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1. 发明申请

US20120027040A1 SEMICONDUCTOR LASER APPARATUS AND OPTICAL APPARATUS 失效
标题翻译：半导体激光装置和光学装置
公开(公告)号：US20120027040A1
公开(公告)日：2012-02-02
申请号：US13189637
申请日：2011-07-25
申请人： Masayuki HATA , Hideki YOSHIKAWA
发明人： Masayuki HATA , Hideki YOSHIKAWA
IPC分类号： H01S5/026
CPC分类号： H01S5/4093 , H01L2224/73265 , H01L2924/10155 , H01S5/02236 , H01S5/0224 , H01S5/02256 , H01S5/02276 , H01S5/0683 , H01S5/4031
摘要： In this semiconductor laser apparatus, a first wire-bonding portion is arranged at a position in a fourth direction from a first semiconductor laser device and in a first direction from a photodetector, and a second wire-bonding portion is arranged at a position in the fourth direction from the first semiconductor laser device and in a third direction from the first wire-bonding portion. A third wire-bonding portion is arranged at a position in a second direction from a third semiconductor laser device and in the first direction from the photodetector, and a fourth wire-bonding portion is arranged at a position in the second direction from the third semiconductor laser device and in the third direction from the third wire-bonding portion.
摘要翻译：在该半导体激光装置中，第一引线接合部配置在从第一半导体激光装置向第四方向的位置，在第一方向配置于光检测器，第二引线接合部配置在从第一半导体激光器件的第四方向和从第一引线接合部分的第三方向。第三引线接合部分布置在距离第三半导体激光器件的第二方向的位置处，并且在第一方向上被布置在从光电检测器的第一方向上，并且第四引线接合部分布置在从第三半导体激光装置，并且从第三引线接合部向第三方向。

2. 发明申请

US20120033696A1 SEMICONDUCTOR LASER APPARATUS AND OPTICAL APPARATUS 审中-公开
标题翻译：半导体激光装置和光学装置
公开(公告)号：US20120033696A1
公开(公告)日：2012-02-09
申请号：US13191847
申请日：2011-07-27
申请人： Nobuhiko HAYASHI , Hideki YOSHIKAWA , Keiichi KURAMOTO
发明人： Nobuhiko HAYASHI , Hideki YOSHIKAWA , Keiichi KURAMOTO
IPC分类号： H01S5/022
CPC分类号： H01S5/02204 , H01L2224/48091 , H01L2224/48247 , H01S5/02212 , H01S5/02216 , H01S5/02244 , H01S5/0683 , H01S5/32341 , H01L2924/00014
摘要： This semiconductor laser apparatus includes a package having sealed space inside and a semiconductor laser chip arranged in the sealed space. The package has a first member and a second member bonded to each other with an adhesive, a covering agent made of an ethylene-vinyl alcohol copolymer is formed on a bonded region of the first member and the second member in the sealed space, and the adhesive is covered with the covering agent.
摘要翻译：该半导体激光装置包括内部具有密封空间的封装和设置在密封空间中的半导体激光芯片。该封装具有第一部件和第二部件，其中粘合剂彼此粘合，在密封空间中的第一部件和第二部件的接合区域上形成由乙烯 - 乙烯醇共聚物制成的覆盖剂，粘合剂被覆盖剂覆盖。

3. 发明申请

US20120033695A1 SEMICONDUCTOR LASER APPARATUS AND OPTICAL APPARATUS 审中-公开
标题翻译：半导体激光装置和光学装置
公开(公告)号：US20120033695A1
公开(公告)日：2012-02-09
申请号：US13191683
申请日：2011-07-27
申请人： Nobuhiko HAYASHI , Hideki YOSHIKAWA , Keiichi KURAMOTO , Takenori GOTO , Yoshio OKAYAMA , Seiichi TOKUNAGA
发明人： Nobuhiko HAYASHI , Hideki YOSHIKAWA , Keiichi KURAMOTO , Takenori GOTO , Yoshio OKAYAMA , Seiichi TOKUNAGA
IPC分类号： H01S5/022
CPC分类号： H01S5/02204 , H01L2224/48091 , H01L2224/48247 , H01S5/02212 , H01S5/02216 , H01S5/02244 , H01S5/02296 , H01S5/0683 , H01S5/32341 , H01L2924/00014
摘要： This semiconductor laser apparatus includes a package constituted by a plurality of members, having sealed space inside and a semiconductor laser chip arranged in the sealed space, while surfaces of the members located in the sealed space are covered with a covering agent made of an ethylene-polyvinyl alcohol copolymer.
摘要翻译：该半导体激光装置包括由内部具有密封空间的多个构件和布置在密封空间中的半导体激光器芯片构成的封装，同时位于密封空间中的构件的表面被覆盖有由乙烯 - 聚乙烯醇共聚物。

4. 发明申请

US20110280267A1 SEMICONDUCTOR LASER APPARATUS AND OPTICAL APPARATUS 审中-公开
标题翻译：半导体激光装置和光学装置
公开(公告)号：US20110280267A1
公开(公告)日：2011-11-17
申请号：US13106006
申请日：2011-05-12
申请人： Hideki YOSHIKAWA , Nobuhiko HAYASHI
发明人： Hideki YOSHIKAWA , Nobuhiko HAYASHI
IPC分类号： H01S5/02
CPC分类号： H01S5/02216 , G11B7/1275 , G11B2007/0006 , H01L2224/48091 , H01S5/0222 , H01S5/02228 , H01S5/02296 , H01S5/02469 , H01S5/0683 , H01S5/4087 , H04N9/3114 , H04N9/3161 , H01L2924/00014
摘要： This semiconductor laser apparatus includes a semiconductor laser chip and a package sealing the semiconductor laser chip. The package includes a base body made of resin, a first sealing member mounted on an upper surface of the base body and a translucent second sealing member mounted on a front surface of the base body. The base body has an opening passing through the base body from the upper surface to the front surface, and the side of the opening closer to the upper surface is sealed with the first sealing member, while the side of the opening closer to the front surface is sealed with the second sealing member.
摘要翻译：该半导体激光装置包括半导体激光芯片和密封半导体激光芯片的封装。包装体包括由树脂制成的基体，安装在基体的上表面上的第一密封构件和安装在基体的前表面上的半透明的第二密封构件。基体具有从上表面到前表面通过基体的开口，并且靠近上表面的开口侧用第一密封构件密封，同时开口的靠近前表面的侧面用第二密封构件密封。

5. 发明申请

US20110280266A1 SEMICONDUCTOR LASER APPARATUS, METHOD OF MANUFACTURING SEMICONDUCTOR LASER APPARATUS AND OPTICAL APPARATUS 审中-公开
标题翻译：半导体激光装置，制造半导体激光装置和光学装置的方法
公开(公告)号：US20110280266A1
公开(公告)日：2011-11-17
申请号：US13106123
申请日：2011-05-12
申请人： Nobuhiko HAYASHI , Hideki YOSHIKAWA , Keiichi KURAMOTO , Yasuhiko NOMURA , Takenori GOTO , Yoshio OKAYAMA , Seiichi TOKUNAGA
发明人： Nobuhiko HAYASHI , Hideki YOSHIKAWA , Keiichi KURAMOTO , Yasuhiko NOMURA , Takenori GOTO , Yoshio OKAYAMA , Seiichi TOKUNAGA
IPC分类号： H01S5/022 , H01L21/52
CPC分类号： H01S5/02216 , H01L2224/48091 , H01L2224/49107 , H01L2224/73265 , H01L2924/16195 , H01S5/02212 , H01S5/0222 , H01S5/02228 , H01S5/02244 , H01S5/02292 , H01S5/02296 , H01S5/02469 , H01S5/0683 , H01L2924/00014
摘要： This semiconductor laser apparatus includes a semiconductor laser chip and a package sealing the semiconductor laser chip. The package has a base portion mounted with the semiconductor laser chip, a sealing member and a window member. The semiconductor laser chip is sealed with the base portion, the sealing member and the window member. At least two of the base portion, the sealing member and the window member are bonded to each other through a sealant made of an ethylene-polyvinyl alcohol copolymer.
摘要翻译：该半导体激光装置包括半导体激光芯片和密封半导体激光芯片的封装。封装具有安装有半导体激光芯片的基座部分，密封构件和窗构件。半导体激光芯片由基部，密封部件和窗部件密封。基部，密封构件和窗构件中的至少两个通过由乙烯 - 聚乙烯醇共聚物制成的密封剂彼此接合。

6. 发明申请

US20070239014A1 BLOOD FLOW IMAGING 有权
标题翻译：血液流动成像
公开(公告)号：US20070239014A1
公开(公告)日：2007-10-11
申请号：US11675711
申请日：2007-02-16
申请人： Hideki YOSHIKAWA , Takashi AZUMA
发明人： Hideki YOSHIKAWA , Takashi AZUMA
IPC分类号： A61B8/00
CPC分类号： A61B8/5276 , A61B8/06 , A61B8/13
摘要： Blood-flow image display equipment for displaying a CFM image that is not affected by a motion of a tissue in an object area during capturing of images or is affected in a reduced manner. The blood-flow image display equipment has following components: a transmitting controller for controlling transmission triggers of a signal for B-mode and a signal for CFM based on a velocity of motion of an object; an ultrasonic transducer in which piezoelectric ultrasonic transducers each for transmitting/receiving an ultrasonic wave to/from the object are arranged in the form of an array; a B-mode image construction unit for constructing a B-mode image with received signals; a motion detector for measuring a motion vector of the object using the B-mode image; a receiving unit for CFM signal for receiving the signal for CFM from the ultrasonic transducer; a time-series signal storage unit for CFM that collects a CFM measurement region located in the same area of the object based on the motion vector measured by the motion detector and stores them in memory in time sequence; and an autocorrelation processing unit for performing autocorrelation processing on time-series CFM signals.
摘要翻译：用于在拍摄图像期间显示不受物体区域内的组织的运动影响的CFM图像的血流图像显示设备，或者以减少的方式影响。血流图像显示装置具有以下部件：发送控制器，用于基于物体的运动速度控制用于B模式的信号的传输触发和用于CFM的信号; 超声波换能器以阵列的形式布置有用于向/从物体发送/接收超声波的压电超声换能器， B模式图像构造单元，用于构造具有接收信号的B模式图像; 运动检测器，用于使用B模式图像测量对象的运动矢量; 用于CFM信号的接收单元，用于从超声换能器接收用于CFM的信号; 用于CFM的时间序列信号存储单元，其基于由运动检测器测量的运动矢量来收集位于对象的相同区域中的CFM测量区域，并将它们以时间顺序存储在存储器中; 以及自相关处理单元，用于对时间序列CFM信号执行自相关处理。

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