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1. 发明授权

US06626736B2 Polishing apparatus 失效
标题翻译：抛光设备
公开(公告)号：US06626736B2
公开(公告)日：2003-09-30
申请号：US09893625
申请日：2001-06-29
申请人： Manabu Tsujimura , Norio Kimura
发明人： Manabu Tsujimura , Norio Kimura
IPC分类号： B24B100
CPC分类号： B24B37/04 , B24B21/04 , B24B37/005 , B24B49/12
摘要： A polishing apparatus is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish, and allows a polishing pad to be automatically replaced without stopping rotary or circulatory motion of a polishing table. The polishing apparatus comprises a polishing table for making rotary or circulatory motion, a top ring vertically movably disposed above the polishing table for removably holding a workpiece to be polished, a pair of rolls rotatable about their own axes and movable in unison with the polishing table, and a polishing pad which is wound on one of the rolls and supplied over an upper surface of the polishing table toward the other of the rolls.
摘要翻译：抛光装置用于将诸如半导体晶片的工件抛光到平面镜面，并且允许抛光垫被自动更换，而不会停止抛光台的旋转或循环运动。抛光装置包括用于进行旋转或循环运动的抛光台，可垂直移动地设置在抛光台上方的用于可移除地保持待抛光工件的顶环，可绕其自身轴线旋转并可与抛光台一起移动的一对辊以及抛光垫，其被卷绕在其中一个辊上并且被供给到抛光台的上表面朝向另一个辊。

2. 发明授权

US07387717B2 Method of performing electrolytic treatment on a conductive layer of a substrate 失效
标题翻译：在基板的导电层上进行电解处理的方法
公开(公告)号：US07387717B2
公开(公告)日：2008-06-17
申请号：US10631726
申请日：2003-08-01
申请人： Junji Kunisawa , Mitsuko Odagaki , Natsuki Makino , Koji Mishima , Kenji Nakamura , Hiroaki Inoue , Norio Kimura , Tetsuo Matsuda , Hisashi Kaneko , Nobuo Hayasaka , Katsuya Okumura , Manabu Tsujimura , Toshiyuki Morita
发明人： Junji Kunisawa , Mitsuko Odagaki , Natsuki Makino , Koji Mishima , Kenji Nakamura , Hiroaki Inoue , Norio Kimura , Tetsuo Matsuda , Hisashi Kaneko , Nobuo Hayasaka , Katsuya Okumura , Manabu Tsujimura , Toshiyuki Morita
IPC分类号： C25D7/12
CPC分类号： H01L21/6719 , C25D7/123 , C25D17/001 , C25D17/12 , C25D17/14 , H01L21/2885 , H01L21/67046 , H01L21/67051 , H01L21/6708 , H01L21/6715 , H01L21/6723 , H01L21/76877 , H01L21/76879 , H01L2924/0002 , H05K3/423 , H01L2924/00
摘要： A plating method and apparatus for a substrate fills a metal, e.g., copper, into a fine interconnection pattern formed in a semiconductor substrate. The apparatus has a substrate holding portion 36 horizontally holding and rotating a substrate with its surface to be plated facing upward. A seal material 90 contacts a peripheral edge portion of the surface, sealing the portion in a watertight manner. A cathode electrode 88 passes an electric current upon contact with the substrate. A cathode portion 38 rotates integrally with the substrate holding portion 36. An electrode arm portion 30 is above the cathode portion 38 and movable horizontally and vertically and has an anode 98 face-down. Plating liquid is poured into a space between the surface to be plated and the anode 98 brought close to the surface to be plated. Thus, plating treatment and treatments incidental thereto can be performed by a single unit.
摘要翻译：用于衬底的电镀方法和装置将诸如铜的金属填充到形成在半导体衬底中的精细互连图案中。该装置具有基板保持部分36，其水平地保持并旋转基板，其表面被面向上。密封材料90接触表面的周缘部分，以水密的方式密封该部分。阴极电极88在与基板接触时通过电流。阴极部38与基板保持部36一体地旋转。电极臂部30在阴极部38的上方，水平且垂直地移动，阳极98面朝下。将电镀液注入被镀表面与接近待镀表面的阳极98之间的空间中。因此，电镀处理和附带的处理可以通过单个单元进行。

3. 发明授权

US06939208B2 Polishing apparatus 有权
标题翻译：抛光设备
公开(公告)号：US06939208B2
公开(公告)日：2005-09-06
申请号：US09787121
申请日：2001-01-22
申请人： Kenji Kamimura , Norio Kimura , Satoshi Okamura , Hideo Aizawa , Makoto Akagi , Katsuhiko Tokushige , Hisanori Matsuo , Manabu Tsujimura
发明人： Kenji Kamimura , Norio Kimura , Satoshi Okamura , Hideo Aizawa , Makoto Akagi , Katsuhiko Tokushige , Hisanori Matsuo , Manabu Tsujimura
IPC分类号： B24B53/00 , B24B53/007 , B24B53/017 , H01L21/306
CPC分类号： B24B53/017 , B24B29/005 , B24B53/003 , H01L21/30625
摘要： The present invention relates to a polishing apparatus for polishing a workpiece, such as a semiconductor wafer, to a flat mirror finish. The polishing apparatus comprises a polishing table having a polishing surface, and a top ring, and the workpiece is interposed between the polishing table and the top ring, and pressed at a predetermined pressure to polish the workpiece. The polishing apparatus comprises at least two dressing units for dressing the polishing surface by being brought into contact with the ppolishing surface, which is a surface of a polishing cloth.
摘要翻译：本发明涉及一种用于将诸如半导体晶片的工件抛光成平面镜面抛光的抛光装置。抛光装置包括具有抛光表面的抛光台和顶环，并且将工件插入在抛光台和顶环之间，并以预定压力按压以抛光工件。抛光装置包括至少两个修整单元，用于通过与作为抛光布表面的抛光表面接触来修整抛光表面。

4. 发明授权

US5476414A Polishing apparatus 失效
标题翻译：抛光设备
公开(公告)号：US5476414A
公开(公告)日：1995-12-19
申请号：US124550
申请日：1993-09-22
申请人： Masayoshi Hirose , Manabu Tsujimura , Seiji Ishikawa , Norio Kimura , You Ishii
发明人： Masayoshi Hirose , Manabu Tsujimura , Seiji Ishikawa , Norio Kimura , You Ishii
IPC分类号： B24B37/10 , B24B37/30 , H01L21/304 , B24B7/22
CPC分类号： H01L21/02024 , B24B37/107 , B24B37/30
摘要： A workpiece such as a semiconductor wafer is supported on a top ring and polished by an abrasive cloth on a turntable while the top ring is being pressed against the turntable and the turntable and the top ring are being rotated. The top ring is coupled to a top ring drive shaft, coupled to a pressure cylinder for pressing the top ring, and to a motor for rotating the top ring. A spherical bearing is interposed between the top ring and the top ring drive shaft for allowing the top ring to align with the upper surface of the moving turntable. A torque transmitting mechanism is operatively coupled between the top ring and the top ring drive shaft for rotating the top ring in synchronization with the top ring drive shaft.
摘要翻译：诸如半导体晶片的工件被支撑在顶环上并且通过研磨布在转盘上抛光，同时顶环被压靠在转台上，并且转台和顶环正在旋转。顶环联接到顶环驱动轴，联接到用于按压顶环的压力缸，以及用于旋转顶环的电动机。在顶环和顶环驱动轴之间插入有球面轴承，用于允许顶环与活动转台的上表面对准。扭矩传递机构可操作地联接在顶环和顶环驱动轴之间，用于与顶环驱动轴同步地旋转顶环。

5. 发明申请

US20080251385A1 PLATING APPARATUS 审中-公开
标题翻译：电镀设备
公开(公告)号：US20080251385A1
公开(公告)日：2008-10-16
申请号：US12116562
申请日：2008-05-07
申请人： Junji Kunisawa , Mitsuko Odagaki , Natsuki Makino , Koji Mishima , Kenji Nakamura , Hiroaki Inoue , Norio Kimura , Tetsuo Matsuda , Hisashi Kaneko , Nobuo Hayasaka , Katsuya Okumura , Manabu Tsujimura , Toshiyuki Morita
发明人： Junji Kunisawa , Mitsuko Odagaki , Natsuki Makino , Koji Mishima , Kenji Nakamura , Hiroaki Inoue , Norio Kimura , Tetsuo Matsuda , Hisashi Kaneko , Nobuo Hayasaka , Katsuya Okumura , Manabu Tsujimura , Toshiyuki Morita
IPC分类号： C25D21/12
CPC分类号： H01L21/6719 , C25D7/123 , C25D17/001 , C25D17/12 , C25D17/14 , H01L21/2885 , H01L21/67046 , H01L21/67051 , H01L21/6708 , H01L21/6715 , H01L21/6723 , H01L21/76877 , H01L21/76879 , H01L2924/0002 , H05K3/423 , H01L2924/00
摘要： A plating method and apparatus for a substrate fills a metal, e.g., copper, into a fine interconnection pattern formed in a semiconductor substrate. The apparatus has a substrate holding portion 36 horizontally holding and rotating a substrate with its surface to be plated facing upward. A seal material 90 contacts a peripheral edge portion of the surface, sealing the portion in a watertight manner. A cathode electrode 88 passes an electric current upon contact with the substrate. A cathode portion 38 rotates integrally with the substrate holding portion 36. An electrode arm portion 30 is above the cathode portion 38 and movable horizontally and vertically and has an anode 98 face-down. Plating liquid is poured into a space between the surface to be plated and the anode 98 brought close to the surface to be plated. Thus, plating treatment and treatments incidental thereto can be performed by a single unit.
摘要翻译：用于衬底的电镀方法和装置将诸如铜的金属填充到形成在半导体衬底中的精细互连图案中。该装置具有基板保持部分36，其水平地保持并旋转基板，其表面被面向上。密封材料90接触表面的周缘部分，以水密的方式密封该部分。阴极电极88在与基板接触时通过电流。阴极部38与基板保持部36一体旋转。电极臂部分30在阴极部分38的上方并且可水平和垂直地移动，并且阳极98面向下。将电镀液注入被镀表面与接近待镀表面的阳极98之间的空间中。因此，电镀处理和附带的处理可以通过单个单元进行。

6. 发明授权

US07040968B2 Polishing apparatus 有权
标题翻译：抛光设备
公开(公告)号：US07040968B2
公开(公告)日：2006-05-09
申请号：US11113084
申请日：2005-04-25
申请人： Kenji Kamimura , Norio Kimura , Satoshi Okamura , Hideo Aizawa , Makoto Akagi , Katsuhiko Tokushige , Hisanori Matsuo , Manabu Tsujimura
发明人： Kenji Kamimura , Norio Kimura , Satoshi Okamura , Hideo Aizawa , Makoto Akagi , Katsuhiko Tokushige , Hisanori Matsuo , Manabu Tsujimura
IPC分类号： B24B53/00
CPC分类号： B24B53/017 , B24B29/005 , B24B53/003 , H01L21/30625
摘要： The present invention relates to a polishing apparatus for polishing a workpiece, such as a semiconductor wafer, to a flat mirror finish. The polishing apparatus comprises a polishing table having a polishing surface, and a top ring, and the workpiece is interposed between the polishing table and the top ring and pressed at a predetermined pressure to polish the workpiece. The polishing apparatus comprises at least two dressing units for dressing the polishing surface by being brought into contact with the polishing surface, which is a surface of a polishing cloth.
摘要翻译：本发明涉及一种用于将诸如半导体晶片的工件抛光成平面镜面抛光的抛光装置。抛光装置包括具有抛光表面的抛光台和顶环，并且将工件插入在抛光台和顶环之间并以预定压力被压制以抛光工件。抛光装置包括至少两个修整单元，用于通过与作为抛光布表面的抛光表面接触来修整抛光表面。

7. 发明授权

US06632335B2 Plating apparatus 有权
标题翻译：电镀装置
公开(公告)号：US06632335B2
公开(公告)日：2003-10-14
申请号：US09742110
申请日：2000-12-22
申请人： Junji Kunisawa , Mitsuko Odagaki , Natsuki Makino , Koji Mishima , Kenji Nakamura , Hiroaki Inoue , Norio Kimura , Tetsuo Matsuda , Hisashi Kaneko , Nobuo Hayasaka , Katsuya Okumura , Manabu Tsujimura , Toshiyuki Morita
发明人： Junji Kunisawa , Mitsuko Odagaki , Natsuki Makino , Koji Mishima , Kenji Nakamura , Hiroaki Inoue , Norio Kimura , Tetsuo Matsuda , Hisashi Kaneko , Nobuo Hayasaka , Katsuya Okumura , Manabu Tsujimura , Toshiyuki Morita
IPC分类号： C25D2112
CPC分类号： H01L21/6719 , C25D7/123 , C25D17/001 , C25D17/12 , C25D17/14 , H01L21/2885 , H01L21/67046 , H01L21/67051 , H01L21/6708 , H01L21/6715 , H01L21/6723 , H01L21/76877 , H01L21/76879 , H01L2924/0002 , H05K3/423 , H01L2924/00
摘要： A plating method and apparatus for a substrate fills a metal, e.g., copper, into a fine interconnection pattern formed in a semiconductor substrate. The apparatus has a substrate holding portion 36 horizontally holding and rotating a substrate with its surface to be plated facing upward. A seal material 90 contacts a peripheral edge portion of the surface, sealing the portion in a watertight manner. A cathode electrode 88 passes an electric current upon contact with the substrate. A cathode portion 38 rotates integrally with the substrate holding portion 36. An electrode arm portion 30 is above the cathode portion 38 and movable horizontally and vertically and has an anode 98 face-down. Plating liquid is poured into a space between the surface to be plated and the anode 98 brought close to the surface to be plated. Thus, plating treatment and treatments incidental thereto can be performed by a single unit.
摘要翻译：用于衬底的电镀方法和装置将诸如铜的金属填充到形成在半导体衬底中的精细互连图案中。该装置具有将待镀表面向上水平保持并旋转的衬底的衬底保持部分 36 。密封材料 90 接触表面的外围边缘部分，以水密的方式密封该部分。当与基板接触时，阴极电极 88 通过电流。阴极部分 38 与衬底保持部分 36 整体旋转。电极臂部分 30 在阴极部分 38 之上，水平和垂直移动并具有阳极 PDAT> 98 面朝下。将电镀液倒入要被镀表面和靠近待镀表面的阳极 98 之间的空间中。因此，电镀处理和附带的处理可以通过单个单元执行

8. 发明授权

US06406364B1 Polishing solution feeder 有权
标题翻译：抛光溶液进料器
公开(公告)号：US06406364B1
公开(公告)日：2002-06-18
申请号：US09355895
申请日：1999-10-25
申请人： Norio Kimura , Hirokuni Hiyama , Yutaka Wada , Kiyotaka Kawashima , Manabu Tsujimura , Takayoshi Kawamoto
发明人： Norio Kimura , Hirokuni Hiyama , Yutaka Wada , Kiyotaka Kawashima , Manabu Tsujimura , Takayoshi Kawamoto
IPC分类号： B24B5700
CPC分类号： B24B37/04 , B24B57/02 , Y10S451/91
摘要： The object of the present invention is to provide a polishing apparatus that can supply a polishing solution having a non-varying distribution of abrading particles sizes at a steady rate. An apparatus (20) for delivering a polishing solution to a polishing apparatus (22) is disclosed. The apparatus (20) comprises: a solution passage for transporting the polishing solution; and an ultrasonic vibrator (72) being provided in at least one location of the solution passage.
摘要翻译：本发明的目的是提供一种抛光装置，其能够以稳定的速度供给研磨粒子尺寸不变的抛光液。公开了一种用于将抛光溶液输送到抛光装置（22）的装置（20）。装置（20）包括：用于输送抛光溶液的溶液通道; 和超声波振动器（72）设置在溶液通道的至少一个位置。

9. 发明授权

US06294059B1 Substrate plating apparatus 有权
标题翻译：基板电镀装置
公开(公告)号：US06294059B1
公开(公告)日：2001-09-25
申请号：US09154895
申请日：1998-09-17
申请人： Akihisa Hongo , Naoaki Ogure , Hiroaki Inoue , Norio Kimura , Fumio Kuriyama , Manabu Tsujimura , Kenichi Suzuki , Atsushi Chono
发明人： Akihisa Hongo , Naoaki Ogure , Hiroaki Inoue , Norio Kimura , Fumio Kuriyama , Manabu Tsujimura , Kenichi Suzuki , Atsushi Chono
IPC分类号： C25D1700
CPC分类号： H01L21/67167 , C25D17/001 , H01L21/2885 , H01L21/67051 , H01L21/67126 , H01L21/67161 , H01L21/67173 , H01L21/6719 , H01L21/67219 , H01L21/6723 , H01L21/76849 , H01L21/76877 , Y10S134/902
摘要： A substrate plating apparatus forms an interconnection layer on an interconnection region composed of a fine groove and/or a fine hole defined in a substrate. The substrate plating apparatus includes a plating unit for forming a plated layer on a surface of the substrate including the interconnection region, a chemical mechanical polishing unit for chemically mechanically polishing the substrate to remove the plated layer from the surface of the substrate leaving a portion of the plated layer in the interconnection region, a cleaning unit for cleaning the substrate after the plated layer is formed or the substrate is chemically mechanically polished, a drying unit for drying the substrate after the substrate is cleaned, and a substrate transfer unit for transferring the substrate to and from each of the first plating unit, the first chemical mechanical polishing unit, the cleaning unit, and the drying unit. The first plating unit, the first chemical mechanical polishing unit, the cleaning unit, the drying unit, and the substrate transfer unit are combined into a unitary arrangement.
摘要翻译：基板电镀装置在由微细凹槽和/或限定在基板中的细孔构成的互连区域上形成布线层。基板电镀装置包括用于在包括互连区域的基板的表面上形成镀层的电镀单元，用于对基板进行化学机械抛光以从基板的表面移除镀层的化学机械抛光单元，互连区域中的镀层，用于在形成镀层之后对基板进行清洗或基板进行化学机械抛光的清洁单元，用于在清洁基板之后使基板干燥的干燥单元，以及用于将基板转印第一电镀单元，第一化学机械抛光单元，清洁单元和干燥单元中的每一个的基板。第一电镀单元，第一化学机械抛光单元，清洁单元，干燥单元和基板转移单元组合成一体的布置。

10. 发明授权

US06843706B2 Polishing apparatus 有权
标题翻译：抛光设备
公开(公告)号：US06843706B2
公开(公告)日：2005-01-18
申请号：US10633560
申请日：2003-08-05
申请人： Manabu Tsujimura , Norio Kimura
发明人： Manabu Tsujimura , Norio Kimura
IPC分类号： B24B21/04 , B24B37/005 , B24B37/04 , B24B49/12 , B24B1/00
CPC分类号： B24B37/04 , B24B21/04 , B24B37/005 , B24B49/12
摘要： A polishing apparatus is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish, and allows a polishing pad to be automatically replaced without stopping rotary or circulatory motion of a polishing table. The polishing apparatus comprises a polishing table for making rotary or circulatory motion, a top ring vertically movably disposed above the polishing table for removably holding a workpiece to be polished, a pair of rolls rotatable about their own axes and movable in unison with the polishing table, and a polishing pad which is wound on one of the rolls and supplied over an upper surface of the polishing table toward the other of the rolls.
摘要翻译：抛光装置用于将诸如半导体晶片的工件抛光到平面镜面，并且允许抛光垫被自动更换，而不会停止抛光台的旋转或循环运动。抛光装置包括用于进行旋转或循环运动的抛光台，可垂直移动地设置在抛光台上方的用于可移除地保持待抛光工件的顶环，可绕其自身轴线旋转并可与抛光台一起移动的一对辊以及抛光垫，其被卷绕在其中一个辊上并且被供给到抛光台的上表面朝向另一个辊。

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