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1. 发明授权

US09076576B2 Chip thermistor and thermistor assembly board 有权
标题翻译：片式热敏电阻和热敏电阻组合板
公开(公告)号：US09076576B2
公开(公告)日：2015-07-07
申请号：US13884390
申请日：2011-10-18
申请人： Yo Saito , Kouki Yamada , Yukihiro Murakami
发明人： Yo Saito , Kouki Yamada , Yukihiro Murakami
IPC分类号： H01C7/10 , H01C7/00 , H01C7/02 , H01C7/04
CPC分类号： H01C7/008 , H01C7/021 , H01C7/041
摘要： A chip thermistor is provided with a thermistor element body, a first electrode, a second electrode, and a third electrode. The thermistor element body has a first principal face and a second principal face opposed to each other in a first direction. The first electrode and the second electrode are arranged as separated from each other in a second direction perpendicular to the first direction, on the first principal face of the thermistor element body. The third electrode is arranged so as to lap over the first electrode and the second electrode, when viewed from the first direction, on the second principal face of the thermistor element body.
摘要翻译：片式热敏电阻设置有热敏电阻元件主体，第一电极，第二电极和第三电极。热敏电阻元件本体具有在第一方向上彼此相对的第一主面和第二主面。第一电极和第二电极在热敏电阻元件主体的第一主面上沿与第一方向垂直的第二方向彼此分离。第三电极布置成在热敏电阻元件主体的第二主面上从第一方向观察第一电极和第二电极。

2. 发明申请

US20130088319A1 CHIP THERMISTOR AND METHOD OF MANUFACTURING SAME 有权
标题翻译：芯片热敏电阻及其制造方法
公开(公告)号：US20130088319A1
公开(公告)日：2013-04-11
申请号：US13805043
申请日：2011-06-21
申请人： Yo Saito , Kouki Yamada , Daisuke Tsuchida
发明人： Yo Saito , Kouki Yamada , Daisuke Tsuchida
IPC分类号： H01C7/04 , H01C17/00
CPC分类号： H01C7/008 , H01C1/1413 , H01C7/023 , H01C7/04 , H01C7/043 , H01C17/00 , H01C17/006 , Y10T29/49085
摘要： A chip thermistor has a thermistor portion including a ceramic material containing respective metal oxides of Mn, Ni, and Co as major ingredients; a pair of composite portions including a composite material of Ag—Pd, and respective metal oxides of Mn, Ni, and Co and arranged on both sides of the thermistor portion so as to sandwich in the thermistor portion between the composite portions; and external electrodes connected to the pair of composite portions, respectively. In this manner, the pair of composite portions are used as bulk electrodes and, for this reason, the resistance of the chip thermistor can be adjusted mainly with consideration to the resistance in the thermistor portion without need for much consideration to the distance between the external electrodes and other factors.
摘要翻译：片式热敏电阻具有热敏电阻部分，该热敏电阻部分包括以Mn，Ni和Co为主要成分的各自的金属氧化物的陶瓷材料; 一对复合部分，包括Ag-Pd的复合材料和Mn，Ni和Co的各自的金属氧化物，并且布置在热敏电阻部分的两侧，以夹在复合部分之间的热敏电阻部分; 以及分别连接到该对复合部分的外部电极。以这种方式，一对复合部分被用作体电极，因此，可以主要考虑到热敏电阻部分中的电阻来调节芯片热敏电阻的电阻，而不需要考虑外部的距离电极等因素。

3. 发明授权

US08896410B2 Chip thermistor and method of manufacturing same 有权
标题翻译：片式热敏电阻及其制造方法
公开(公告)号：US08896410B2
公开(公告)日：2014-11-25
申请号：US13805043
申请日：2011-06-21
申请人： Yo Saito , Kouki Yamada , Daisuke Tsuchida
发明人： Yo Saito , Kouki Yamada , Daisuke Tsuchida
IPC分类号： H01C7/02 , H01C7/04 , H01C17/00 , H01C7/00 , H01C1/14
CPC分类号： H01C7/008 , H01C1/1413 , H01C7/023 , H01C7/04 , H01C7/043 , H01C17/00 , H01C17/006 , Y10T29/49085
摘要： A chip thermistor has a thermistor portion including a ceramic material containing respective metal oxides of Mn, Ni, and Co as major ingredients; a pair of composite portions including a composite material of Ag—Pd, and respective metal oxides of Mn, Ni, and Co and arranged on both sides of the thermistor portion so as to sandwich in the thermistor portion between the composite portions; and external electrodes connected to the pair of composite portions, respectively. In this manner, the pair of composite portions are used as bulk electrodes and, for this reason, the resistance of the chip thermistor can be adjusted mainly with consideration to the resistance in the thermistor portion without need for much consideration to the distance between the external electrodes and other factors.
摘要翻译：片式热敏电阻具有热敏电阻部分，该热敏电阻部分包括以Mn，Ni和Co为主要成分的各自的金属氧化物的陶瓷材料; 一对复合部分，包括Ag-Pd的复合材料和Mn，Ni和Co的各自的金属氧化物，并且布置在热敏电阻部分的两侧，以夹在复合部分之间的热敏电阻部分; 以及分别连接到该对复合部分的外部电极。以这种方式，一对复合部分被用作体电极，因此，可以主要考虑到热敏电阻部分中的电阻来调节芯片热敏电阻的电阻，而不需要考虑外部的距离电极等因素。

4. 发明申请

US20130222106A1 CHIP THERMISTOR AND THERMISTOR ASSEMBLY BOARD 有权
标题翻译：芯片热敏电阻和热敏电阻组件板
公开(公告)号：US20130222106A1
公开(公告)日：2013-08-29
申请号：US13884390
申请日：2011-10-18
申请人： Yo Saito , Kouki Yamada , Yukihiro Murakami
发明人： Yo Saito , Kouki Yamada , Yukihiro Murakami
IPC分类号： H01C7/00
CPC分类号： H01C7/008 , H01C7/021 , H01C7/041
摘要： A chip thermistor is provided with a thermistor element body, a first electrode, a second electrode, and a third electrode. The thermistor element body has a first principal face and a second principal face opposed to each other in a first direction. The first electrode and the second electrode are arranged as separated from each other in a second direction perpendicular to the first direction, on the first principal face of the thermistor element body. The third electrode is arranged so as to lap over the first electrode and the second electrode, when viewed from the first direction, on the second principal face of the thermistor element body.
摘要翻译：片式热敏电阻设置有热敏电阻元件主体，第一电极，第二电极和第三电极。热敏电阻元件本体具有在第一方向上彼此相对的第一主面和第二主面。第一电极和第二电极在热敏电阻元件主体的第一主面上沿与第一方向垂直的第二方向彼此分离。第三电极配置成在热敏电阻元件主体的第二主面上从第一方向观察第一电极和第二电极。

5. 发明授权

US5643056A Revolving drum polishing apparatus 失效
标题翻译：滚筒抛光装置
公开(公告)号：US5643056A
公开(公告)日：1997-07-01
申请号：US550117
申请日：1995-10-30
申请人： Masayoshi Hirose , Seiji Ishikawa , Norio Kimura , Yoshimi Sasaki , Kouki Yamada , Fujio Aoyama , Noburu Shimizu , Katsuya Okumura
发明人： Masayoshi Hirose , Seiji Ishikawa , Norio Kimura , Yoshimi Sasaki , Kouki Yamada , Fujio Aoyama , Noburu Shimizu , Katsuya Okumura
IPC分类号： B24B7/22 , B24B29/02 , B24B37/07 , B24B37/10 , H01L21/304 , B24B1/00
CPC分类号： B24B7/228 , B24B29/02 , B24B37/04
摘要： A drum-type polishing apparatus for producing a flat mirror polish on an object such as a semiconductor wafer, is capable of three degrees of freedom of movement of a drum member with respect to the wafer. The relative movements can be made, successively or simultaneously, at right angles to an axis of the drum, parallel to the surface of the wafer, as well as at any desired angular orientations. Combined with a follower device to provide automatic compensation for unevenness in pressing pressure applied to the wafer during polishing, the polishing apparatus offers outstanding uniformity in polishing quality and high productivity, even for large diameter wafers, with a comparatively modest investment in both facility space and equipment cost.
摘要翻译：用于在诸如半导体晶片的物体上制造平面镜抛光的滚筒式抛光装置能够使鼓构件相对于晶片具有三个自由度的移动。相对运动可以连续或同时地与滚筒的轴线成直角，平行于晶片的表面以及任何期望的角度取向。结合跟随装置，为抛光期间对晶片施加的压力压力的不均匀性提供自动补偿，抛光装置即使对于大直径晶片也具有优异的抛光质量均匀性和高生产率，在设备空间和设备成本

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