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    • 2. 发明授权
    • Light-emitting-element array
    • 发光元件阵列
    • US06858875B2
    • 2005-02-22
    • US10630936
    • 2003-07-31
    • Hiroshi HamanoMasumi TaninakaMasaharu NoboriMasumi Koizumi
    • Hiroshi HamanoMasumi TaninakaMasaharu NoboriMasumi Koizumi
    • H01L23/12B41J2/45H01L27/15H01L33/08H01L33/30H01L33/48H01L33/00H01L21/00
    • H01L27/153B41J2/45
    • A light-emitting-element array has a semiconductor layer formed on a current-blocking layer. Light-emitting elements are formed in the semiconductor layer by diffusion of an impurity of a different conductive type. An isolation trench divides the semiconductor layer into a first region and a remaining region, and divides the array of light-emitting elements into segments disposed alternately in these two regions, each segment preferably including one or two light-emitting elements. A first shared interconnecting pad is electrically coupled to the light-emitting elements in the first region by electrical paths not crossing the isolation trench. A second shared interconnecting pad is electrically coupled to light-emitting elements in the remaining semiconductor region by electrical paths crossing the isolation trench. The array can then be driven by a number of separate interconnecting pads equal to half the number of the light-emitting elements.
    • 发光元件阵列具有形成在电流阻挡层上的半导体层。 通过不同导电类型的杂质的扩散在半导体层中形成发光元件。 隔离沟槽将半导体层划分成第一区域和剩余区域,并且将发光元件阵列分成交替布置在这两个区域中的区段,每个区段优选地包括一个或两个发光元件。 第一共享互连焊盘通过不穿过隔离沟槽的电路径电耦合到第一区域中的发光元件。 第二共享互连焊盘通过穿过隔离沟槽的电路径电耦合到剩余半导体区域中的发光元件。 阵列然后可以由等于发光元件数量的一半的多个单独的互连焊盘驱动。
    • 7. 发明授权
    • Light-emitting element array having an element separating region
    • 具有元件分离区域的发光元件阵列
    • US06717184B2
    • 2004-04-06
    • US10253730
    • 2002-09-23
    • Masumi TaninakaMasaharu NoboriMitsuhiko Ogihara
    • Masumi TaninakaMasaharu NoboriMitsuhiko Ogihara
    • H01L2715
    • H01L27/153
    • A light-emitting array can be driven by a matrix-type driving operation. When the packaging density of light-emitting elements is to be increased, the width of the element-separating region should be made narrower. The element-separating region extends over a considerable distance and therefore is apt to be adversely affected by particles. This tends to prevent formation of a good element-separating region, lowering manufacturing yield. An n-side electrode is arranged close to a predetermined number of LEDs. An element-separating region is formed to surround the LEDs and the n-side electrode, thereby defining a plurality of n-type semiconductor blocks. The element-separating region has a first portion that extends in a direction parallel to the line of the LEDs aligned and a second portion that extend between adjacent blocks. The first portion is wider than the second portion.
    • 发光阵列可以通过矩阵型驱动操作来驱动。 当要增加发光元件的封装密度时,应使元件分离区的宽度变窄。 元件分离区域延伸相当长的距离,因此容易受到颗粒的不利影响。 这倾向于防止形成良好的元素分离区域,降低制造成品率。 n侧电极靠近预定数量的LED布置。 形成元件分离区域以包围LED和n侧电极,从而限定多个n型半导体块。 元件分离区域具有沿平行于LED对准线的方向延伸的第一部分和在相邻块之间延伸的第二部分。 第一部分比第二部分宽。