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1. 发明授权

US5476414A Polishing apparatus 失效
标题翻译：抛光设备
公开(公告)号：US5476414A
公开(公告)日：1995-12-19
申请号：US124550
申请日：1993-09-22
申请人： Masayoshi Hirose , Manabu Tsujimura , Seiji Ishikawa , Norio Kimura , You Ishii
发明人： Masayoshi Hirose , Manabu Tsujimura , Seiji Ishikawa , Norio Kimura , You Ishii
IPC分类号： B24B37/10 , B24B37/30 , H01L21/304 , B24B7/22
CPC分类号： H01L21/02024 , B24B37/107 , B24B37/30
摘要： A workpiece such as a semiconductor wafer is supported on a top ring and polished by an abrasive cloth on a turntable while the top ring is being pressed against the turntable and the turntable and the top ring are being rotated. The top ring is coupled to a top ring drive shaft, coupled to a pressure cylinder for pressing the top ring, and to a motor for rotating the top ring. A spherical bearing is interposed between the top ring and the top ring drive shaft for allowing the top ring to align with the upper surface of the moving turntable. A torque transmitting mechanism is operatively coupled between the top ring and the top ring drive shaft for rotating the top ring in synchronization with the top ring drive shaft.
摘要翻译：诸如半导体晶片的工件被支撑在顶环上并且通过研磨布在转盘上抛光，同时顶环被压靠在转台上，并且转台和顶环正在旋转。顶环联接到顶环驱动轴，联接到用于按压顶环的压力缸，以及用于旋转顶环的电动机。在顶环和顶环驱动轴之间插入有球面轴承，用于允许顶环与活动转台的上表面对准。扭矩传递机构可操作地联接在顶环和顶环驱动轴之间，用于与顶环驱动轴同步地旋转顶环。

2. 再颁专利

USRE38878E1 Polishing apparatus 失效
标题翻译：抛光设备
公开(公告)号：USRE38878E1
公开(公告)日：2005-11-15
申请号：US08993893
申请日：1997-12-18
申请人： Masayoshi Hirose , Manabu Tsujimura , Seiji Ishikawa , Norio Kimura , You Ishii
发明人： Masayoshi Hirose , Manabu Tsujimura , Seiji Ishikawa , Norio Kimura , You Ishii
IPC分类号： B24B7/22 , B24B37/04
CPC分类号： B24B37/107 , B24B37/30
摘要： A workpiece such as a semiconductor wafer is supported on a top ring and polished by an abrasive cloth on a turntable while the top ring is being pressed against the turntable and the turntable and the top ring are being rotated. The top ring is coupled to a top ring drive shaft, coupled to a pressure cylinder for pressing the top ring, and to a motor for rotating the top ring. A spherical bearing is interposed between the top ring and the top ring drive shaft for allowing the top ring to align with the upper surface of the moving turntable. A torque transmitting mechanism is operatively coupled between the top ring and the top ring drive shaft for rotating the top ring in synchronization with the top ring drive shaft.
摘要翻译：诸如半导体晶片的工件被支撑在顶环上并且通过研磨布在转盘上抛光，同时顶环被压靠在转台上，并且转台和顶环正在旋转。顶环联接到顶环驱动轴，联接到用于按压顶环的压力缸，以及用于旋转顶环的电动机。在顶环和顶环驱动轴之间插入有球面轴承，用于允许顶环与活动转台的上表面对准。扭矩传递机构可操作地联接在顶环和顶环驱动轴之间，用于与顶环驱动轴同步地旋转顶环。

3. 再颁专利

USRE38228E1 Polishing apparatus 失效
标题翻译：抛光设备和方法
公开(公告)号：USRE38228E1
公开(公告)日：2003-08-19
申请号：US08789304
申请日：1997-01-30
申请人： Masayoshi Hirose , Seiji Ishikawa , Norio Kimura , Kiyotaka Kawashima , You Ishii
发明人： Masayoshi Hirose , Seiji Ishikawa , Norio Kimura , Kiyotaka Kawashima , You Ishii
IPC分类号： B24B100
CPC分类号： B24B53/017 , B24B37/26
摘要： A turntable with an abrasive cloth mounted thereon and a top ring positioned above the turntable are independently rotatably provided. The top ring holds a workpiece to be polished and presses the workpiece against the abrasive cloth. The turntable and the top ring are rotated to polish the surface of the workpiece to a flat mirror finish on the abrasive cloth. A rotatable brush pressed against the abrasive cloth is rotated about an axis substantially perpendicularly to the plane of the abrasive cloth, and oscillated substantially radially between radially inner and outer positions over the abrasive cloth. A cleaning solution is sprayed from a nozzle onto the abrasive cloth. The turntable has a bank along an outer circumferential edge thereto for preventing a protective solution, which is supplied to the abrasive cloth to keep the abrasive cloth wet and prevent it, from flowing off the turntable when the turntable is stationary.

4. 发明授权

US5384986A Polishing apparatus 失效
标题翻译：抛光设备
公开(公告)号：US5384986A
公开(公告)日：1995-01-31
申请号：US124648
申请日：1993-09-22
申请人： Masayoshi Hirose , Seiji Ishikawa , Norio Kimura , Kiyotaka Kawashima , You Ishii
发明人： Masayoshi Hirose , Seiji Ishikawa , Norio Kimura , Kiyotaka Kawashima , You Ishii
IPC分类号： B24B37/26 , B24B53/007 , B24B53/017 , B41J11/62
CPC分类号： B24B53/017 , B24B37/26
摘要： A turntable with an abrasive cloth mounted thereon and a top ring positioned above the turntable are independently rotatably provided. The top ring holds a workpiece to be polished and presses the workpiece against the abrasive cloth. The turntable and the top ring are rotated to polish the surface of the workpiece to a flat mirror finish on the abrasive cloth. A rotatable brush pressed against the abrasive cloth is rotated about an axis substantially perpendicularly to the plane of the abrasive cloth, and oscillated substantially radially between radially inner and outer positions over the abrasive cloth. A cleaning solution is sprayed from a nozzle onto the abrasive cloth. The turntable has a bank along an outer circumferential edge thereof for preventing a protective solution, which is supplied to the abrasive cloth to keep the abrasive cloth wet and prevent it, from flowing off the turntable when the turntable is stationary.
摘要翻译：安装有研磨布的转盘和位于转盘上方的顶环可独立地可旋转地设置。顶环保持要抛光的工件，并将工件压在研磨布上。转盘和顶环旋转以将工件的表面抛光到研磨布上的平整镜面上。压在研磨布上的可旋转刷子围绕基本上垂直于研磨布平面的轴线旋转，并且在磨料布的径向内部和外部位置之间基本径向摆动。将清洁溶液从喷嘴喷射到研磨布上。转台沿其外圆周边缘具有一个堤，用于防止当转台静止时供给磨料以保持磨料湿润并防止磨损的保护溶液流出转台。

5. 发明授权

US5716264A Polishing apparatus 失效
标题翻译：抛光设备
公开(公告)号：US5716264A
公开(公告)日：1998-02-10
申请号：US683424
申请日：1996-07-18
申请人： Norio Kimura , Ritsuo Kikuta , You Ishii , Masayoshi Hirose
发明人： Norio Kimura , Ritsuo Kikuta , You Ishii , Masayoshi Hirose
IPC分类号： B24B37/00 , B24B53/007 , B24B21/18
CPC分类号： B24B53/017
摘要： A polishing apparatus is employed to polish an object to be polished by urging the surface of the object to be polished against the surface of a polishing cloth and causing a relative movement therebetween, while supplying a polishing liquid into an area between the object to be polished and the polishing cloth. A plurality of nozzles spray respective fluid jets to strike against the surface of the cloth. The plurality of nozzles include more than one type of nozzle which vary flow velocity, flow rate, angle of spray, and cross-sectional configuration of a jet. The plurality of nozzles have axes positioned at a location at different distances from the rotation axis of the polishing cloth.
摘要翻译：抛光装置用于通过将待抛光物体的表面推压在抛光布的表面上并在其之间相对移动，同时将抛光液体提供到待抛光对象之间的区域中来抛光待抛光物体和抛光布。多个喷嘴喷射相应的流体射流以抵靠布的表面。多个喷嘴包括不止一种类型的喷嘴，其改变流速，流速，喷射角度和射流的横截面构造。多个喷嘴具有位于与抛光布的旋转轴线不同的距离处的轴线。

6. 发明授权

US5398459A Method and apparatus for polishing a workpiece 失效
标题翻译：抛光工件的方法和设备
公开(公告)号：US5398459A
公开(公告)日：1995-03-21
申请号：US156641
申请日：1993-11-24
申请人： Katsuya Okumura , Tohru Watanabe , Riichirou Aoki , Hiroyuki Yano , Masako Kodera , Atsushi Shigeta , You Ishii , Norio Kimura , Masayoshi Hirose , Yukio Ikeda
发明人： Katsuya Okumura , Tohru Watanabe , Riichirou Aoki , Hiroyuki Yano , Masako Kodera , Atsushi Shigeta , You Ishii , Norio Kimura , Masayoshi Hirose , Yukio Ikeda
IPC分类号： B24B37/10 , B24B37/30 , B24B1/00
CPC分类号： B24B37/102 , B24B37/30
摘要： A workpiece such as a semiconductor wafer is positioned between a turntable and a top ring and polished by an abrasive cloth on the turntable while the top ring is being pressed against the turntable. The top ring has a retaining ring for preventing the workpiece from deviating from the lower surface of the top ring, and the retaining ring has an inside diameter larger than an outside diameter of the workpiece. The rotation of the turntable imparts a pressing force in a direction parallel to the upper surface of the turntable to the workpiece so that an outer periphery of the workpiece contacts an inner periphery of the retaining ring, and the rotation of the retaining ring imparts a rotational force to the workpiece so that the workpiece performs a planetary motion relative to the top ring in the retaining ring.
摘要翻译：诸如半导体晶片的工件位于转盘和顶环之间，并且当顶环被压靠在转盘上时，其通过研磨布在转盘上抛光。顶环具有用于防止工件偏离顶环的下表面的保持环，并且保持环的内径大于工件的外径。转台的转动使平台于转台上表面的方向向工件施加压力，使得工件的外周与保持环的内周接触，并且保持环的旋转赋予转动使工件相对于保持环中的顶环执行行星运动。

7. 发明授权

US5643056A Revolving drum polishing apparatus 失效
标题翻译：滚筒抛光装置
公开(公告)号：US5643056A
公开(公告)日：1997-07-01
申请号：US550117
申请日：1995-10-30
申请人： Masayoshi Hirose , Seiji Ishikawa , Norio Kimura , Yoshimi Sasaki , Kouki Yamada , Fujio Aoyama , Noburu Shimizu , Katsuya Okumura
发明人： Masayoshi Hirose , Seiji Ishikawa , Norio Kimura , Yoshimi Sasaki , Kouki Yamada , Fujio Aoyama , Noburu Shimizu , Katsuya Okumura
IPC分类号： B24B7/22 , B24B29/02 , B24B37/07 , B24B37/10 , H01L21/304 , B24B1/00
CPC分类号： B24B7/228 , B24B29/02 , B24B37/04
摘要： A drum-type polishing apparatus for producing a flat mirror polish on an object such as a semiconductor wafer, is capable of three degrees of freedom of movement of a drum member with respect to the wafer. The relative movements can be made, successively or simultaneously, at right angles to an axis of the drum, parallel to the surface of the wafer, as well as at any desired angular orientations. Combined with a follower device to provide automatic compensation for unevenness in pressing pressure applied to the wafer during polishing, the polishing apparatus offers outstanding uniformity in polishing quality and high productivity, even for large diameter wafers, with a comparatively modest investment in both facility space and equipment cost.
摘要翻译：用于在诸如半导体晶片的物体上制造平面镜抛光的滚筒式抛光装置能够使鼓构件相对于晶片具有三个自由度的移动。相对运动可以连续或同时地与滚筒的轴线成直角，平行于晶片的表面以及任何期望的角度取向。结合跟随装置，为抛光期间对晶片施加的压力压力的不均匀性提供自动补偿，抛光装置即使对于大直径晶片也具有优异的抛光质量均匀性和高生产率，在设备空间和设备成本

8. 发明授权

US5616063A Polishing apparatus 失效
标题翻译：抛光设备
公开(公告)号：US5616063A
公开(公告)日：1997-04-01
申请号：US309193
申请日：1994-09-20
申请人： Katsuya Okumura , Riichirou Aoki , Hiromi Yajima , Masako Kodera , Shirou Mishima , Atsushi Shigeta , Masayoshi Hirose , Norio Kimura , Seiji Ishikawa
发明人： Katsuya Okumura , Riichirou Aoki , Hiromi Yajima , Masako Kodera , Shirou Mishima , Atsushi Shigeta , Masayoshi Hirose , Norio Kimura , Seiji Ishikawa
IPC分类号： H01L21/302 , B08B1/04 , B24B27/00 , B24B37/04 , B24B37/34 , B24B51/00 , B24B55/12 , H01L21/00 , H01L21/677 , B24B49/00
CPC分类号： H01L21/67167 , B08B1/04 , B08B13/00 , B24B27/0023 , B24B37/04 , B24B37/345 , B24B51/00 , B24B55/12 , H01L21/67028 , H01L21/67046 , H01L21/67057 , H01L21/67161 , H01L21/67219 , H01L21/67745
摘要： A polishing apparatus is a cluster type of apparatus having a plurality of units which perform various operations. The polishing apparatus includes a universal transfer robot having at least one arm for transferring a workpiece, a plurality of units disposed around the universal transfer robot and including a loading unit for receiving the workpiece to be polished, at least one polishing unit for polishing the workpiece, at least one washing unit for washing the workpiece which has been polished and an unloading unit for receiving the cleaned workpiece. Discrete mechanisms respectively transfer a clean workpiece and a dirty workpiece amongst the units.
摘要翻译：抛光装置是具有执行各种操作的多个单元的集群类型的装置。抛光装置包括具有用于传送工件的至少一个臂的通用传送机器人，设置在通用传送机器人周围的多个单元，并且包括用于接收被抛光工件的装载单元，用于抛光工件的至少一个抛光单元至少一个用于清洗已经被抛光的工件的洗涤单元和用于接收清洁的工件的卸载单元。离散机构分别在单元之间传送清洁的工件和脏工件。

9. 发明授权

US06626736B2 Polishing apparatus 失效
标题翻译：抛光设备
公开(公告)号：US06626736B2
公开(公告)日：2003-09-30
申请号：US09893625
申请日：2001-06-29
申请人： Manabu Tsujimura , Norio Kimura
发明人： Manabu Tsujimura , Norio Kimura
IPC分类号： B24B100
CPC分类号： B24B37/04 , B24B21/04 , B24B37/005 , B24B49/12
摘要： A polishing apparatus is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish, and allows a polishing pad to be automatically replaced without stopping rotary or circulatory motion of a polishing table. The polishing apparatus comprises a polishing table for making rotary or circulatory motion, a top ring vertically movably disposed above the polishing table for removably holding a workpiece to be polished, a pair of rolls rotatable about their own axes and movable in unison with the polishing table, and a polishing pad which is wound on one of the rolls and supplied over an upper surface of the polishing table toward the other of the rolls.
摘要翻译：抛光装置用于将诸如半导体晶片的工件抛光到平面镜面，并且允许抛光垫被自动更换，而不会停止抛光台的旋转或循环运动。抛光装置包括用于进行旋转或循环运动的抛光台，可垂直移动地设置在抛光台上方的用于可移除地保持待抛光工件的顶环，可绕其自身轴线旋转并可与抛光台一起移动的一对辊以及抛光垫，其被卷绕在其中一个辊上并且被供给到抛光台的上表面朝向另一个辊。

10. 发明授权

US07387717B2 Method of performing electrolytic treatment on a conductive layer of a substrate 失效
标题翻译：在基板的导电层上进行电解处理的方法
公开(公告)号：US07387717B2
公开(公告)日：2008-06-17
申请号：US10631726
申请日：2003-08-01
申请人： Junji Kunisawa , Mitsuko Odagaki , Natsuki Makino , Koji Mishima , Kenji Nakamura , Hiroaki Inoue , Norio Kimura , Tetsuo Matsuda , Hisashi Kaneko , Nobuo Hayasaka , Katsuya Okumura , Manabu Tsujimura , Toshiyuki Morita
发明人： Junji Kunisawa , Mitsuko Odagaki , Natsuki Makino , Koji Mishima , Kenji Nakamura , Hiroaki Inoue , Norio Kimura , Tetsuo Matsuda , Hisashi Kaneko , Nobuo Hayasaka , Katsuya Okumura , Manabu Tsujimura , Toshiyuki Morita
IPC分类号： C25D7/12
CPC分类号： H01L21/6719 , C25D7/123 , C25D17/001 , C25D17/12 , C25D17/14 , H01L21/2885 , H01L21/67046 , H01L21/67051 , H01L21/6708 , H01L21/6715 , H01L21/6723 , H01L21/76877 , H01L21/76879 , H01L2924/0002 , H05K3/423 , H01L2924/00
摘要： A plating method and apparatus for a substrate fills a metal, e.g., copper, into a fine interconnection pattern formed in a semiconductor substrate. The apparatus has a substrate holding portion 36 horizontally holding and rotating a substrate with its surface to be plated facing upward. A seal material 90 contacts a peripheral edge portion of the surface, sealing the portion in a watertight manner. A cathode electrode 88 passes an electric current upon contact with the substrate. A cathode portion 38 rotates integrally with the substrate holding portion 36. An electrode arm portion 30 is above the cathode portion 38 and movable horizontally and vertically and has an anode 98 face-down. Plating liquid is poured into a space between the surface to be plated and the anode 98 brought close to the surface to be plated. Thus, plating treatment and treatments incidental thereto can be performed by a single unit.
摘要翻译：用于衬底的电镀方法和装置将诸如铜的金属填充到形成在半导体衬底中的精细互连图案中。该装置具有基板保持部分36，其水平地保持并旋转基板，其表面被面向上。密封材料90接触表面的周缘部分，以水密的方式密封该部分。阴极电极88在与基板接触时通过电流。阴极部38与基板保持部36一体地旋转。电极臂部30在阴极部38的上方，水平且垂直地移动，阳极98面朝下。将电镀液注入被镀表面与接近待镀表面的阳极98之间的空间中。因此，电镀处理和附带的处理可以通过单个单元进行。

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