会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 1. 发明授权
    • Semiconductor integrated circuit device
    • 半导体集成电路器件
    • US5654577A
    • 1997-08-05
    • US476761
    • 1995-06-07
    • Masayuki NakamuraKazuyuki MiyazawaHidetoshi Iwai
    • Masayuki NakamuraKazuyuki MiyazawaHidetoshi Iwai
    • H01L27/04G11C11/408H01L21/822H01L21/8238H01L27/092H01L27/10H01L27/105H01L27/108H01L29/76
    • H01L27/105
    • A semiconductor integrated circuit device includes in a substrate a P-type well region containing a memory array section in which dynamic memory cells are arranged in a matrix. The P-type well region is fed with a back bias voltage whose absolute value is reduced so as to be the most suitable for the refresh characteristics. Also included is a P-well region wherein there are formed N-channel MOSFETs of a peripheral circuit this P-well region is fed with a back bias voltage whose absolute value is smaller than that of the potential fed to the P-type well of the memory array section, considering the high-speed operation. A P-type well section, wherein there is formed are N-channel MOSFETs of an input circuit or an output circuit connected with external terminals, is fed with a back bias voltage whose absolute value is made large considering an undershoot voltage. The P-type well region provided with the memory array section is fed with a requisite minimum back bias voltage. Accordingly, the P-type well region provided with the input circuit or the output circuit corresponding to the external terminals is fed with the back bias voltage to provide a measure of protection against undershoot, while the refresh characteristics are improved by reducing the leakage current between the source/drain region connected with a capacitor and the P-type well, to thereby raise the operation speed of the peripheral circuit can be raised.
    • 半导体集成电路器件在衬底中包括含有存储器阵列部分的P型阱区域,其中动态存储器单元被布置成矩阵。 P型阱区域馈送有绝对值减小的背偏置电压,以便最适合刷新特性。 还包括P阱区,其中形成外围电路的N沟道MOSFET,该P阱区被馈送反馈偏压,其绝对值小于馈送到P型阱的电位的绝对值 存储器阵列部分,考虑高速运行。 其中形成有输入电路的N沟道MOSFET或与外部端子连接的输出电路的P型阱区,考虑到下冲电压,馈送绝对值较大的反向偏置电压。 设置有存储器阵列部分的P型阱区域被馈送必需的最小反向偏置电压。 因此,设置有与外部端子相对应的输入电路或输出电路的P型阱区域被馈送有反向偏置电压,以提供对下冲的保护措施,同时通过减小刷新特性来减小 可以提高与电容器和P型阱连接的源极/漏极区域,从而提高外围电路的操作速度。
    • 2. 发明授权
    • Semiconductor integrated circuit device
    • 半导体集成电路器件
    • US06906971B2
    • 2005-06-14
    • US10767078
    • 2004-01-30
    • Masayuki NakamuraKazuyuki MiyazawaHidetoshi Iwai
    • Masayuki NakamuraKazuyuki MiyazawaHidetoshi Iwai
    • H01L27/04G11C11/408H01L21/822H01L21/8238H01L27/092H01L27/10H01L27/105G11C7/00
    • H01L27/105
    • A semiconductor IC device includes, in a substrate, a P-type well region having a dynamic memory array section and applied with a reduced back bias voltage suitable for refreshing. Also included is a P-well region where N-channel MOSFETs of a peripheral circuit are formed. This P-well region is applied with a back bias voltage of an absolute value smaller than that applied to the P-type well of the memory array section. A P-type well section, where there are formed N-channel MOSFETs of an input circuit or an output circuit connected with external terminals, is applied with a back bias voltage of an absolute value large enough to provide a measure of protection against undershoot, while the refresh characteristics are improved by reducing the leakage current between the source/drain region connected with a capacitor and the P-type well, to thereby raise the operation speed of the peripheral circuit.
    • 半导体IC器件在衬底中包括具有动态存储器阵列部分并且施加有适于刷新的减小的背偏压的P型阱区。 还包括形成外围电路的N沟道MOSFET的P阱区。 该P阱区域施加的绝对值的反偏压小于施加到存储器阵列部分的P型阱的绝对值。 形成输入电路的N沟道MOSFET或与外部端子连接的输出电路的P型阱部分被施加绝对值足够大的背偏压以提供防止下冲的保护措施, 同时通过减少与电容器连接的源极/漏极区域与P型阱之间的漏电流来改善刷新特性,从而提高外围电路的操作速度。
    • 3. 发明授权
    • Semiconductor integrated circuit device
    • 半导体集成电路器件
    • US6078084A
    • 2000-06-20
    • US823167
    • 1997-03-25
    • Masayuki NakamuraKazuyuki MiyazawaHidetoshi Iwai
    • Masayuki NakamuraKazuyuki MiyazawaHidetoshi Iwai
    • H01L27/04G11C11/408H01L21/822H01L21/8238H01L27/092H01L27/10H01L27/105H01L27/108
    • H01L27/105
    • A semiconductor integrated circuit device includes in a P-type well region containing a memory substrate a array section in which dynamic memory cells are arranged in a matrix. The P-type well region is fed with a back bias voltage whose absolute value is reduced so as to be the most suitable for the refresh characteristics. Also included is a P-well region wherein there are formed N-channel MOSFETs of a peripheral circuit this P-well region is fed with a back bias voltage whose absolute value is smaller than that of the potential fed to the P-type well of the memory array section, considering the high-speed operation. A P-type well section, wherein there is formed are N-channel MOSFETs of an input circuit or an output circuit connected with external terminals, is fed with a back bias voltage whose absolute value is made large considering an undershoot voltage. The P-type well region provided with the memory array section is fed with a requisite minimum back bias voltage. Accordingly, the P-type well region provided with the input circuit or the output circuit corresponding to the external terminals is fed with the back bias voltage to provide a measure of protection against undershoot, while the refresh characteristics are improved by reducing the leakage current between the source/drain region connected with a capacitor and the P-type well, to thereby raise the operation speed of the peripheral circuit can be raised.
    • 半导体集成电路器件包括在包含存储器基板的P型阱区中,其中动态存储单元以矩阵形式布置在其中。 P型阱区域馈送有绝对值减小的背偏置电压,以便最适合刷新特性。 还包括P阱区,其中形成外围电路的N沟道MOSFET,该P阱区被馈送反馈偏压,其绝对值小于馈送到P型阱的电位的绝对值 存储器阵列部分,考虑高速运行。 其中形成有输入电路的N沟道MOSFET或与外部端子连接的输出电路的P型阱区,考虑到下冲电压,馈送绝对值较大的反向偏置电压。 设置有存储器阵列部分的P型阱区域被馈送必需的最小反向偏置电压。 因此,设置有与外部端子相对应的输入电路或输出电路的P型阱区域被馈送有反向偏置电压,以提供对下冲的保护措施,同时通过减小刷新特性来减小 可以提高与电容器和P型阱连接的源极/漏极区域,从而提高外围电路的操作速度。
    • 6. 发明授权
    • Semiconductor integrated circuit device having a first MISFET of an
output buffer circuit and a second MISFET of an internal circuit
    • 具有输出缓冲电路的第一MISFET和内部电路的第二MISFET的半导体集成电路器件
    • US5436483A
    • 1995-07-25
    • US142965
    • 1993-10-29
    • Hidetoshi IwaiKazumichi MitsusadaMasamichi IshiharaTetsuro MatsumotoKazuyuki MiyazawaHisao KattoKousuke Okuyama
    • Hidetoshi IwaiKazumichi MitsusadaMasamichi IshiharaTetsuro MatsumotoKazuyuki MiyazawaHisao KattoKousuke Okuyama
    • H01L21/8238H01L21/8242H01L27/02H01L27/092H01L29/78H01L29/06
    • H01L21/823864H01L27/0251H01L27/0266H01L27/0922H01L27/10873H01L29/78
    • Disclosed is a semiconductor device having an internal circuit protected by an electrostatic protective circuit, the internal circuit and electrostatic protective circuit being formed on the same semiconductor substrate. The internal circuit includes MIS elements and has a double-diffused drain structure, while the protective circuit has a single-diffused drain structure. The internal circuit can be, e.g., a DRAM, and the protective circuit can have diffused resistors and clamping MIS elements. The single-diffused drain structure can be formed in the protective circuit on the semiconductor substrate, while providing double-diffused drain structure in the internal circuit on the same substrate, by: (1) scanning the ion implanting apparatus to avoid ion implantation of the first ions into the region of the protective circuit, and/or (2) forming a photoresist film over the region of the protective circuit to prevent ion implanation of the first ions into the protective circuit region. As a further embodiment of the present invention, a semiconductor integrated circuit device is provided wherein the source and drain regions of an MOSFET in the internal circuit have lightly doped drain (LDD) structure in order to suppress the appearance of hot carriers, and the source and drain regions of an MOSFET in the input/output circuit have structure doped with phosphorus at a high impurity concentration, in order to enhance an electrostatic breakdown voltage.
    • 公开了具有被静电保护电路保护的内部电路的半导体器件,内部电路和静电保护电路形成在同一半导体衬底上。 内部电路包括MIS元件,并具有双扩散漏极结构,而保护电路具有单扩散漏极结构。 内部电路可以是例如DRAM,并且保护电路可以具有扩散电阻器和钳位MIS元件。 单扩散漏极结构可以形成在半导体衬底上的保护电路中,同时通过以下步骤在同一衬底上的内部电路中提供双扩散漏极结构:(1)扫描离子注入装置以避免离子注入 第一离子进入保护电路的区域,和/或(2)在保护电路的区域上形成光致抗蚀剂膜,以防止第一离子离子注入保护电路区域。 作为本发明的另一实施例,提供了一种半导体集成电路器件,其中内部电路中的MOSFET的源极和漏极区域具有轻掺杂漏极(LDD)结构,以便抑制热载流子的出现,源极 并且输入/输出电路中的MOSFET的漏极区域掺杂有高杂质浓度的磷的结构,以增强静电击穿电压。
    • 9. 发明授权
    • Semiconductor integrated circuit device having input protective elements
and internal circuits
    • 具有输入保护元件和内部电路的半导体集成电路器件
    • US5436484A
    • 1995-07-25
    • US143151
    • 1993-10-29
    • Hidetoshi IwaiKazumichi MitsusadaMasamichi IshiharaTetsuro MatsumotoKazuyuki MiyazawaHisao KattoKousuke Okuyama
    • Hidetoshi IwaiKazumichi MitsusadaMasamichi IshiharaTetsuro MatsumotoKazuyuki MiyazawaHisao KattoKousuke Okuyama
    • H01L21/8238H01L21/8242H01L27/02H01L27/092H01L29/78H01L29/06
    • H01L21/823864H01L27/0251H01L27/0266H01L27/0922H01L27/10873H01L29/78
    • Disclosed is a semiconductor device having an internal circuit protected by an electrostatic protective circuit, the internal circuit and electrostatic protective circuit being formed on the same semiconductor substrate. The internal circuit includes MIS elements and has a double-diffused drain structure, while the protective circuit has a single-diffused drain structure. The internal circuit can be, e.g., a DRAM, and the protective circuit can have diffused resistors and clamping MIS elements. The single-diffused drain structure can be formed in the protective circuit on the semiconductor substrate, while providing double-diffused drain structure in the internal circuit on the same substrate, by: (1) scanning the ion implanting apparatus to avoid ion implantation of the first ions into the region of the protective circuit, and/or (2) forming a photoresist film over the region of the protective circuit to prevent ion implanation of the first ions into the protective circuit region. As a further embodiment of the present invention, a semiconductor integrated circuit device is provided wherein the source and drain regions of an MOSFET in the internal circuit have lightly doped drain (LDD) structure in order to suppress the appearance of hot carriers, and the source and drain regions of an MOSFET in the input/output circuit have structure doped with phosphorus at a high impurity concentration, in order to enhance an electrostatic breakdown voltage.
    • 公开了具有被静电保护电路保护的内部电路的半导体器件,内部电路和静电保护电路形成在同一半导体衬底上。 内部电路包括MIS元件,并具有双扩散漏极结构,而保护电路具有单扩散漏极结构。 内部电路可以是例如DRAM,并且保护电路可以具有扩散电阻器和钳位MIS元件。 单扩散漏极结构可以形成在半导体衬底上的保护电路中,同时通过以下步骤在同一衬底上的内部电路中提供双扩散漏极结构:(1)扫描离子注入装置以避免离子注入 第一离子进入保护电路的区域,和/或(2)在保护电路的区域上形成光致抗蚀剂膜,以防止第一离子离子注入保护电路区域。 作为本发明的另一实施例,提供了一种半导体集成电路器件,其中内部电路中的MOSFET的源极和漏极区域具有轻掺杂漏极(LDD)结构,以便抑制热载流子的出现,源极 并且输入/输出电路中的MOSFET的漏极区域掺杂有高杂质浓度的磷的结构,以增强静电击穿电压。
    • 10. 发明授权
    • Semiconductor integrated circuit device having protective/output
elements and internal circuits
    • 具有保护/输出元件和内部电路的半导体集成电路器件
    • US5276346A
    • 1994-01-04
    • US815863
    • 1992-01-02
    • Hidetoshi IwaiKazumichi MitsusadaMasamichi IshiharaTetsuro MatsumotoKazuyuki MiyazawaHisao KattoKousuke Okuyama
    • Hidetoshi IwaiKazumichi MitsusadaMasamichi IshiharaTetsuro MatsumotoKazuyuki MiyazawaHisao KattoKousuke Okuyama
    • H01L21/8238H01L21/8242H01L27/02H01L27/092H01L29/78H01L29/06
    • H01L21/823864H01L27/0251H01L27/0266H01L27/0922H01L27/10873H01L29/78
    • Disclosed is a semiconductor device having an internal circuit protected by an electrostatoc protective circuit, the internal circuit and electrostatic protective circuit being formed on the same semiconductor substrate. The internal circuit includes MIS elements and has a double-diffused drain structure, while the protective circuit has a single-diffused drain structure. The internal circuit can be, e.g., a DRAM, and the protective circuit can have diffused resistors and clamping MIS elements. The single-diffused drain structure can be formed in the protective circuit on the semiconductor substrate, while providing double-diffused drain structure in the internal circuit on the same substrate, by: (1) scanning the ion implanting apparatus to avoid ion implantation of the first ions into the region of the protective circuit, and/or (2) forming a photoresist film over the region of the protective circuit to prevent ion implanation of the first ions into the protective circuit region. As a further embodiment of the present invention, a semiconductor integrated circuit device is provided wherein the source and drain regions of an MOSFET in the internal circuit have lightly doped drain (LDD) structure in order to suppress the appearance of hot carriers, and the source and drain regions of an MOSFET in the input/output circuit have structure doped with phosphorus at a high impurity concentration, in order to enhance an electrostatic breakdown voltage.
    • 本发明公开了一种半导体器件,其具有由静电场保护电路保护的内部电路,内部电路和静电保护电路形成在同一半导体衬底上。 内部电路包括MIS元件,并具有双扩散漏极结构,而保护电路具有单扩散漏极结构。 内部电路可以是例如DRAM,并且保护电路可以具有扩散电阻器和钳位MIS元件。 单扩散漏极结构可以形成在半导体衬底上的保护电路中,同时通过以下步骤在同一衬底上的内部电路中提供双扩散漏极结构:(1)扫描离子注入装置以避免离子注入 第一离子进入保护电路的区域,和/或(2)在保护电路的区域上形成光致抗蚀剂膜,以防止第一离子离子注入保护电路区域。 作为本发明的另一个实施例,提供一种半导体集成电路器件,其中内部电路中的MOSFET的源极和漏极区域具有轻掺杂漏极(LDD)结构,以便抑制热载流子的出现,源极 并且输入/输出电路中的MOSFET的漏极区域掺杂有高杂质浓度的磷的结构,以增强静电击穿电压。