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1. 发明授权

US06306014B1 Web-format planarizing machines and methods for planarizing microelectronic substrate assemblies 有权
标题翻译：用于平面化微电子衬底组件的Web格式平面化机器和方法
公开(公告)号：US06306014B1
公开(公告)日：2001-10-23
申请号：US09613654
申请日：2000-07-11
申请人： Michael A. Walker , Scott E. Moore
发明人： Michael A. Walker , Scott E. Moore
IPC分类号： B24B100
CPC分类号： B24B37/20 , B24B21/04 , B24B21/20 , B24B37/26
摘要： Methods and machines for planarizing microelectronic substrate assemblies using mechanical and/or chemical-mechanical planarizing processes. One machine in accordance with an embodiment of the invention includes a table having a support surface with a planarizing zone, an elongated polishing pad configured to move across the support surface of the table along a pad travel path, and a pad advancing mechanism coupled to the pad. The elongated pad can have a length along an elongated dimension extending along the pad travel path, an elongated first edge, an elongated second edge opposite the first edge, an elongated first side region extending along the first edge, an elongated second side region extending along the second edge, and an elongated medial region having a width between the first and second side regions. The pad advancing mechanism can include a first roller about which an unused portion of the pad is wrapped and a second roller about which a used portion of the pad is wrapped. The planarizing machine can further include a carrier assembly having a head and a drive system to translate the substrate assembly across an active section of the polishing pad in the planarizing zone. The planarizing machine further includes a pad tensioning system between the planarizing zone of the table and either the first roller or the second roller. The tensioning system, for example, can have a pneumatic or mechanical stretching assembly configured to push or pull the medial region of the pad more than the first and second side regions to compensate for the smaller diameter of the used portion of the pad wrapped around the second roller.
摘要翻译：用于使用机械和/或化学机械平面化工艺平面化微电子衬底组件的方法和机器。根据本发明的实施例的一台机器包括具有平坦化区域的支撑表面的台面，被配置成沿着垫移动路径跨越工作台的支撑表面移动的细长抛光垫，以及联接到垫。细长垫可以具有沿着衬垫行进路径延伸的细长尺寸的长度，细长的第一边缘，与第一边缘相对的细长的第二边缘，沿着第一边缘延伸的细长的第一侧区域，沿着第一边缘延伸的细长的第二侧面区域第二边缘，以及在第一和第二侧区域之间具有宽度的细长的中间区域。衬垫推进机构可以包括第一辊，衬垫的未使用部分围绕第一辊和第二辊，衬垫的使用部分围绕第二辊被包裹。平面化机器还可以包括具有头部和驱动系统的托架组件，以便在平坦化区域中平移衬底组件跨过抛光垫的有效部分。平面化机还包括在工作台的平坦化区与第一辊或第二辊之间的垫张紧系统。例如，张紧系统可以具有气动或机械拉伸组件，其构造成比第一和第二侧区域推或拉推动衬垫的中间区域，以补偿围绕着第二侧区域的垫的使用部分的较小直径第二辊。

2. 发明授权

US06419560B2 Web-format planarizing machines and methods for planarizing microelectronic substrate assemblies 有权
公开(公告)号：US06419560B2
公开(公告)日：2002-07-16
申请号：US09965298
申请日：2001-09-26
申请人： Michael A. Walker , Scott E. Moore
发明人： Michael A. Walker , Scott E. Moore
IPC分类号： B24B100
CPC分类号： B24B37/20 , B24B21/04 , B24B21/20 , B24B37/26
摘要： Methods and machines for planarizing microelectronic substrate assemblies using mechanical and/or chemical-mechanical planarizing processes. One machine in accordance with an embodiment of the invention includes a table having a support surface with a planarizing zone, an elongated polishing pad configured to move across the support surface of the table along a pad travel path, and a pad advancing mechanism coupled to the pad. The elongated pad can have a length along an elongated dimension extending along the pad travel path, an elongated first edge, an elongated second edge opposite the first edge, an elongated first side region extending along the first edge, an elongated second side region extending along the second edge, and an elongated medial region having a width between the first and second side regions. The pad advancing mechanism can include a first roller about which an unused portion of the pad is wrapped and a second roller about which a used portion of the pad is wrapped. The planarizing machine can further include a carrier assembly having a head and a drive system to translate the substrate assembly across an active section of the polishing pad in the planarizing zone. The planarizing machine further includes a pad tensioning system between the planarizing zone of the table and either the first roller or the second roller. The tensioning system, for example, can have a pneumatic or mechanical stretching assembly configured to push or pull the medial region of the pad more than the first and second side regions to compensate for the smaller diameter of the used portion of the pad wrapped around the second roller.

3. 发明授权

US06428404B2 Web-format planarizing machines and methods for planarizing microelectronic substrate assemblies 有权
公开(公告)号：US06428404B2
公开(公告)日：2002-08-06
申请号：US09957112
申请日：2001-09-19
申请人： Michael A. Walker , Scott E. Moore
发明人： Michael A. Walker , Scott E. Moore
IPC分类号： B24B2100
CPC分类号： B24B37/20 , B24B21/04 , B24B21/20 , B24B37/26
摘要： Methods and machines for planarizing microelectronic substrate assemblies using mechanical and/or chemical-mechanical planarizing processes. One machine in accordance with an embodiment of the invention includes a table having a support surface with a planarizing zone, an elongated polishing pad configured to move across the support surface of the table along a pad travel path, and a pad advancing mechanism coupled to the pad. The elongated pad can have a length along an elongated dimension extending along the pad travel path, an elongated first edge, an elongated second edge opposite the first edge, an elongated first side region extending along the first edge, an elongated second side region extending along the second edge, and an elongated medial region having a width between the first and second side regions. The pad advancing mechanism can include a first roller about which an unused portion of the pad is wrapped and a second roller about which a used portion of the pad is wrapped. The planarizing machine can further include a carrier assembly having a head and a drive system to translate the substrate assembly across an active section of the polishing pad in the planarizing zone. The planarizing machine further includes a pad tensioning system between the planarizing zone of the table and either the first roller or the second roller. The tensioning system, for example, can have a pneumatic or mechanical stretching assembly configured to push or pull the medial region of the pad more than the first and second side regions to compensate for the smaller diameter of the used portion of the pad wrapped around the second roller.

4. 发明授权

US06402601B2 Web-format planarizing machines and methods for planarizing microelectronic substrate assemblies 有权
标题翻译：用于平面化微电子衬底组件的Web格式平面化机器和方法
公开(公告)号：US06402601B2
公开(公告)日：2002-06-11
申请号：US09907834
申请日：2001-07-17
申请人： Michael A. Walker , Scott E. Moore
发明人： Michael A. Walker , Scott E. Moore
IPC分类号： B24B2100
CPC分类号： B24B37/20 , B24B21/04 , B24B21/20 , B24B37/26
摘要： Methods and machines for planarizing microelectronic substrate assemblies using mechanical and/or chemical-mechanical planarizing processes. One machine in accordance with an embodiment of the invention includes a table having a support surface with a planarizing zone, an elongated polishing pad configured to move across the support surface of the table along a pad travel path, and a pad advancing mechanism coupled to the pad. The elongated pad can have a length along an elongated dimension extending along the pad travel path, an elongated first edge, an elongated second edge opposite the first edge, an elongated first side region extending along the first edge, an elongated second side region extending along the second edge, and an elongated medial region having a width between the first and second side regions. The pad advancing mechanism can include a first roller about which an unused portion of the pad is wrapped and a second roller about which a used portion of the pad is wrapped. The planarizing machine can further include a carrier assembly having a head and a drive system to translate the substrate assembly across an active section of the polishing pad in the planarizing zone. The planarizing machine further includes a pad tensioning system between the planarizing zone of the table and either the first roller or the second roller. The tensioning system, for example, can have a pneumatic or mechanical stretching assembly configured to push or pull the medial region of the pad more than the first and second side regions to compensate for the smaller diameter of the used portion of the pad wrapped around the second roller.
摘要翻译：用于使用机械和/或化学机械平面化工艺平面化微电子衬底组件的方法和机器。根据本发明的实施例的一台机器包括具有平坦化区域的支撑表面的台面，被配置成沿着垫移动路径跨越工作台的支撑表面移动的细长抛光垫，以及联接到垫。细长垫可以具有沿着衬垫行进路径延伸的细长尺寸的长度，细长的第一边缘，与第一边缘相对的细长的第二边缘，沿着第一边缘延伸的细长的第一侧区域，沿着第一边缘延伸的细长的第二侧面区域第二边缘，以及在第一和第二侧区域之间具有宽度的细长的中间区域。衬垫推进机构可以包括第一辊，衬垫的未使用部分围绕第一辊和第二辊，衬垫的使用部分围绕第二辊被包裹。平面化机器还可以包括具有头部和驱动系统的托架组件，以便在平坦化区域中平移衬底组件跨过抛光垫的有效部分。平面化机还包括在工作台的平坦化区与第一辊或第二辊之间的垫张紧系统。例如，张紧系统可以具有气动或机械拉伸组件，其构造成比第一和第二侧区域推或拉推动衬垫的中间区域，以补偿围绕着第二侧区域的垫的使用部分的较小直径第二辊。

5. 发明授权

US06261163B1 Web-format planarizing machines and methods for planarizing microelectronic substrate assemblies 有权
公开(公告)号：US06261163B1
公开(公告)日：2001-07-17
申请号：US09385985
申请日：1999-08-30
申请人： Michael A. Walker , Scott E. Moore
发明人： Michael A. Walker , Scott E. Moore
IPC分类号： B24B2100
CPC分类号： B24B37/20 , B24B21/04 , B24B21/20 , B24B37/26
摘要： Methods and machines for planarizing microelectronic substrate assemblies using mechanical and/or chemical-mechanical planarizing processes. One machine in accordance with an embodiment of the invention includes a table having a support surface with a planarizing zone, an elongated polishing pad configured to move across the support surface of the table along a pad travel path, and a pad advancing mechanism coupled to the pad. The elongated pad can have a length along an elongated dimension extending along the pad travel path, an elongated first edge, an elongated second edge opposite the first edge, an elongated first side region extending along the first edge, an elongated second side region extending along the second edge, and an elongated medial region having a width between the first and second side regions. The pad advancing mechanism can include a first roller about which an unused portion of the pad is wrapped and a second roller about which a used portion of the pad is wrapped. The planarizing machine can further include a carrier assembly having a head and a drive system to translate the substrate assembly across an active section of the polishing pad in the planarizing zone. The planarizing machine further includes a pad tensioning system between the planarizing zone of the table and either the first roller or the second roller. The tensioning system, for example, can have a pneumatic or mechanical stretching assembly configured to push or pull the medial region of the pad more than the first and second side regions to compensate for the smaller diameter of the used portion of the pad wrapped around the second roller.

6. 发明授权

US06803378B2 HIV integrase inhibitors 有权
标题翻译： HIV整合酶抑制剂
公开(公告)号：US06803378B2
公开(公告)日：2004-10-12
申请号：US10254365
申请日：2002-09-25
申请人： Michael A. Walker , Timothy D. Johnson , Nicholas A. Meanwell , Jacque Banville
发明人： Michael A. Walker , Timothy D. Johnson , Nicholas A. Meanwell , Jacque Banville
IPC分类号： C07D31700
CPC分类号： C07D213/30 , C07C59/90 , C07C235/28 , C07C235/74 , C07C237/42 , C07C311/51 , C07C2601/02 , C07D213/38 , C07D213/40 , C07D307/52 , C07D317/34 , C07D317/40 , C07D317/46 , C07D317/58 , C07D333/20 , C07D405/12 , C07D407/12
摘要： Novel diketoacid compounds of Formula I are provided which are useful as HIV integrase inhibitors and for the treatment of AIDS or ARC.
摘要翻译：提供式I的新型二酮酸化合物，其可用作HIV整合酶抑制剂和用于治疗AIDS或ARC。

7. 再颁专利

USRE38049E1 Optimized container stacked capacitor dram cell utilizing sacrificial oxide deposition and chemical mechanical polishing 失效
标题翻译：利用牺牲氧化物沉积和化学机械抛光优化容器堆叠电容器电容器
公开(公告)号：USRE38049E1
公开(公告)日：2003-03-25
申请号：US08759058
申请日：1996-10-07
申请人： Charles H. Dennison , Michael A. Walker
发明人： Charles H. Dennison , Michael A. Walker
IPC分类号： H01L2120
CPC分类号： H01L28/91
摘要： An existing stacked capacitor fabrication process is modified to construct a three-dimensional stacked container capacitor. The present invention develops the container capacitor by etching an opening (or contact opening) into a low etch rate oxide. The contact opening is used as a form for deposited polysilicon that conforms to the sides of the opening walls. Within the thin poly lining of the oxide container a high etch-rate oxide, such as ozone TEOS, is deposited over the entire structure thereby bridging across the top of the oxide container. The high etch-rate oxide is planarized back to the thin poly and the resulting exposed poly is then removed to separate neighboring containers. The two oxides, having different etch rates, are then etched thereby leaving a free-standing poly container cell with 100% (or all) of the higher etch rate oxide removed and a pre-determined oxide surrounding the container still intact.
摘要翻译：修改现有的堆叠电容器制造工艺以构建三维堆叠容器电容器。本发明通过将开口（或接触开口）蚀刻成低蚀刻速率氧化物来开发容器电容器。接触开口用作与开口壁的侧面一致的沉积多晶硅的形式。在氧化物容器的薄多孔衬里内，在整个结构上沉积诸如臭氧TEOS的高蚀刻速率氧化物，从而桥接穿过氧化物容器的顶部。将高蚀刻速率的氧化物平面化回到薄的多晶硅上，然后除去所得到的暴露的聚合物以分离相邻的容器。然后蚀刻具有不同蚀刻速率的两种氧化物，从而留下独立的多容器电池，其具有100％（或全部）更高蚀刻速率的氧化物，并且包围容器的预定氧化物仍然完整。

8. 发明授权

US06521534B1 Treatment of exposed silicon and silicon dioxide surfaces 有权
标题翻译：处理暴露的硅和二氧化硅表面
公开(公告)号：US06521534B1
公开(公告)日：2003-02-18
申请号：US09639369
申请日：2000-08-15
申请人： Karl M. Robinson , Michael A. Walker
发明人： Karl M. Robinson , Michael A. Walker
IPC分类号： H01L21302
CPC分类号： H01L21/02052 , B08B3/08 , C11D7/06 , C11D7/08 , C11D11/0047 , H01L21/67051 , H01L21/67057
摘要： A chemical mechanical polishing step is performed to expose a silicon/silicon dioxide interface on a surface situated on a semiconductor substrate. The semiconductor substrate is dipped in a solution of about 200 parts of deionized water, about 1 part of hydrofluoric acid, and at least 5 parts tetramethyl ammonium hydroxide. The exposed silicon/silicon dioxide interface is then contacted with an organic carboxylic acid surfactant having a critical micelle concentration greater than or equal to 1−7 m/l and having a pH from about 2.2 to about 7. Lastly, the exposed silicon/silicon dioxide interface is rinsed in deionized water or sulfuric acid to remove silicon dioxide particles from the exposed silicon/silicon dioxide interface, leaving a very clean, low particulate surface on both the silicon dioxide and silicon portions thereof, with little or no etching of the silicon portion.
摘要翻译：进行化学机械抛光步骤以暴露位于半导体衬底上的表面上的硅/二氧化硅界面。将半导体衬底浸入约200份去离子水，约1份氢氟酸和至少5份氢氧化四甲基铵溶液中。然后暴露的硅/二氧化硅界面与具有大于或等于1-7m / l的临界胶束浓度并且具有约2.2至约7的pH的有机羧酸表面活性剂接触。最后，暴露的硅/硅二氧化硅界面在去离子水或硫酸中漂洗以从暴露的硅/二氧化硅界面中除去二氧化硅颗粒，在其二氧化硅和硅部分上留下非常干净的低颗粒表面，几乎没有或没有蚀刻硅一部分。

9. 发明授权

US06296557B1 Method and apparatus for releasably attaching polishing pads to planarizing machines in mechanical and/or chemical-mechanical planarization of microelectronic-device substrate assemblies 失效
标题翻译：在微电子器件衬底组件的机械和/或化学机械平面化中将抛光垫可释放地附接到平面化机器的方法和装置
公开(公告)号：US06296557B1
公开(公告)日：2001-10-02
申请号：US09285319
申请日：1999-04-02
申请人： Michael A. Walker
发明人： Michael A. Walker
IPC分类号： B24D1100
CPC分类号： B24B37/26 , B24D9/085
摘要： A method and an apparatus for releasably attaching a polishing pad to a support surface under the polishing pad. In one embodiment of the invention, a polishing pad has a first surface for planarizing a substrate assembly, a second surface contacting the support surface, and an interlocking element. The support surface has a retaining member configured to engage the interlocking element on the polishing pad. The interlocking element and retaining member can be any one of several configurations, including: tongue and groove, protuberance and depression, reciprocal elongated ridges, or teeth.
摘要翻译：一种用于将抛光垫可释放地附接到抛光垫下方的支撑表面的方法和装置。在本发明的一个实施例中，抛光垫具有用于平坦化基板组件的第一表面，接触支撑表面的第二表面和互锁元件。支撑表面具有构造成与抛光垫上的互锁元件接合的保持构件。互锁元件和保持构件可以是几种构造中的任何一种，包括：舌和凹槽，凸起和凹陷，往复的细长脊或齿。

10. 发明授权

US06277015B1 Polishing pad and system 有权
标题翻译：抛光垫和系统
公开(公告)号：US06277015B1
公开(公告)日：2001-08-21
申请号：US09300007
申请日：1999-04-26
申请人： Karl M. Robinson , Michael A. Walker
发明人： Karl M. Robinson , Michael A. Walker
IPC分类号： B24D1100
CPC分类号： B24B37/26 , B24B41/047
摘要： The present invention comprises a method of chemical-mechanical polishing of a surface on a semiconductor substrate by providing a fixed-abrasive polishing pad; providing a surface to be polished; and providing a chemical polishing solution containing a surface tension-lowering agent that lowers the surface tension of the solution from the nominal surface tension of water to a surface tension that sufficiently wets a hydrophobic surface to be polished such that chemical-mechanical polishing is accomplished. The present invention also comprises pad improvements that mechanically sweep the polishing solution under the pad or that receive polishing solution from the back of the pad such that a tangential and radial shear is placed on the polishing solution as it flows away from the pad.
摘要翻译：本发明包括通过提供固定研磨抛光垫对半导体衬底上的表面进行化学机械抛光的方法; 提供要抛光的表面; 并且提供含有表面张力降低剂的化学抛光溶液，其将溶液的表面张力从水的标称表面张力降低到充分润湿要抛光的疏水表面的表面张力，从而实现化学机械抛光。本发明还包括垫片改进，其将抛光溶液机械地扫过垫片下方或者从垫的背面接收抛光溶液，使得当抛光溶液从衬垫流出时，切向和径向剪切被放置在抛光溶液上。

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