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    • 1. 发明授权
    • Light-emitting element array having an element separating region
    • 具有元件分离区域的发光元件阵列
    • US06717184B2
    • 2004-04-06
    • US10253730
    • 2002-09-23
    • Masumi TaninakaMasaharu NoboriMitsuhiko Ogihara
    • Masumi TaninakaMasaharu NoboriMitsuhiko Ogihara
    • H01L2715
    • H01L27/153
    • A light-emitting array can be driven by a matrix-type driving operation. When the packaging density of light-emitting elements is to be increased, the width of the element-separating region should be made narrower. The element-separating region extends over a considerable distance and therefore is apt to be adversely affected by particles. This tends to prevent formation of a good element-separating region, lowering manufacturing yield. An n-side electrode is arranged close to a predetermined number of LEDs. An element-separating region is formed to surround the LEDs and the n-side electrode, thereby defining a plurality of n-type semiconductor blocks. The element-separating region has a first portion that extends in a direction parallel to the line of the LEDs aligned and a second portion that extend between adjacent blocks. The first portion is wider than the second portion.
    • 发光阵列可以通过矩阵型驱动操作来驱动。 当要增加发光元件的封装密度时,应使元件分离区的宽度变窄。 元件分离区域延伸相当长的距离,因此容易受到颗粒的不利影响。 这倾向于防止形成良好的元素分离区域,降低制造成品率。 n侧电极靠近预定数量的LED布置。 形成元件分离区域以包围LED和n侧电极,从而限定多个n型半导体块。 元件分离区域具有沿平行于LED对准线的方向延伸的第一部分和在相邻块之间延伸的第二部分。 第一部分比第二部分宽。
    • 3. 发明授权
    • LED array
    • LED阵列
    • US06211537B1
    • 2001-04-03
    • US09040450
    • 1998-03-18
    • Takatoku ShimizuMitsuhiko OgiharaMasumi TaninakaHiroshi Hamano
    • Takatoku ShimizuMitsuhiko OgiharaMasumi TaninakaHiroshi Hamano
    • H01L3300
    • B41J2/45H01L27/153H01L33/0008
    • A 1200 dpi LED may be manufactured without highly accurate mask alignment and provide good light radiation efficiency. A first interlayer dielectric is formed on a semiconductor substrate and has a plurality of first windows formed therein and aligned in a row. A diffusion region is formed in the semiconductor substrate through each of the first windows. An electrode is formed to have an area in contact with the corresponding diffusion region. Another electrode is formed on the other side of the substrate. A second interlayer dielectric is formed on the first interlayer dielectric such that the second interlayer dielectric does not overlap the area of the electrode and does not extend to a first perimeter of the area.
    • 可以在没有高精度掩模对准的情况下制造1200dpi的LED,并提供良好的光辐射效率。 第一层间电介质形成在半导体衬底上,并且具有形成在其中的多个第一窗口并排成一行。 通过每个第一窗口在半导体衬底中形成扩散区域。 电极形成为具有与相应的扩散区域接触的区域。 另一电极形成在基板的另一侧。 第二层间电介质形成在第一层间电介质上,使得第二层间电介质不与电极的区域重叠,并且不延伸到该区域的第一周边。
    • 5. 发明授权
    • Method of manufacturing light-receiving/emitting diode array chip
    • 制造光接收/发光二极管阵列芯片的方法
    • US5972729A
    • 1999-10-26
    • US31534
    • 1998-02-27
    • Takatoku ShimizuMitsuhiko OgiharaMasumi TaninakaHiroshi Hamano
    • Takatoku ShimizuMitsuhiko OgiharaMasumi TaninakaHiroshi Hamano
    • B41J2/44B41J2/45B41J2/455H01L21/301H01L27/15H01L31/10H01L33/08H01L33/30H01L33/44H01L33/48H01L33/00
    • H01L27/153B41J2/45H01L33/0008Y10S438/975
    • A method of manufacturing a light-emitting or a light-receiving diode array chip. A first interlayer dielectric is formed in each of a plurality of chip areas on a substrate of a first conductivity type. Impurity diffusion regions of a second conductivity type are formed in the substrate using the first interlayer dielectric as a diffusion mask. An electrode is formed in contact with each of the impurity diffusion regions. The substrate is separated so that the plurality of chip areas are separated into individual chips. A second interlayer dielectric may be formed on the first interlayer dielectric after forming the impurity diffusion regions. The second interlayer dielectric is formed such that the second interlayer dielectric is absent from a second area along which the substrate is separated into the individual chips, at least in the vicinity of the last one of a plurality of windows. Island-shaped patterns may be formed on the interlayer dielectric so as to hold the interlayer dielectric onto the substrate. The first interlayer dielectric may be removed such that the first interlayer dielectric is absent from the second area, at least in the vicinity of the last one of the plurality of windows.
    • 一种制造发光或光接收二极管阵列芯片的方法。 在第一导电类型的衬底上的多个芯片区域中的每一个中形成第一层间电介质。 使用第一层间电介质作为扩散掩模,在衬底中形成第二导电类型的杂质扩散区域。 形成与每个杂质扩散区接触的电极。 分离基板使得多个芯片区域分离为单独的芯片。 在形成杂质扩散区之后,可以在第一层间电介质上形成第二层间电介质。 第二层间电介质形成为使得第二层间电介质不存在于第二区域中,至少在多个窗口中的最后一个窗口附近,基板沿着该第二区域分离成单独的芯片。 可以在层间电介质上形成岛状图案,以将层间电介质保持在基板上。 可以去除第一层间电介质,使得至少在多个窗口中的最后一个窗口附近,第二区域中不存在第一层间电介质。
    • 6. 发明授权
    • Method of fabricating an LED array
    • 制造LED阵列的方法
    • US5869221A
    • 1999-02-09
    • US997735
    • 1997-12-24
    • Mitsuhiko OgiharaYukio NakamuraTakatoku ShimizuMasumi Taninaka
    • Mitsuhiko OgiharaYukio NakamuraTakatoku ShimizuMasumi Taninaka
    • H01L27/15G03F9/00
    • H01L27/153
    • A method of fabricating an LED array includes forming a first insulating film composed of aluminum oxide on a semiconductor substrate of a first conductive type; patterning the first insulating film by photolithography to form a plurality of first windows; diffusing an impurity of a second conductive type through the plurality of first windows into the first insulating film, thereby forming a plurality of diffusion regions of the second conductive type below the plurality of first windows; forming a second insulating film on the first insulating film and the plurality of first windows; patterning the second insulating film by photolithography to-remove the second insulating film from the plurality of first windows, using an etchant that does not etch the first insulating film; forming a metal film on the second insulating film and the plurality of first windows; and patterning the metal film by photolithography to form a plurality of electrodes which make electrical contact with respective diffusion regions.
    • 制造LED阵列的方法包括在第一导电类型的半导体衬底上形成由氧化铝构成的第一绝缘膜; 通过光刻图案化第一绝缘膜以形成多个第一窗口; 将通过所述多个第一窗口的第二导电类型的杂质扩散到所述第一绝缘膜中,从而在所述多个第一窗口的下方形成所述第二导电类型的多个扩散区域; 在所述第一绝缘膜和所述多个第一窗口上形成第二绝缘膜; 使用不蚀刻第一绝缘膜的蚀刻剂通过光刻图案化第二绝缘膜以从多个第一窗口去除第二绝缘膜; 在所述第二绝缘膜和所述多个第一窗口上形成金属膜; 并通过光刻法形成金属膜以形成与各个扩散区电接触的多个电极。
    • 8. 发明授权
    • Light-emitting-element array
    • 发光元件阵列
    • US06858875B2
    • 2005-02-22
    • US10630936
    • 2003-07-31
    • Hiroshi HamanoMasumi TaninakaMasaharu NoboriMasumi Koizumi
    • Hiroshi HamanoMasumi TaninakaMasaharu NoboriMasumi Koizumi
    • H01L23/12B41J2/45H01L27/15H01L33/08H01L33/30H01L33/48H01L33/00H01L21/00
    • H01L27/153B41J2/45
    • A light-emitting-element array has a semiconductor layer formed on a current-blocking layer. Light-emitting elements are formed in the semiconductor layer by diffusion of an impurity of a different conductive type. An isolation trench divides the semiconductor layer into a first region and a remaining region, and divides the array of light-emitting elements into segments disposed alternately in these two regions, each segment preferably including one or two light-emitting elements. A first shared interconnecting pad is electrically coupled to the light-emitting elements in the first region by electrical paths not crossing the isolation trench. A second shared interconnecting pad is electrically coupled to light-emitting elements in the remaining semiconductor region by electrical paths crossing the isolation trench. The array can then be driven by a number of separate interconnecting pads equal to half the number of the light-emitting elements.
    • 发光元件阵列具有形成在电流阻挡层上的半导体层。 通过不同导电类型的杂质的扩散在半导体层中形成发光元件。 隔离沟槽将半导体层划分成第一区域和剩余区域,并且将发光元件阵列分成交替布置在这两个区域中的区段,每个区段优选地包括一个或两个发光元件。 第一共享互连焊盘通过不穿过隔离沟槽的电路径电耦合到第一区域中的发光元件。 第二共享互连焊盘通过穿过隔离沟槽的电路径电耦合到剩余半导体区域中的发光元件。 阵列然后可以由等于发光元件数量的一半的多个单独的互连焊盘驱动。