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1. 发明申请

US20050167814A1 Method of making microelectronic packages including electrically and/or thermally conductive element 审中-公开
标题翻译：制造包括电和/或导热元件的微电子封装的方法
公开(公告)号：US20050167814A1
公开(公告)日：2005-08-04
申请号：US11091880
申请日：2005-03-28
申请人： Masud Beroz , Bob Wen Kong , Michael Warner
发明人： Masud Beroz , Bob Wen Kong , Michael Warner
IPC分类号： H01L21/56 , H01L21/68 , H01L23/13 , H01L23/24 , H01L23/31 , H01L23/367 , H01L23/433 , H01L23/492 , H01L23/498 , H01L23/552 , H01L23/22
CPC分类号： H01L21/561 , H01L21/565 , H01L21/6835 , H01L23/13 , H01L23/24 , H01L23/3114 , H01L23/3128 , H01L23/3675 , H01L23/4334 , H01L23/492 , H01L23/49816 , H01L23/4985 , H01L23/552 , H01L24/26 , H01L24/48 , H01L24/83 , H01L24/97 , H01L2224/05599 , H01L2224/45099 , H01L2224/48091 , H01L2224/48227 , H01L2224/73153 , H01L2224/8319 , H01L2224/83801 , H01L2224/85399 , H01L2224/97 , H01L2225/0651 , H01L2225/0652 , H01L2225/06582 , H01L2225/06589 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/16152 , H01L2924/181 , H01L2924/3025 , H01L2224/83 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： A method of manufacturing a plurality of microelectronic packages including electrically and/or thermally conductive elements. The method includes providing a support structure having a plurality of protrusions and depressions extending outwardly from the support. A conductive element is then mated to the support structure in a male-to-female relationship. The depressions formed in the support structure and conductive element are used to house a microelectronic element such as a semiconductor chip. A substrate is provided so as to cover substantially each depression located in the conductive element. Leads interconnect contacts to the chip to terminals on the substrate. A curable encapsulant material may be deposited into the depression so as to protect and support the leads and the microelectronic element. Additionally, the curable encapsulant material forms part of the exterior of a single resulting chip package once the assembly is diced and cut into individual packages.
摘要翻译：一种制造包括电和/或导热元件的多个微电子封装件的方法。该方法包括提供具有从支撑体向外延伸的多个突起和凹陷的支撑结构。然后将导电元件以男性与女性的关系配合到支撑结构。在支撑结构和导电元件中形成的凹陷用于容纳诸如半导体芯片的微电子元件。提供基板以便基本上覆盖位于导电元件中的每个凹部。引线将接触芯片连接到基板上的端子。可固化的密封剂材料可以沉积到凹陷中，以保护和支撑引线和微电子元件。此外，一旦组装被切割并切割成单独的包装，可固化的密封剂材料形成单个所得的芯片封装的外部的一部分。

2. 发明授权

US07176506B2 High frequency chip packages with connecting elements 有权
标题翻译：具有连接元件的高频芯片封装
公开(公告)号：US07176506B2
公开(公告)日：2007-02-13
申请号：US10746810
申请日：2003-12-24
申请人： Masud Beroz , Michael Warner , Lee Smith , Glenn Urbish , Teck-Gyu Kang , Jae M. Park , Yoichi Kubota
发明人： Masud Beroz , Michael Warner , Lee Smith , Glenn Urbish , Teck-Gyu Kang , Jae M. Park , Yoichi Kubota
IPC分类号： H01L27/148
CPC分类号： G06F21/10 , G06F2221/2129 , H01F17/0033 , H01L23/24 , H01L23/3107 , H01L23/3114 , H01L23/36 , H01L23/3675 , H01L23/4334 , H01L23/49531 , H01L23/49575 , H01L23/49822 , H01L23/49838 , H01L23/49861 , H01L23/5387 , H01L23/552 , H01L23/645 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/50 , H01L25/0652 , H01L25/0657 , H01L25/16 , H01L2223/6611 , H01L2224/05569 , H01L2224/05571 , H01L2224/05573 , H01L2224/16145 , H01L2224/16235 , H01L2224/32245 , H01L2224/45014 , H01L2224/451 , H01L2224/48091 , H01L2224/4824 , H01L2224/4911 , H01L2224/73253 , H01L2224/73257 , H01L2224/73265 , H01L2224/85207 , H01L2225/0651 , H01L2225/06513 , H01L2225/06517 , H01L2225/0652 , H01L2225/06527 , H01L2225/06541 , H01L2225/06551 , H01L2225/06572 , H01L2225/06579 , H01L2225/06582 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01007 , H01L2924/01013 , H01L2924/01014 , H01L2924/01023 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01031 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01061 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2924/10253 , H01L2924/12042 , H01L2924/15311 , H01L2924/1532 , H01L2924/15331 , H01L2924/15787 , H01L2924/16152 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19103 , H01L2924/19107 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H01L2924/00 , H01L2224/05599
摘要： A radio frequency chip package is formed by assembling a connecting element such as a circuit board or flexible circuit tape having chips thereon with a bottom plane element such as a lead frame incorporating a large thermally-conductive plate and leads projecting upwardly from the plane of the plate. The assembly step places the rear surfaces of the chips on the bottom side of the connecting element into proximity with the thermal conductor and joins the conductive traces on the connecting element with the leads. The resulting assembly is encapsulated, leaving terminals at the bottom ends of the leads exposed. The encapsulated assembly may be surface-mounted to a circuit board. The leads provide robust electrical connections between the connecting element and the circuit board.
摘要翻译：射频芯片封装通过将诸如电路板的连接元件或其上具有芯片的柔性电路带与诸如引入框架的底部平面元件组合而形成，该引线框架包括大的导热板，并且从该平面盘子。组装步骤将芯片的后表面放置在连接元件的底侧，与导热体接近，并将连接元件上的导电迹线与导线连接。所得的组件被封装，导致引线的底端处的端子被暴露。封装的组件可以表面安装到电路板。引线在连接元件和电路板之间提供牢固的电连接。

3. 发明申请

US20060275951A1 Microelectronic assemblies having low profile connections 审中-公开
标题翻译：具有薄型连接的微电子组件
公开(公告)号：US20060275951A1
公开(公告)日：2006-12-07
申请号：US11487880
申请日：2006-07-17
申请人： Michael Warner , Masud Beroz , David Light , Delin Li , Dennis Castillo , Hung-ming Wang , John Smith
发明人： Michael Warner , Masud Beroz , David Light , Delin Li , Dennis Castillo , Hung-ming Wang , John Smith
IPC分类号： H01L21/00
CPC分类号： H01L24/10 , H01L23/3128 , H01L23/3135 , H01L23/49816 , H01L23/49827 , H01L23/4985 , H01L23/5389 , H01L24/13 , H01L2224/05001 , H01L2224/05022 , H01L2224/05572 , H01L2224/13 , H01L2224/13022 , H01L2224/13099 , H01L2224/73204 , H01L2224/81193 , H01L2224/8193 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/00 , H01L2224/05644 , H01L2924/00014 , H01L2224/05647 , H01L2224/05655 , H01L2224/05666 , H01L2224/05671 , H01L2224/05124
摘要： A microelectronic assembly includes a first microelectronic element having a first face and contacts accessible at the first face, and a layer of a dielectric material having a bottom surface contacting the first microelectronic element, a top surface facing away from the first microelectronic element and holes extending between the top and bottom faces in alignment with the contacts on the first microelectronic element. The assembly includes conductive protrusions extending through the holes to the contacts, the conductive protrusions projecting beyond the top surface of the dielectric layer. The assembly also has a second microelectronic element having a first surface with conductive elements being accessible at the first surface thereof, the second microelectronic element being assembled with the first microelectronic element so that the contacts of the second microelectronic element are connected with the conductive protrusions and the top surface of the dielectric layer is spaced from the first surface of the second microelectronic element.
摘要翻译：微电子组件包括具有第一面和在第一面可接触的触点的第一微电子元件和具有接触第一微电子元件的底表面的电介质材料层，背离第一微电子元件的顶表面和延伸在顶面和底面之间，与第一微电子元件上的触点对齐。组件包括延伸穿过孔到触头的导电突起，导电突出部突出超过电介质层的顶表面。组件还具有第二微电子元件，其具有第一表面，其导电元件在其第一表面处可访问，第二微电子元件与第一微电子元件组装，使得第二微电子元件的触点与导电突起连接，电介质层的顶表面与第二微电子元件的第一表面间隔开。

4. 发明申请

US20060113645A1 Microelectronic assemblies incorporating inductors 审中-公开
公开(公告)号：US20060113645A1
公开(公告)日：2006-06-01
申请号：US11327057
申请日：2006-01-06
申请人： Michael Warner , Belgacem Haba , Masud Beroz
发明人： Michael Warner , Belgacem Haba , Masud Beroz
IPC分类号： H01L23/495
摘要： Inductors are provided in chip assemblies such as in packaged semiconductor chips. The inductors may be incorporated in a chip carrier which forms part of the package, and may include, for example, spiral or serpentine inductors formed from traces on the chip carrier. The chip carrier may include a flap bearing the inductive element, and this flap may be bent to tilt the inductive element out of the plane of the chip carrier to reduce electromagnetic interaction between the inductive element and surrounding electrical components. Other inductors include solenoids formed in part by leads on the chip carrier as, for example, by displacing leads out of the plane of the chip carrier to form loops in vertically-extensive planes transverse to the plane of the chip carrier. Additional features provide trimming of the inductor to a desired inductance value during by breaking or connecting leads during assembly.

5. 发明申请

US20060108698A1 Microelectronic assemblies and methods of making microelectronic assemblies 审中-公开
标题翻译：微电子组件和制造微电子组件的方法
公开(公告)号：US20060108698A1
公开(公告)日：2006-05-25
申请号：US11196724
申请日：2005-08-03
申请人： Masud Beroz , Michael Warner
发明人： Masud Beroz , Michael Warner
IPC分类号： H01L23/48 , H01L21/48
CPC分类号： H05K13/046 , H01L2224/16225 , H01L2924/00014 , Y10T29/4913 , Y10T29/49144 , Y10T29/49146 , Y10T29/49147 , Y10T29/49149 , Y10T29/49169 , H01L2224/0401
摘要： A microelectronic subassembly includes a substrate having a first surface, and one or more microelectronic elements positioned above the first surface of the substrate, each microelectronic element having a contact bearing face confronting the first surface of the substrate and a back surface remote therefrom. The subassembly includes a substantially rigid plate attached to the back surfaces of the microelectronic elements, an array of flexible leads extending between the substrate and the microelectronic elements, the leads having first ends attached to the substrate and second ends attached to the contacts of the microelectronic elements, and an at least partially cured spacer material sandwiched between the substantially rigid plate and the substrate for holding the contact bearing faces of the microelectronic elements at a precise height above the substrate.
摘要翻译：微电子子组件包括具有第一表面的衬底和位于衬底的第一表面上方的一个或多个微电子元件，每个微电子元件具有面对衬底的第一表面的接触支承面和远离衬底的后表面。子组件包括附接到微电子元件的后表面的基本上刚性的板，在衬底和微电子元件之间延伸的柔性引线的阵列，引线具有连接到衬底的第一端和附接到微电子器件的触点的第二端元件以及夹在基本上刚性的板和基底之间的至少部分固化的间隔物材料，用于将微电子元件的接触支承面保持在衬底上方的精确高度。

6. 发明申请

US20070096160A1 High frequency chip packages with connecting elements 审中-公开
公开(公告)号：US20070096160A1
公开(公告)日：2007-05-03
申请号：US11640765
申请日：2006-12-18
申请人： Masud Beroz , Michael Warner , Lee Smith , Glenn Urbish , Teck-Gyu Kang , Jae Park , Yoichi Kubota
发明人： Masud Beroz , Michael Warner , Lee Smith , Glenn Urbish , Teck-Gyu Kang , Jae Park , Yoichi Kubota
IPC分类号： H01L27/148
摘要： A radio frequency chip package is formed by assembling a connecting element such as a circuit board or flexible circuit tape having chips thereon with a bottom plane element such as a lead frame incorporating a large thermally-conductive plate and leads projecting upwardly from the plane of the plate. The assembly step places the rear surfaces of the chips on the bottom side of the connecting element into proximity with the thermal conductor and joins the conductive traces on the connecting element with the leads. The resulting assembly is encapsulated, leaving terminals at the bottom ends of the leads exposed. The encapsulated assembly may be surface-mounted to a circuit board. The leads provide robust electrical connections between the connecting element and the circuit board.

7. 发明授权

US07012323B2 Microelectronic assemblies incorporating inductors 有权
标题翻译：包含电感器的微电子组件
公开(公告)号：US07012323B2
公开(公告)日：2006-03-14
申请号：US10452333
申请日：2003-06-02
申请人： Michael Warner , Belgacem Haba , Masud Beroz
发明人： Michael Warner , Belgacem Haba , Masud Beroz
IPC分类号： H01L23/48
CPC分类号： G06F21/10 , G06F2221/2129 , H01F17/0033 , H01L23/24 , H01L23/3107 , H01L23/3114 , H01L23/36 , H01L23/3675 , H01L23/4334 , H01L23/49531 , H01L23/49575 , H01L23/49822 , H01L23/49838 , H01L23/49861 , H01L23/5387 , H01L23/552 , H01L23/645 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/50 , H01L25/0652 , H01L25/0657 , H01L25/16 , H01L2223/6611 , H01L2224/05569 , H01L2224/05571 , H01L2224/05573 , H01L2224/05599 , H01L2224/12105 , H01L2224/16145 , H01L2224/16235 , H01L2224/32145 , H01L2224/32245 , H01L2224/45014 , H01L2224/45099 , H01L2224/451 , H01L2224/48091 , H01L2224/48145 , H01L2224/48225 , H01L2224/48227 , H01L2224/4824 , H01L2224/4911 , H01L2224/73204 , H01L2224/73207 , H01L2224/73253 , H01L2224/73257 , H01L2224/73265 , H01L2224/85207 , H01L2224/85399 , H01L2225/0651 , H01L2225/06513 , H01L2225/06517 , H01L2225/0652 , H01L2225/06527 , H01L2225/06541 , H01L2225/06551 , H01L2225/06568 , H01L2225/06572 , H01L2225/06579 , H01L2225/06582 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01007 , H01L2924/01013 , H01L2924/01014 , H01L2924/01023 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01031 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01061 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2924/10253 , H01L2924/12042 , H01L2924/15311 , H01L2924/1532 , H01L2924/15331 , H01L2924/15787 , H01L2924/16152 , H01L2924/19011 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19103 , H01L2924/19104 , H01L2924/19105 , H01L2924/19107 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H03H9/0542 , H03H9/0547 , H03H9/1064 , H03H2009/0019 , H01L2924/00 , H01L2224/45015 , H01L2924/207 , H01L2924/00012
摘要： Inductors are provided in chip assemblies such as in packaged semiconductor chips. The inductors may be incorporated in a chip carrier which forms part of the package, and may include, for example, spiral or serpentine inductors formed from traces on the chip carrier. The chip carrier may include a flap bearing the inductive element, and this flap may be bent to tilt the inductive element out of the plane of the chip carrier to reduce electromagnetic interaction between the inductive element and surrounding electrical components. Other inductors include solenoids formed in part by leads on the chip carrier as, for example, by displacing leads out of the plane of the chip carrier to form loops in vertically-extensive planes transverse to the plane of the chip carrier. Additional features provide trimming of the inductor to a desired inductance value during by breaking or connecting leads during assembly.
摘要翻译：电感器设置在诸如封装半导体芯片的芯片组件中。电感器可以结合在构成封装的一部分的芯片载体中，并且可以包括例如由芯片载体上的迹线形成的螺旋或蛇形电感器。芯片载体可以包括承载感应元件的翼片，并且该翼片可以被弯曲以将感应元件倾斜到芯片载体的平面之外，以减小电感元件和周围的电气部件之间的电磁相互作用。其他电感器包括由芯片载体上的引线部分地形成的螺线管，例如通过将引线移出芯片载体的平面而在横向于芯片载体的平面的垂直方向的平面中形成环。附加特征提供了在组装期间通过断开或连接引线将电感器修整到期望的电感值。

8. 发明授权

US07268426B2 High-frequency chip packages 有权
标题翻译：高频芯片封装
公开(公告)号：US07268426B2
公开(公告)日：2007-09-11
申请号：US10783314
申请日：2004-02-20
申请人： Michael Warner , Lee Smith , Belgacem Haba , Glenn Urbish , Masud Beroz , Teck-Gyu Kang
发明人： Michael Warner , Lee Smith , Belgacem Haba , Glenn Urbish , Masud Beroz , Teck-Gyu Kang
IPC分类号： H01L23/10 , H01L23/34
CPC分类号： G06F21/10 , G06F2221/2129 , H01F17/0033 , H01L23/24 , H01L23/3107 , H01L23/3114 , H01L23/36 , H01L23/3675 , H01L23/4334 , H01L23/49531 , H01L23/49575 , H01L23/49822 , H01L23/49838 , H01L23/49861 , H01L23/5387 , H01L23/552 , H01L23/645 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/50 , H01L25/0652 , H01L25/0657 , H01L25/16 , H01L2223/6611 , H01L2224/05569 , H01L2224/05571 , H01L2224/05573 , H01L2224/05599 , H01L2224/12105 , H01L2224/16145 , H01L2224/16235 , H01L2224/32145 , H01L2224/32245 , H01L2224/45014 , H01L2224/45099 , H01L2224/451 , H01L2224/48091 , H01L2224/48145 , H01L2224/48225 , H01L2224/48227 , H01L2224/4824 , H01L2224/4911 , H01L2224/73204 , H01L2224/73207 , H01L2224/73253 , H01L2224/73257 , H01L2224/73265 , H01L2224/85207 , H01L2224/85399 , H01L2225/0651 , H01L2225/06513 , H01L2225/06517 , H01L2225/0652 , H01L2225/06527 , H01L2225/06541 , H01L2225/06551 , H01L2225/06568 , H01L2225/06572 , H01L2225/06579 , H01L2225/06582 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01007 , H01L2924/01013 , H01L2924/01014 , H01L2924/01023 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01031 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01061 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2924/10253 , H01L2924/12042 , H01L2924/15311 , H01L2924/1532 , H01L2924/15331 , H01L2924/15787 , H01L2924/16152 , H01L2924/19011 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19103 , H01L2924/19104 , H01L2924/19105 , H01L2924/19107 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H03H9/0542 , H03H9/0547 , H03H9/1064 , H03H2009/0019 , H01L2924/00 , H01L2224/45015 , H01L2924/207 , H01L2924/00012
摘要： A packaged semiconductor chip includes features such as a chip carrier having a large thermal conductor which can be solder-bonded to a circuit panel so as to provide enhanced thermal conductivity to the circuit panel and electromagnetic shielding and a conductive enclosure which partially or completely surrounds the packaged chip to provide additional heat dissipation and shielding. The packaged unit may include both an active semiconductor chip and a passive element, desirably in the form of a chip, which includes resistors and capacitors. Inductors may be provided in whole or in part on the chip carrier.
摘要翻译：封装的半导体芯片包括诸如具有大导热体的芯片载体的特征，其可以焊接到电路板上，以便为电路板提供增强的导热性和电磁屏蔽，以及导电外壳，其部分地或完全地围绕封装芯片提供额外的散热和屏蔽。封装单元可以包括有源半导体芯片和无源元件，期望地包括芯片形式，其包括电阻器和电容器。电感器可以全部或部分地设置在芯片载体上。

9. 发明授权

US07098074B2 Microelectronic assemblies having low profile connections 有权
标题翻译：具有薄型连接的微电子组件
公开(公告)号：US07098074B2
公开(公告)日：2006-08-29
申请号：US10699328
申请日：2003-10-31
申请人： Michael Warner , Masud Beroz , David Light , Delin Li , Dennis Castillo , Hung-ming Wang , John W. Smith
发明人： Michael Warner , Masud Beroz , David Light , Delin Li , Dennis Castillo , Hung-ming Wang , John W. Smith
IPC分类号： H01L21/44 , H01L21/48 , H01L21/50
CPC分类号： H01L24/10 , H01L23/3128 , H01L23/3135 , H01L23/49816 , H01L23/49827 , H01L23/4985 , H01L23/5389 , H01L24/13 , H01L2224/05001 , H01L2224/05022 , H01L2224/05572 , H01L2224/13 , H01L2224/13022 , H01L2224/13099 , H01L2224/73204 , H01L2224/81193 , H01L2224/8193 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/00 , H01L2224/05644 , H01L2924/00014 , H01L2224/05647 , H01L2224/05655 , H01L2224/05666 , H01L2224/05671 , H01L2224/05124
摘要： A method is disclosed for making a microelectronic package. A material is applied to a first major surface of a microelectronic element to reduce the heights of protrusions projecting from the first major surface. The microelectronic element is assembled to a microelectronic component. A method of forming protrusions and an assembly incorporating the microelectronic element having protrusions is also disclosed.
摘要翻译：公开了一种制造微电子封装的方法。将材料施加到微电子元件的第一主表面以减小从第一主表面突出的突起的高度。微电子元件组装到微电子元件上。还公开了一种形成突起的方法和包括具有突起的微电子元件的组件。

10. 发明授权

US06959489B2 Methods of making microelectronic packages 有权
标题翻译：制造微电子封装的方法
公开(公告)号：US06959489B2
公开(公告)日：2005-11-01
申请号：US09956448
申请日：2001-09-19
申请人： Masud Beroz , Michael Warner
发明人： Masud Beroz , Michael Warner
IPC分类号： H05K13/04 , H05K3/34
CPC分类号： H05K13/046 , H01L2224/16225 , H01L2924/00014 , Y10T29/4913 , Y10T29/49144 , Y10T29/49146 , Y10T29/49147 , Y10T29/49149 , Y10T29/49169 , H01L2224/0401
摘要： A method of making a microelectronic package includes providing a substrate having a plurality of conductive leads at a first surface of the substrate. The conductive leads may have first ends permanently attached to the substrate and second ends remote from the terminal ends, the second ends being movable relative to the first ends of the leads. One or more microelectronic elements having contact bearing surfaces and back surfaces remote therefrom may be juxtaposed with the substrate and the contacts connected with the first ends of the leads. A substantially rigid plate may be attached to the back surfaces of the microelectronic elements. The substantially rigid plate may be moved to a precise height above the substrate to vertically extend the leads. While the plate is maintained at the precise height above the substrate, a spacer material is dispensed between the plate and the substrate. The spacer material is then at least partially cured for holding the plate at the precise height above the substrate.
摘要翻译：制造微电子封装的方法包括在衬底的第一表面处提供具有多个导电引线的衬底。导电引线可以具有永久地附着到基板的第一端和远离端子的第二端，第二端可相对于引线的第一端移动。具有接触轴承表面和远离其的后表面的一个或多个微电子元件可以与衬底并置，并且与引线的第一端连接。基本上刚性的板可附接到微电子元件的背面。基本上刚性的板可以移动到衬底上方的精确高度以垂直地延伸引线。当板保持在衬底上方的精确高度时，间隔材料被分配在板和衬底之间。然后将间隔物材料至少部分地固化以将板保持在衬底上方的精确高度。

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