embodiments are disclosed in which wafer-scale as well as die-scale thermocompression bonding is utilized to encapsulate MEMS and/or to provide electrical interconnections with MEMS. Apparatus embodiments include apparatus for performing thermocompression bonding and bonded hybrid structures manufactured in accordance with the process embodiments. Devices having various substrate bonding and/or sealing configurations variously offer the advantage of reduced size, higher manufacturing yields, reduced costs, improved reliability, improved compatibility with existing semiconductor manufacturing process and/or greater versatility of applications.
摘要翻译：公开了改进的微机电系统（MEMS），使用热压接的工艺和装置。例如，公开了方法实施例，其中利用晶片尺度以及管芯尺寸的热压粘合来封装MEMS和/或提供与MEMS的电互连。装置实施例包括用于执行根据方法实施例制造的热压接和粘合的混合结构的装置。具有各种基板结合和/或密封结构的装置各不相同地提供了减小尺寸，更高的制造成本，降低的成本，改进的可靠性，改进的与现有半导体制造工艺的兼容性和/或更大的多功能性应用的优点。

7. 发明申请

US20120193754A1 MEMS DEVICE WITH INTEGRAL PACKAGING 失效
标题翻译：具有整体封装的MEMS器件
公开(公告)号：US20120193754A1
公开(公告)日：2012-08-02
申请号：US13368275
申请日：2012-02-07
申请人： Michael B. Cohn , Ji-Hai Xu
发明人： Michael B. Cohn , Ji-Hai Xu
IPC分类号： H01L29/06
CPC分类号： H01H59/0009 , B81B7/0077 , B81B2201/018 , B81B2203/0118 , B81B2207/093 , B81C1/00301 , B81C1/00357 , B81C3/001 , B81C2201/019 , B81C2203/0109 , B81C2203/0118 , B81C2203/019 , H01H2059/0018 , H01H2059/0072
摘要： A MEMS device and method of making same is disclosed. In one embodiment, a micro-switch includes a base assembly comprising a movable structure bearing a contact pad. The base assembly is wafer-scale bonded to a lid assembly comprising an activator and a signal path. The movable structure moves within a sealed cavity formed during the bonding process. The signal path includes an input line and an output line separated by a gap, which prevents signals from propagating through the micro-switch when the switch is deactivated. In operation, a signal is launched into the signal path. When the micro-switch is activated, a force is established by the actuator, which pulls a portion of the movable structure upwards towards the gap in the signal path, until the contact pad bridges the gap between the input line and output line, allowing the signal to propagate through the micro-switch.
摘要翻译：公开了MEMS器件及其制造方法。在一个实施例中，微型开关包括基座组件，其包括承载接触垫的可移动结构。基座组件被晶片刻度结合到包括激活器和信号路径的盖组件。可移动结构在接合过程中形成的密封空腔内移动。信号路径包括输入线和由间隙分开的输出线，当开关被去激活时，该线路防止信号通过微型开关传播。在操作中，信号被发送到信号路径中。当微动开关被激活时，致动器建立一个力，致动器将可移动结构的一部分朝向信号路径中的间隙向上拉，直到接触垫桥接输入线和输出线之间的间隙，从而允许信号通过微型开关传播。

8. 发明授权

US6142358A Wafer-to-wafer transfer of microstructures using break-away tethers 失效
标题翻译：使用脱离系绳的晶圆 - 晶片转移微结构
公开(公告)号：US6142358A
公开(公告)日：2000-11-07
申请号：US866954
申请日：1997-05-31
申请人： Michael B. Cohn , Roger T. Howe
发明人： Michael B. Cohn , Roger T. Howe
IPC分类号： B23K1/00 , B81B7/00 , H01L21/68 , B23K31/02 , B23K1/018 , H01L23/52 , B65G49/07
CPC分类号： H01L21/6835 , B23K1/0016 , B81B7/00 , B23K2201/40 , H01L2221/68359 , H01L2924/30105 , Y10S414/135 , Y10S414/136
摘要： Break-away tethers to secure electronic, mechanical, optical, or other microstructures, during release from one substrate and transfer to another. Microstructures are fabricated with integrated tethers attaching them to a first substrate. The structures are undercut by etching and contacted and bonded to a second substrate. First and second substrates are separated, breaking the tethers.
摘要翻译：脱离系绳以在从一个基板释放并转移到另一个基板时固定电子，机械，光学或其他微结构。微结构制造具有将其附接到第一基底的集成系绳。该结构通过蚀刻被切割并接触并结合到第二基底。分离第一和第二底物，破坏系绳。

9. 发明授权

US5355577A Method and apparatus for the assembly of microfabricated devices 失效
标题翻译：用于装配微加工装置的方法和装置
公开(公告)号：US5355577A
公开(公告)日：1994-10-18
申请号：US902986
申请日：1992-06-23
申请人： Michael B. Cohn
发明人： Michael B. Cohn
IPC分类号： H01S5/022 , H05K13/02 , H05K13/04 , H01S4/00 , B23P19/00
CPC分类号： B82Y30/00 , B81C3/005 , H01L24/24 , H01L24/82 , H01L24/95 , H02K99/00 , H05K13/028 , H05K13/0482 , B81C2203/054 , B81C2203/058 , H01L2224/24051 , H01L2224/24226 , H01L2224/95085 , H01L2224/95122 , H01L2224/95136 , H01L2224/95144 , H01L2224/95145 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/0102 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01075 , H01L2924/014 , H01L2924/10329 , H01L2924/12041 , H01L2924/12042 , H01L2924/1306 , H01L2924/14 , H01L2924/19041 , H01L2924/19043 , H01L2924/30105 , Y10S29/046 , Y10T29/49002 , Y10T29/4913 , Y10T29/5313 , Y10T29/53196
摘要： Abstract: A method of rapidly assembling many discrete microelectronic or micro-mechanical devices 56 (FIG. 2 ) in a precise configuration (FIG. 8f). The devices are placed randomly on a template (FIG. 3 ) consisting of a pair of oppositely charged planar electrodes. The upper electrode contains a multiplicity of apertures. The template is vibrated and the devices are attracted to the apertures and trapped thereat. The shape of a given aperture determines the number, orientation, and type of device that it traps. The process is completed by mechanically and electrically connecting the devices. The present method for serf-assembly allows many sub-millimeter sized electronic components or other particles to be rapidly assembled into a predetermined configuration. The method relies on vibration and weak electrical or magnetic forces.
摘要翻译：摘要：一种以精确配置（图8f）快速组装许多分立微电子或微机械装置56（图2）的方法。将器件随机放置在由一对相对带电的平面电极组成的模板（图3）上。上电极包含多个孔。模板被振动，并且装置被吸引到孔并被捕获在其上。给定孔径的形状决定了其捕获的设备的数量，方向和类型。该过程通过机械和电气连接装置完成。本发明的伺服组装方法允许许多亚毫米尺寸的电子部件或其它颗粒快速组装成预定的构型。该方法依赖于振动和弱电或磁力。

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