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1. 发明授权

US4352897A Resin molded stators 失效
标题翻译：树脂模制定子
公开(公告)号：US4352897A
公开(公告)日：1982-10-05
申请号：US103506
申请日：1979-12-14
申请人： Masatsugu Ogata , Hirokazu Takasaki , Masanori Nemoto , Toshikazu Narahara , Kenichi Hironaka , Tetuo Ishikawa
发明人： Masatsugu Ogata , Hirokazu Takasaki , Masanori Nemoto , Toshikazu Narahara , Kenichi Hironaka , Tetuo Ishikawa
IPC分类号： H02K3/44 , C08K13/04 , C08L67/06 , H01B3/42 , H02K3/32 , H02K5/08 , H02K15/12
CPC分类号： H02K5/08 , C08K13/04 , C08L67/06 , H01B3/425 , H02K3/32
摘要： A resin molded stator comprising a stator core and coils as major constituents at least parts of which are molded into one piece by a molding material, said molding material comprising (a) a low-shrink unsaturated polyester resin, (b) a filler having a particle size of 44 .mu. or less, and (c) a fibrous material having a length of 3 mm or less, in proportions of 15 to 40% by weight of the component (a) and 60 to 85% by weight of a total of the components (b) and (c), and a weight ratio of the component (b) to the component (c) being 3/1 to 30/1, is excellent in crack resistance, moisture resistance and insulating properties.
摘要翻译：一种树脂模制定子，其包括定子芯和线圈作为主要成分，其至少一部分通过模制材料模制成一体，所述模制材料包括（a）低收缩不饱和聚酯树脂，（b）填料，其具有粒径为44μm以下，（c）长度为3mm以下的纤维材料，以（a）成分的15〜40重量％的比例和60〜85重量％组分（b）和（c）以及组分（b）与组分（c）的重量比为3/1至30/1，具有优异的抗裂性，耐湿性和绝缘性。

2. 发明授权

US4393177A Thermosetting resin composition, process for preparation thereof and cured product thereof 失效
标题翻译：热固性树脂组合物，其制备方法和其固化产物
公开(公告)号：US4393177A
公开(公告)日：1983-07-12
申请号：US242617
申请日：1981-03-11
申请人： Takeo Ishii , Masatsugu Ogata , Toshikazu Narahara
发明人： Takeo Ishii , Masatsugu Ogata , Toshikazu Narahara
IPC分类号： C08F226/06 , C08F299/02 , C08F283/04 , C08G73/16 , C08L79/08
CPC分类号： C08F226/06 , C08F299/022
摘要： The present invention relates to a thermosetting resin composition, a process for the preparation of this composition and a cured product obtained by heating and curing this composition. Both the thermosetting resin composition and cured product of the present invention comprise triallylisocyanurate (TAIC) and a poly(phenylmethylene)polymaleimide represented by the following general formula: ##STR1## wherein n is a number of at least 1. This composition is obtained by heating and dissolving the polymaleimide into TAIC. According to the intended use of the molded product, various additives may be added to the composition. For example, there may be added a radical-polymerizable thermosetting resin such as an unsaturated polyester, an epoxy acrylate resin or a diallyl phthalate prepolymer and a filler represented by a thermoplastic resin. The composition of the present invention is excellent in the compatibility and therefore, a good moldability is obtained at the molding step. Furthermore, the cured product of the present invention is excellent in the mechanical properties, electric properties and heat resistance.
摘要翻译：本发明涉及一种热固性树脂组合物，该组合物的制备方法和通过加热和固化该组合物得到的固化产物。本发明的热固性树脂组合物和固化产物都包含由以下通式表示的三烯丙基三聚氰酸酯（TAIC）和聚（苯基亚甲基）聚马来酰亚胺：其中n是至少为1的数。该组合物通过加热并将聚马来酰亚胺溶解在TAIC中。根据成型产品的预期用途，可以向组合物中加入各种添加剂。例如，可以添加自由基聚合性热固性树脂，例如不饱和聚酯，环氧丙烯酸酯树脂或邻苯二甲酸二烯丙酯预聚物和由热塑性树脂表示的填料。本发明的组合物的相容性优异，因此在成型步骤中获得良好的成型性。此外，本发明的固化物的机械性能，电特性和耐热性优异。

3. 发明授权

US4366516A Precision machinery component 失效
标题翻译：精密机械部件
公开(公告)号：US4366516A
公开(公告)日：1982-12-28
申请号：US153007
申请日：1980-05-27
申请人： Masatsugu Ogata , Hideki Asano , Tsuneo Narusawa , Toshikazu Narahara
发明人： Masatsugu Ogata , Hideki Asano , Tsuneo Narusawa , Toshikazu Narahara
IPC分类号： C08L67/06 , G11B15/61 , G11B25/06 , G11B33/10 , G11B15/60 , G11B5/10
CPC分类号： G11B33/10 , C08L67/06 , G11B15/61 , G11B25/063
摘要： Precision machinerycomponents such as a cylinder in a magnetic tape scanning apparatus, a cylinder base and/or a sub-chassis in a video tape recorder, etc. made of cured thermosetting resin composition comprising (A) a resin component comprising, particularly preferably, a terephthalic acid series unsaturated polyester resin, styrene and a saturated polyester resin, (B) an inorganic filler, and (C) short fibrous material such as carbon short fibers, have excellent dimensional accuracy and dimensional stability. When these precision machinery components are used, for example, in a video tape recorder, the same clear VTR picture as in the case of using those made of metal can be obtained.
摘要翻译：精密机械部件，如磁带扫描装置中的气缸，磁带录像机中的气缸底座和/或底盘，等等，其由固化的热固性树脂组合物制成，其包含（A）树脂组分，其特别优选地包括对苯二甲酸系不饱和聚酯树脂，苯乙烯和饱和聚酯树脂，（B）无机填料和（C）短纤维材料如碳短纤维，具有优异的尺寸精度和尺寸稳定性。当使用这些精密机械部件时，例如在录像机中，可以获得与使用由金属制成的情况相同的清晰VTR图像。

4. 发明授权

US4387311A Uninflammable dynamoelectric machine having coil windings and core encapsulated with unsaturated polyester resin-filler composition 失效
标题翻译：具有线圈绕组和不饱和聚酯树脂 - 填料组成的不可燃电动机
公开(公告)号：US4387311A
公开(公告)日：1983-06-07
申请号：US247269
申请日：1981-03-25
申请人： Tsuguo Kobayashi , Tetsuo Ishikawa , Kenichi Hironaka , Hideo Umetsu , Masatsugu Ogata , Hitoshi Yokono
发明人： Tsuguo Kobayashi , Tetsuo Ishikawa , Kenichi Hironaka , Hideo Umetsu , Masatsugu Ogata , Hitoshi Yokono
IPC分类号： H02K3/30 , H02K3/44 , H02K5/08 , H02K1/04 , B32B27/36 , C08K7/14 , C08L67/06
CPC分类号： H02K5/08 , Y10S428/921 , Y10T428/31794
摘要： In a dynamoelectric machine having a stator assembly of coil windings and a core, a heat-dissipating, uninflammable, electro-insulative housing encapsulates the coil windings and the core. The housing is made of a cured molded article or material formed of a resin-filler composition which comprises a liquid unsaturated polyester resin, a finely divided calcium carbonate powder, an inorganic mineral particulate having a particle size larger than that of the calcium carbonate powder, a chopped glass fiber and an aluminum hydroxide powder, wherein the ratio by weight of the calcium carbonate to the mineral particulate is 0.3 to 4, the ratio of the weight of glass fiber to the total weight of the composition is 0.05 to 0.25, the ratio of the weight of the polyester resin to the total weight of the composition is 0.1 to 0.4, the weight ratio of the calcium carbonate powder, the mineral particulate and the glass fiber to the total weight of the composition is 0.15 to 0.80, and the weight ratio of the aluminum hydroxide powder to the total weight of the composition is 0.1 to 0.6.
摘要翻译：在具有线圈绕组和铁心的定子组件的电动机中，散热不可燃的电绝缘壳体封装线圈绕组和芯。壳体由固化的模制品或由树脂填料组合物形成的材料制成，该组合物包括液体不饱和聚酯树脂，细碎碳酸钙粉末，粒径大于碳酸钙粉末的无机矿物颗粒，短切玻璃纤维和氢氧化铝粉末，其中碳酸钙与矿物颗粒的重量比为0.3〜4，玻璃纤维重量与组合物总重量的比例为0.05〜0.25，比例聚酯树脂的重量相对于组合物的总重量为0.1〜0.4，碳酸钙粉末，矿物颗粒和玻璃纤维的重量比相对于组合物的总重量为0.15〜0.80，重量氢氧化铝粉末与组合物总重量的比例为0.1〜0.6。

5. 发明授权

US6124629A Semiconductor device including a resin sealing member which exposes the rear surface of the sealed semiconductor chip 失效
标题翻译：半导体装置包括使密封的半导体芯片的后表面露出的树脂密封构件
公开(公告)号：US6124629A
公开(公告)日：2000-09-26
申请号：US168097
申请日：1998-10-08
申请人： Gen Murakami , Kunihiro Tsubosaki , Masahiro Ichitani , Kunihiko Nishi , Ichiro Anjo , Asao Nishimura , Makoto Kitano , Akihiro Yaguchi , Sueo Kawai , Masatsugu Ogata , Syuuji Eguchi , Hiroyoshi Kokaku , Masanori Segawa , Hiroshi Hozoji , Takashi Yokoyama , Noriyuki Kinjo , Aizo Kaneda , Junichi Saeki , Shozo Nakamura , Akio Hasebe , Hiroshi Kikuchi , Isamu Yoshida , Takashi Yamazaki , Kazuyoshi Oshima , Tetsuro Matsumoto
发明人： Gen Murakami , Kunihiro Tsubosaki , Masahiro Ichitani , Kunihiko Nishi , Ichiro Anjo , Asao Nishimura , Makoto Kitano , Akihiro Yaguchi , Sueo Kawai , Masatsugu Ogata , Syuuji Eguchi , Hiroyoshi Kokaku , Masanori Segawa , Hiroshi Hozoji , Takashi Yokoyama , Noriyuki Kinjo , Aizo Kaneda , Junichi Saeki , Shozo Nakamura , Akio Hasebe , Hiroshi Kikuchi , Isamu Yoshida , Takashi Yamazaki , Kazuyoshi Oshima , Tetsuro Matsumoto
IPC分类号： H01L21/44 , H01L21/48 , H01L21/50 , H01L23/31 , H01L23/495 , H01L25/10 , H01L29/06 , H05K1/14 , H05K1/18 , H05K3/34
CPC分类号： H01L24/32 , H01L23/3107 , H01L23/4951 , H01L23/49555 , H01L23/49558 , H01L23/49568 , H01L23/49586 , H01L24/05 , H01L24/06 , H01L25/105 , H01L29/0657 , H01L2224/02166 , H01L2224/0401 , H01L2224/04042 , H01L2224/05554 , H01L2224/05556 , H01L2224/05599 , H01L2224/05624 , H01L2224/06136 , H01L2224/16 , H01L2224/29111 , H01L2224/2919 , H01L2224/2929 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/45565 , H01L2224/4569 , H01L2224/48091 , H01L2224/48247 , H01L2224/4826 , H01L2224/48465 , H01L2224/48624 , H01L2224/48724 , H01L2224/48799 , H01L2224/73215 , H01L2224/85205 , H01L2224/8592 , H01L2225/1005 , H01L2225/1029 , H01L2225/107 , H01L24/45 , H01L24/48 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01023 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01039 , H01L2924/01043 , H01L2924/01045 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01058 , H01L2924/01074 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/01092 , H01L2924/0132 , H01L2924/014 , H01L2924/10253 , H01L2924/13091 , H01L2924/14 , H01L2924/15738 , H01L2924/15747 , H01L2924/1576 , H01L2924/181 , H01L2924/1815 , H01L2924/3025 , H01L2924/3511 , H05K1/144 , H05K1/181 , H05K3/3421 , Y10T29/49121
摘要： As the semiconductor chip is large-sized, highly integrated and speeded up, it becomes difficult to pack the semiconductor chip together with leads in a package. In view of this difficulty, there has been adopted the package structure called the "Lead-On-Chip" or "Chip-On-Lead" structure in which the semiconductor and the leads are stacked and packed. In the package of this structure, according to the present invention, the gap between the leading end portions of the inner leads and the semiconductor chip is made wider than that between the inner lead portions except the leading end portions and the semiconductor chip thereby to reduce the stray capacity, to improve the signal transmission rate and to reduce the electrical noises.
摘要翻译：由于半导体芯片尺寸大，高集成度和加速度，所以难以将半导体芯片与包装中的引线组合在一起。鉴于这种困难，已经采用称为半导体和引线堆叠和封装的称为“片上引线”或“引线芯片”结构的封装结构。在该结构的封装中，根据本发明，内引线和半导体芯片的前端部之间的间隙比除引导端部和半导体芯片之外的内引线部分之间的间隙宽，从而减小杂散容量，提高信号传输速率和减少电气噪声。

6. 发明授权

US6114005A Laminate and multilayer printed circuit board 失效
标题翻译：层压板和多层印刷电路板
公开(公告)号：US6114005A
公开(公告)日：2000-09-05
申请号：US859659
申请日：1997-05-20
申请人： Akira Nagai , Masatsugu Ogata , Shuji Eguchi , Masahiko Ogino , Toshiaki Ishii , Masanori Segawa , Hiroyoshi Kokaku , Ryo Moteki , Ichiro Anjoh
发明人： Akira Nagai , Masatsugu Ogata , Shuji Eguchi , Masahiko Ogino , Toshiaki Ishii , Masanori Segawa , Hiroyoshi Kokaku , Ryo Moteki , Ichiro Anjoh
IPC分类号： B32B27/12 , H01L23/14 , H05K1/03 , B32B5/12
CPC分类号： B32B27/12 , H01L23/145 , H05K1/0373 , H01L2224/48227 , H01L2924/10253 , H01L2924/12044 , H01L2924/15311 , H01L2924/30107 , H01L2924/3025 , H05K2201/015 , H05K2201/0209 , H05K2201/0212 , H05K2201/029 , H05K2201/068 , Y10S428/901 , Y10T428/24132 , Y10T428/254
摘要： A laminate capable of mounting semiconductor elements thereon; comprising an insulating layer which is constituted by a resin portion of sea-island structure and a woven reinforcement. The resin portion of sea-island structure is, for example, such that a resin as islands are dispersed in a resin as a matrix. Thus, the insulating layer exhibits a coefficient of thermal expansion of 3.0.about.10 (ppm/K) in a planar direction thereof and a glass transition temperature of 150.about.300 (.degree.C.). Owing to these physical properties, thermal stresses which the laminate undergoes in packaging the semiconductor elements thereon can be reduced, so that the connections of the laminate with the semiconductor elements can be made highly reliable.
摘要翻译：能够在其上安装半导体元件的层压体; 包括由海岛结构的树脂部分和织造加强件构成的绝缘层。例如，海岛结构的树脂部分使得岛状树脂以树脂为基体分散。因此，绝缘层在其平面方向上的热膨胀系数为3.0D（ppm / K），玻璃化转变温度为150℃（℃）。由于这些物理性质，可以减少层压体在其上封装半导体元件时的热应力，使得层压体与半导体元件的连接可以高度可靠。

7. 发明授权

US6100115A Semiconductor device 失效
公开(公告)号：US6100115A
公开(公告)日：2000-08-08
申请号：US166121
申请日：1998-10-05
申请人： Gen Murakami , Kunihiro Tsubosaki , Masahiro Ichitani , Kunihiko Nishi , Ichiro Anjo , Asao Nishimura , Makoto Kitano , Akihiro Yaguchi , Sueo Kawai , Masatsugu Ogata , Syuuji Eguchi , Hiroyoshi Kokaku , Masanori Segawa , Hiroshi Hozoji , Takashi Yokoyama , Noriyuki Kinjo , Aizo Kaneda , Junichi Saeki , Shozo Nakamura , Akio Hasebe , Hiroshi Kikuchi , Isamu Yoshida , Takashi Yamazaki , Kazuyoshi Oshima , Tetsuro Matsumoto
发明人： Gen Murakami , Kunihiro Tsubosaki , Masahiro Ichitani , Kunihiko Nishi , Ichiro Anjo , Asao Nishimura , Makoto Kitano , Akihiro Yaguchi , Sueo Kawai , Masatsugu Ogata , Syuuji Eguchi , Hiroyoshi Kokaku , Masanori Segawa , Hiroshi Hozoji , Takashi Yokoyama , Noriyuki Kinjo , Aizo Kaneda , Junichi Saeki , Shozo Nakamura , Akio Hasebe , Hiroshi Kikuchi , Isamu Yoshida , Takashi Yamazaki , Kazuyoshi Oshima , Tetsuro Matsumoto
IPC分类号： H01L21/44 , H01L21/48 , H01L21/50 , H01L23/31 , H01L23/495 , H01L25/10 , H01L29/06 , H05K1/14 , H05K1/18 , H05K3/34
CPC分类号： H01L24/32 , H01L23/3107 , H01L23/4951 , H01L23/49555 , H01L23/49558 , H01L23/49568 , H01L23/49586 , H01L24/05 , H01L24/06 , H01L25/105 , H01L29/0657 , H01L2224/02166 , H01L2224/0401 , H01L2224/04042 , H01L2224/05554 , H01L2224/05556 , H01L2224/05599 , H01L2224/05624 , H01L2224/06136 , H01L2224/16 , H01L2224/29111 , H01L2224/2919 , H01L2224/2929 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/45565 , H01L2224/4569 , H01L2224/48091 , H01L2224/48247 , H01L2224/4826 , H01L2224/48465 , H01L2224/48624 , H01L2224/48724 , H01L2224/48799 , H01L2224/73215 , H01L2224/85205 , H01L2224/8592 , H01L2225/1005 , H01L2225/1029 , H01L2225/107 , H01L24/45 , H01L24/48 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01023 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01039 , H01L2924/01043 , H01L2924/01045 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01058 , H01L2924/01074 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/01092 , H01L2924/0132 , H01L2924/014 , H01L2924/10253 , H01L2924/13091 , H01L2924/14 , H01L2924/15738 , H01L2924/15747 , H01L2924/1576 , H01L2924/181 , H01L2924/1815 , H01L2924/3025 , H01L2924/3511 , H05K1/144 , H05K1/181 , H05K3/3421 , Y10T29/49121
摘要： As the semiconductor chip is large-sized, highly integrated and speeded up, it becomes difficult to pack the semiconductor chip together with leads in a package. In view of this difficulty, there has been adopted the package structure called the "Lead-On-Chip" or "Chip-On-Lead" structure in which the semiconductor and the leads are stacked and packed. In the package of this structure, according to the present invention, the gap between the leading end portions of the inner leads and the semiconductor chip is made wider than that between the inner lead portions except the leading end portions and the semiconductor chip thereby to reduce the stray capacity, to improve the signal transmission rate and to reduce the electrical noises.

8. 发明授权

US5602420A Stacked high mounting density semiconductor devices 失效
标题翻译：堆叠的高安装密度半导体器件
公开(公告)号：US5602420A
公开(公告)日：1997-02-11
申请号：US429463
申请日：1995-04-27
申请人： Masatsugu Ogata , Teruo Kitamura , Shuji Eguchi , Kenji Akeyama
发明人： Masatsugu Ogata , Teruo Kitamura , Shuji Eguchi , Kenji Akeyama
IPC分类号： H01L25/00 , H01L25/10 , H01L23/02 , H01L23/48 , H01L23/495 , H01L23/52
CPC分类号： H01L25/105 , H01L2225/1064 , H01L2225/107 , H01L2924/0002
摘要： A semiconductor device is provided with a stack of a plurality of semiconductor elements each having a bump deposited on each of surface electrodes, and a plurality of leads disposed closely adjacent to the stacked semiconductor elements, the leads being bonded to the bumps respectively thereby structurally integrally assembling the plural semiconductor elements.
摘要翻译：半导体器件设置有多个半导体元件的堆叠，每个半导体元件具有沉积在每个表面电极上的凸块和与堆叠的半导体元件紧密相邻设置的多个引线，引线分别结合到凸块上，从而在结构上整合组装多个半导体元件。

9. 发明授权

US4129678A Self-bondable insulated wires comprising three coatings including a phenoxy resin outer layer 失效
标题翻译：包含三层涂层的自粘合绝缘电线，包括苯氧树脂外层
公开(公告)号：US4129678A
公开(公告)日：1978-12-12
申请号：US800788
申请日：1977-05-26
申请人： Masatoshi Seki , Moriichi Sato , Hideo Tsukioka , Etuo Ohe , Masatsugu Ogata , Akio Mitsuoka
发明人： Masatoshi Seki , Moriichi Sato , Hideo Tsukioka , Etuo Ohe , Masatsugu Ogata , Akio Mitsuoka
IPC分类号： H01B7/02 , H01B3/30 , H01B3/40 , H01B3/44 , B32B15/02 , B32B15/08 , H01B3/36
CPC分类号： H01B3/40 , H01B3/306 , H01B3/446 , Y10T428/2947
摘要： In a self-bondable insulated wire comprising a conductor and three resin insulating layers, the first resin insulating layer is formed with a resin selected from the group consisting of polyimide resins, polyamideimide resins and polyesterimide resins, the intermediate resin insulating layer is formed with a resin selected from the group consisting of polyvinyl formal resins and epoxy resins, and the outermost resin insulating layer is formed with a self-bondable resin of phenoxy series. Thus, a self-bondable insulated wire which is excellent in both oil resistance and heat resistance is obtained.
摘要翻译：在包括导体和三个树脂绝缘层的自粘合绝缘线中，第一树脂绝缘层由选自聚酰亚胺树脂，聚酰胺酰亚胺树脂和聚酯酰亚胺树脂的树脂形成，中间树脂绝缘层形成有选自聚乙烯醇缩甲醛树脂和环氧树脂的树脂，最外层树脂绝缘层由苯氧基系列的自粘合树脂形成。因此，获得耐油性和耐热性都优异的自粘合绝缘线。

10. 发明授权

US06303982B2 Semiconductor device 失效
公开(公告)号：US06303982B2
公开(公告)日：2001-10-16
申请号：US09771617
申请日：2001-01-30
申请人： Gen Murakami , Kunihiro Tsubosaki , Masahiro Ichitani , Kunihiko Nishi , Ichiro Anjo , Asao Nishimura , Makoto Kitano , Akihiro Yaguchi , Sueo Kawai , Masatsugu Ogata , Syuuji Eguchi , Hiroyoshi Kokaku , Masanori Segawa , Hiroshi Hozoji , Takashi Yokoyama , Noriyuki Kinjo , Aizo Kaneda , Junichi Saeki , Shozo Nakamura , Akio Hasebe , Hiroshi Kikuchi , Isamu Yoshida , Takashi Yamazaki , Kazuyoshi Oshima , Tetsuro Matsumoto
发明人： Gen Murakami , Kunihiro Tsubosaki , Masahiro Ichitani , Kunihiko Nishi , Ichiro Anjo , Asao Nishimura , Makoto Kitano , Akihiro Yaguchi , Sueo Kawai , Masatsugu Ogata , Syuuji Eguchi , Hiroyoshi Kokaku , Masanori Segawa , Hiroshi Hozoji , Takashi Yokoyama , Noriyuki Kinjo , Aizo Kaneda , Junichi Saeki , Shozo Nakamura , Akio Hasebe , Hiroshi Kikuchi , Isamu Yoshida , Takashi Yamazaki , Kazuyoshi Oshima , Tetsuro Matsumoto
IPC分类号： H01L23495
CPC分类号： H01L23/3107 , H01L23/4951 , H01L23/49555 , H01L23/49558 , H01L23/49568 , H01L23/49586 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/49 , H01L25/105 , H01L29/0657 , H01L2224/0401 , H01L2224/05554 , H01L2224/05599 , H01L2224/16245 , H01L2224/29111 , H01L2224/2919 , H01L2224/2929 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/4554 , H01L2224/4569 , H01L2224/48091 , H01L2224/48247 , H01L2224/4826 , H01L2224/48465 , H01L2224/48599 , H01L2224/48699 , H01L2224/48799 , H01L2224/49171 , H01L2224/73215 , H01L2224/73265 , H01L2224/85205 , H01L2224/8592 , H01L2224/92147 , H01L2225/1005 , H01L2225/1029 , H01L2225/107 , H01L2225/1088 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01023 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01039 , H01L2924/01043 , H01L2924/01045 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01058 , H01L2924/01074 , H01L2924/01075 , H01L2924/01079 , H01L2924/01092 , H01L2924/0132 , H01L2924/014 , H01L2924/07802 , H01L2924/10253 , H01L2924/13091 , H01L2924/14 , H01L2924/15738 , H01L2924/15747 , H01L2924/1576 , H01L2924/181 , H01L2924/1815 , H01L2924/3025 , H01L2924/3511 , H05K1/144 , H05K1/181 , H05K3/3421 , H01L2924/00012 , H01L2924/00 , H01L2924/01026 , H01L2924/3512 , H01L2924/0695 , H01L2224/85399
摘要： As the semiconductor chip is large-sized, highly integrated and speeded up, it becomes difficult to pack the semiconductor chip together with leads in a package. In view of this difficulty, there has been adopted the package structure called the “Lead-On-Chip” or “Chip-On-Lead” structure in which the semiconductor and the leads are stacked and packed. In the package of this structure, according to the present invention, the gap between the leading end portions of the inner leads and the semiconductor chip is made wider than that between the inner lead portions except the leading end portions and the semiconductor chip thereby to reduce the stray capacity, to improve the signal transmission rate and to reduce the electrical noises.

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