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1. 发明授权

US5643056A Revolving drum polishing apparatus 失效
标题翻译：滚筒抛光装置
公开(公告)号：US5643056A
公开(公告)日：1997-07-01
申请号：US550117
申请日：1995-10-30
申请人： Masayoshi Hirose , Seiji Ishikawa , Norio Kimura , Yoshimi Sasaki , Kouki Yamada , Fujio Aoyama , Noburu Shimizu , Katsuya Okumura
发明人： Masayoshi Hirose , Seiji Ishikawa , Norio Kimura , Yoshimi Sasaki , Kouki Yamada , Fujio Aoyama , Noburu Shimizu , Katsuya Okumura
IPC分类号： B24B7/22 , B24B29/02 , B24B37/07 , B24B37/10 , H01L21/304 , B24B1/00
CPC分类号： B24B7/228 , B24B29/02 , B24B37/04
摘要： A drum-type polishing apparatus for producing a flat mirror polish on an object such as a semiconductor wafer, is capable of three degrees of freedom of movement of a drum member with respect to the wafer. The relative movements can be made, successively or simultaneously, at right angles to an axis of the drum, parallel to the surface of the wafer, as well as at any desired angular orientations. Combined with a follower device to provide automatic compensation for unevenness in pressing pressure applied to the wafer during polishing, the polishing apparatus offers outstanding uniformity in polishing quality and high productivity, even for large diameter wafers, with a comparatively modest investment in both facility space and equipment cost.
摘要翻译：用于在诸如半导体晶片的物体上制造平面镜抛光的滚筒式抛光装置能够使鼓构件相对于晶片具有三个自由度的移动。相对运动可以连续或同时地与滚筒的轴线成直角，平行于晶片的表面以及任何期望的角度取向。结合跟随装置，为抛光期间对晶片施加的压力压力的不均匀性提供自动补偿，抛光装置即使对于大直径晶片也具有优异的抛光质量均匀性和高生产率，在设备空间和设备成本

2. 发明授权

US06802099B2 Cleaning member and cylindrical cleaning element 有权
标题翻译：清洁部件和圆柱形清洁元件
公开(公告)号：US06802099B2
公开(公告)日：2004-10-12
申请号：US09964661
申请日：2001-09-28
申请人： Seigo Murakami , Hiroshi Ishii , Norio Yamada , Hidetoshi Nose , Fujio Aoyama
发明人： Seigo Murakami , Hiroshi Ishii , Norio Yamada , Hidetoshi Nose , Fujio Aoyama
IPC分类号： B08B1100
CPC分类号： H01L21/67046 , B08B1/04 , B08B3/04 , B23P11/02 , Y10T29/4987
摘要： A rotary shaft having a predetermined diameter and a cylindrical cleaning element having an axial through-hole formed therein and capable of being either in a wet or a dry state are prepared. The through-hole has, in a wet state, a predetermined diameter smaller than that of the rotary shaft. The cleaning element is wetted and the through-hole of the wet cleaning element enlarged so that it has a diameter larger than that of the rotary shaft. The enlarged cleaning element is dry-set and the rotary shaft is inserted into the through-hole of the cleaning element. The cleaning element is then wetted, to contract the diameter of the through-hole of the cleaning element and provide a press-fit between the cleaning element and the shaft. A, cleaning member comprising a cylindrical cleaning element and a rotary shaft held therein with a press-fit is obtained.
摘要翻译：制备具有预定直径的旋转轴和形成有能够处于湿或干态的轴向通孔的圆柱形清洁元件。通孔在湿状态下具有比旋转轴小的预定直径。清洁元件被润湿，并且湿式清洁元件的通孔扩大，使得其直径大于旋转轴的直径。放大的清洁元件是干式固定的，并且旋转轴插入清洁元件的通孔中。然后清洁元件被润湿，以收缩清洁元件的通孔的直径，并在清洁元件和轴之间提供压配合。 A，获得包括圆柱形清洁元件和保持在其中的压配合的旋转轴的清洁构件。

3. 发明授权

US5985090A Polishing cloth and polishing apparatus having such polishing cloth 失效
标题翻译：具有抛光布的抛光布和抛光装置
公开(公告)号：US5985090A
公开(公告)日：1999-11-16
申请号：US650144
申请日：1996-05-17
申请人： Ritsuo Kikuta , Fujio Aoyama , Koji Kato , Tamami Takahashi
发明人： Ritsuo Kikuta , Fujio Aoyama , Koji Kato , Tamami Takahashi
IPC分类号： B24B37/20 , B24B37/24 , B24B41/047 , B24D7/14 , B24D13/14 , H01L21/304 , C23F1/02 , B44C1/22
CPC分类号： B24B37/24 , B24B37/26
摘要： A polishing cloth mounted on a turntable of a polishing apparatus and a polishing apparatus having such a polishing cloth for polishing a workpiece such as a semiconductor wafer to a flat mirror finish. The polishing cloth comprises a first elastic region contacting the surface of the workpiece and having a certain elastic modulus, and a second elastic region contacting the surface of the workpiece and having an elastic modulus different from the first elastic region. The second elastic region is surrounded by the first elastic region and has a smaller dimension in a radial direction of the turntable than a diameter of the workpiece when the second elastic region is held in contact with the workpiece. The position of the second elastic region is determined on the basis of an area in which the second elastic region acts on the workpiece.
摘要翻译：一种安装在抛光装置的转盘上的抛光布和具有用于将诸如半导体晶片的工件抛光到平面镜面的抛光布的抛光装置。抛光布包括与工件的表面接触并具有一定弹性模量的第一弹性区域和与工件的表面接触并具有与第一弹性区域不同的弹性模量的第二弹性区域。第二弹性区域被第一弹性区域围绕，并且当第二弹性区域保持与工件接触时，在转台的径向上具有比工件的直径更小的尺寸。第二弹性区域的位置基于第二弹性区域作用在工件上的面积来确定。

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