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1. 发明授权

US5358032A LSI package cooling heat sink, method of manufacturing the same and LSI package to which the heat sink is mounted 失效
标题翻译： LSI封装冷却散热器，其制造方法以及安装散热片的LSI封装
公开(公告)号：US5358032A
公开(公告)日：1994-10-25
申请号：US13423
申请日：1993-02-04
申请人： Masatsugu Arai , Akiomi Kohno , Toshio Hatada , Yoshihiro Kondo , Toshihiro Komatsu , Kanji Otsuka , Yuji Shirai , Susumu Iwai
发明人： Masatsugu Arai , Akiomi Kohno , Toshio Hatada , Yoshihiro Kondo , Toshihiro Komatsu , Kanji Otsuka , Yuji Shirai , Susumu Iwai
IPC分类号： H01L23/36 , F28F3/02 , H01L23/367 , H01L23/467 , F28F7/00
CPC分类号： F28F3/022 , H01L23/3677 , H01L2224/45015 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/49109 , H01L2224/73265 , H01L24/45 , H01L24/49 , H01L2924/01014 , H01L2924/01015 , H01L2924/01047 , H01L2924/01057 , H01L2924/01079 , H01L2924/01322 , H01L2924/14 , H01L2924/16195
摘要： Disclosed is an LSI package cooling heat sink having a heat diffusion plate and thin wire fins joined to the heat diffusion plate. The heat sink is mounted on an LSI package and the LSI package is cooled by the flowing of fluid through the thin wire fins. The wire fins are made of a net formed of longitudinal thin wires intersecting with horizontal thin wires. The net is formed to continuous rectangular shapes or a swirl shape and joined to the heat diffusion plate. The net is constituted so that the number of the thin wires vertical to the heat diffusion plate is larger than the number of the thin wires parallel thereto and the net is joined to the heat diffusion plate by brazing, diffusion joint, pressure welding or the like. Since the heat sink is formed of the net composed of the longitudinal thin wires intersecting with the horizontal thin wires, the irregular portions of the adjacent thin wires are formed at a dislocated position and fluid striking against the thin wires produces many turbulent flows so that a high heat transfer performance can be obtained. Further, since the net formed of the thin wires is used, the size of cooling fins can be reduced and noise can be also lowered. Further, it is possible to produce an LSI package cooling heat sink in a short time which heat sink is excellent in mass-production.
摘要翻译：公开了具有热扩散板的LSI封装冷却散热器和与散热板接合的细线散热片。散热器安装在LSI封装上，并且LSI封装通过流体流过细金属丝散热片来冷却。金属丝散热片由与水平细线相交的纵向细线形成的网构成。网形成为连续的矩形形状或漩涡形状并且连接到热扩散板。网构成为与散热板垂直的细线的数量大于与其平行的细线的数量，并且网通过钎焊，扩散接头，压焊等连接到热扩散板。由于散热器由与横向细线相交的纵向细线组成的网形成，所以相邻细线的不规则部分形成在脱位位置，并且撞击细线的流体产生许多湍流，使得可以获得高的传热性能。此外，由于使用由细线形成的网，所以能够降低散热片的尺寸，降低噪音。此外，可以在短时间内制造LSI封装冷却散热器，散热器的批量生产性优异。

2. 发明授权

US5796580A Air-cooled information processing apparatus having cooling air fan, sub-fan, and plural separated cooling air flow channels 失效
标题翻译：具有冷却风扇，副风扇和多个分离的冷却空气流动通道的风冷信息处理设备
公开(公告)号：US5796580A
公开(公告)日：1998-08-18
申请号：US226824
申请日：1994-04-13
申请人： Toshihiro Komatsu , Hitoshi Matsushima , Toshio Hatada , Susumu Iwai , Tetsuro Homma , Yoshihiro Kondo , Shouhei Fuse , Hiroshi Yamada , Kazuo Morita , Hiroshi Ito , Akiyoshi Iida , Kenta Kumagai , Shinichi Shimode
发明人： Toshihiro Komatsu , Hitoshi Matsushima , Toshio Hatada , Susumu Iwai , Tetsuro Homma , Yoshihiro Kondo , Shouhei Fuse , Hiroshi Yamada , Kazuo Morita , Hiroshi Ito , Akiyoshi Iida , Kenta Kumagai , Shinichi Shimode
IPC分类号： G06F1/20 , H05K7/20 , G06F1/16
CPC分类号： H05K7/20727 , G06F1/20
摘要： An air-cooled information processing apparatus has a plurality of units and a casing accommodating the units. At least one cooling air supply section and at least one cooling air discharge section are provided in the casing, for supplying cooling air into the apparatus and for discharging the air therefrom. A partition member divides the space inside the casing so as to define at least two cooling air flow channels between the cooling air supply section and the cooling air discharge section. At least one main fan unit is disposed in each of the cooling air flow channels. The cooling air flow channels include at least one first cooling air flow channel in which at least two units from among the plurality of units are disposed in parallel with each other with respect to the direction of flow of cooling air, and at least one second cooling air flow channel in which at least two units from among the plurality of units are arranged in series to each other along the flow of cooling air. This cooling arrangement ensures optimum cooling for different types of units in the apparatus, without being accompanied by rise in the noise level, rate of discharge of air, power consumption and production cost.
摘要翻译：风冷信息处理装置具有多个单元和容纳该单元的壳体。至少一个冷却空气供应部分和至少一个冷却空气排放部分设置在壳体中，用于将冷却空气供给到设备中并从中排出空气。分隔构件将壳体内的空间分隔开，以便在冷却空气供应部分和冷却空气排放部分之间限定至少两个冷却空气流动通道。至少一个主风扇单元设置在每个冷却空气流动通道中。冷却空气流动通道包括至少一个第一冷却空气流动通道，其中多个单元中的至少两个单元相对于冷却空气的流动方向彼此平行地设置，并且至少一个第二冷却空气流动通道，其中来自多个单元中的至少两个单元沿着冷却空气的流动彼此串联布置。该冷却装置确保了设备中不同类型单元的最佳冷却，而不伴随着噪声水平，空气排放速率，功率消耗和生产成本的上升。

3. 发明授权

US5195576A LSI cooling apparatus and computer cooling apparatus 失效
标题翻译： LSI冷却装置和计算机冷却装置
公开(公告)号：US5195576A
公开(公告)日：1993-03-23
申请号：US659671
申请日：1991-02-25
申请人： Toshio Hatada , Hitoshi Matsushima , Yoshihiro Kondou , Hiroshi Inoue , Kanji Otsuka , Yuji Shirai , Takao Ohba , Akira Yamagiwa
发明人： Toshio Hatada , Hitoshi Matsushima , Yoshihiro Kondou , Hiroshi Inoue , Kanji Otsuka , Yuji Shirai , Takao Ohba , Akira Yamagiwa
IPC分类号： H01L23/473 , F28F3/02 , H01L23/367 , H01L23/467 , H05K7/10 , H05K7/20
CPC分类号： F28F3/022 , H01L23/3672 , H01L23/3677 , H01L23/467 , H05K7/1015 , H01L2224/45015 , H01L2224/49109 , H01L24/49 , H01L2924/00014 , H01L2924/01014 , H01L2924/01068 , H01L2924/16195
摘要： An LSI cooling apparatus having various structures is used in electronic devices such as computer systems. In particular, the LSI cooling of apparatus is suitable for cooling of LSIs having high heat generating densities. In a cooling apparatus of the present invention, a heat sink is constructed to be small in pressure loss and excellent in cooling performance. This is because the heat sink comprises thin wire fins so set that the Reynold's number may not exceed 40. As a result, LSIs generating a large amount of heat can be cooled. Further, a heat sink having rigidity can be obtained by disposing wide-width wire drawn substances in thin wires or by using supports. Further, a computer comprising LSIs equipped with heat sinks can cope with various cooling air sending methods and it can be cooled with low noises.
摘要翻译：具有各种结构的LSI冷却装置用于诸如计算机系统的电子设备中。特别地，装置的LSI冷却适用于具有高发热密度的LSI的冷却。在本发明的冷却装置中，散热器的压力损失小，冷却性能优异。这是因为散热器包括细线散热片，使得雷诺数不得超过40个。结果，可以冷却产生大量热量的LSI。此外，通过将宽幅拉丝物质设置在细线中或通过使用支撑体，可以获得具有刚性的散热器。此外，包括散热器的LSI的计算机可以应对各种冷却空气送出方法，并且可以以低噪声进行冷却。

4. 发明授权

US5365402A Cooling apparatus of electronic device 失效
标题翻译：电子设备冷却装置
公开(公告)号：US5365402A
公开(公告)日：1994-11-15
申请号：US800268
申请日：1991-11-29
申请人： Toshio Hatada , Shigeo Ohashi , Tadakatsu Nakajima , Heikichi Kuwahara , Hitoshi Matsushima , Motohiro Sato , Hiroshi Inouye , Takao Ohba , Akira Yamagiwa , Kanji Otsuka , Yuuji Shirai
发明人： Toshio Hatada , Shigeo Ohashi , Tadakatsu Nakajima , Heikichi Kuwahara , Hitoshi Matsushima , Motohiro Sato , Hiroshi Inouye , Takao Ohba , Akira Yamagiwa , Kanji Otsuka , Yuuji Shirai
IPC分类号： H01L23/36 , H01L23/367 , H01L23/40 , H01L23/433 , H05K7/20
CPC分类号： H01L23/433 , H01L23/3677 , H01L23/4006 , H01L2023/405 , H01L2224/32188 , H01L2224/451 , H01L2224/48091 , H01L2224/48227 , H01L2224/49109 , H01L2224/73265 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2924/00014 , H01L2924/15312 , H01L2924/1532 , H01L2924/16195
摘要： A cooling apparatus for an electronic device of high calorific density including an elastomer interposed between a semiconductor chip and a heat sink so as to connect them thermally. The elastomer may also be in close contact with a large number of semiconductor chips having various configurations which are mounted on a board, so that the elastomer is thermally connected with them, whereby the elastomer absorbs thermal deformations.
摘要翻译：一种用于高热密度的电子装置的冷却装置，包括插入在半导体芯片和散热片之间的弹性体，以便将它们热连接。弹性体还可以与安装在板上的具有各种构造的大量半导体芯片紧密接触，使得弹性体与它们热连接，由此弹性体吸收热变形。

5. 发明授权

US5646824A Electronic equipment and lap-top type electronic equipment 失效
标题翻译：电子设备和膝上型电子设备
公开(公告)号：US5646824A
公开(公告)日：1997-07-08
申请号：US489623
申请日：1995-06-12
申请人： Shigeo Ohashi , Toshio Hatada , Takeo Tanaka , Susumu Iwai
发明人： Shigeo Ohashi , Toshio Hatada , Takeo Tanaka , Susumu Iwai
IPC分类号： F28D15/02 , G06F1/20 , H01L23/473 , H05K7/20
CPC分类号： G06F1/203 , F28D15/00 , F28D15/0266 , H01L23/473 , G06F2200/201 , H01L2924/0002
摘要： A flat shaped header having a heat receiving side is attached to a semiconductor element mounted on a circuit board. The header having the heat receiving side is connected to another header having a heat receiving side attached to a plurality of heat radiating fins so as to form a heat exchanging radiator which heat radiating fins are installed at a peripheral portion of a body of electronic equipment. The heat generated by the semiconductor element is transmitted by liquid moving between the headers via flexible tubes and then to the heat radiating fins, which heat is discharged outside of the body of equipment. Since the flat shaped header and the flexible tubes are employed, a high heat generating semiconductor element and the heat radiating fins are thermally connected with ease without being influenced by the configurational condition in the equipment even when many semiconductor elements are mounted inside a small space.
摘要翻译：具有热接收侧的扁平头部安装在安装在电路板上的半导体元件上。具有热接收侧的集管连接到具有附接到多个散热片的热接收侧的另一个集管，以形成散热片安装在电子设备主体的周边部分的散热片。由半导体元件产生的热量通过液体通过柔性管在集管之间移动，然后传递到散热片，热量被排放到设备本体外部。由于使用扁平形的集管和柔性管，因此即使在许多半导体元件安装在小空间内的情况下，高发热半导体元件和散热片也容易热连接而不受设备的结构条件的影响。

6. 发明授权

US5428503A Jet cooling apparatus for cooling electronic equipment and computer having the same mounted thereon 失效
标题翻译：用于冷却电子设备的喷射冷却装置和安装在其上的计算机
公开(公告)号：US5428503A
公开(公告)日：1995-06-27
申请号：US317614
申请日：1994-09-26
申请人： Hitoshi Matsushima , Toshihiro Komatu , Yoshihiro Kondou , Toshio Hatada , Susumu Iwai , Tetsuro Honma , Toshiki Iino , Takao Ohba , Akira Yamagiwa
发明人： Hitoshi Matsushima , Toshihiro Komatu , Yoshihiro Kondou , Toshio Hatada , Susumu Iwai , Tetsuro Honma , Toshiki Iino , Takao Ohba , Akira Yamagiwa
IPC分类号： H05K7/20
CPC分类号： H05K7/20154 , Y10S165/908
摘要： A cooling apparatus for electronic equipment for improving the reliability of the equipment by making uniform the temperature distribution of heat generating devices mounted on the electronic equipment, more particularly on a computer and for reducing the working process required at the time of performing a maintenance of a printed circuit board in the electronic equipment by stacking, in a frame, the electronic printed circuit boards on which the heat generating devices, such as a CPU and memories, are mounted at predetermined intervals. The cooling apparatus has a fan fastened to one wall surface of a chamber and a plurality of jet cooling devices formed on the surface opposing the wall surface. The jet cooling devices are formed in parallel to the printed circuit boards. The jet cooling devices are slits, or nozzles or jet stream ducts extending among the printed circuit boards and are so formed as to supply cooling air in a jet stream state to each heat generating device. Therefore, the cooling air can be concentrated to locally cool the printed circuit board including the device that generates heat of a large heating value. Hence, the temperature rise in the heat generating devices can be made uniform.
摘要翻译：一种用于电子设备的冷却装置，用于通过使安装在电子设备上的发热装置的温度分布均匀，更具体地在计算机上，并且为了减少进行维护时所需的工作过程而提高设备的可靠性电子设备中的印刷电路板通过在框架中堆叠以预定间隔安装诸如CPU和存储器的发热装置的电子印刷电路板。冷却装置具有固定在室的一个壁表面上的风扇和形成在与壁表面相对的表面上的多个喷射冷却装置。喷射冷却装置与印刷电路板平行地形成。喷射冷却装置是在印刷电路板之间延伸的狭缝或喷嘴或喷射流管道，并且形成为将喷射流状态的冷却空气供应到每个发热装置。因此，冷却空气可以集中以局部冷却印刷电路板，包括产生大热值的热的装置。因此，能够使发热元件的温度上升均匀。

7. 发明授权

US5313362A Packaging structure of small-sized computer 失效
标题翻译：小型电脑包装结构
公开(公告)号：US5313362A
公开(公告)日：1994-05-17
申请号：US885979
申请日：1992-05-20
申请人： Toshio Hatada , Hiroshi Inouye , Takao Ohba , Susumu Iwai
发明人： Toshio Hatada , Hiroshi Inouye , Takao Ohba , Susumu Iwai
IPC分类号： G06F1/20 , H01L23/36 , H01L23/467 , H05K7/20
CPC分类号： G06F1/203
摘要： In a small-sized computer of a natural air-cooling type, a high-temperature radiator promotes natural convection so as to increase a quantity of heat radiation and to raise the allowable limit of heat generation of LSI chips, thereby improving the processing speed of the computer. For this purpose, a casing and fins are utilized as heat radiators at relatively low temperatures of about 40.degree. C. which are safe even if they are touched by an operator's hands. On the other hand, the high-temperature radiator set at about 50.degree. to 60.degree. C. is provided inside of the casing, thus preventing the operator's hands from touching it directly. Heat generated by the LSI chips and so forth is transmitted to the high-temperature radiator through heat conduction or the like, and heat exchange is performed between the high-temperature radiator increased in temperature and the air introduced into the casing, in order to promote natural convection inside of the casing.
摘要翻译：在天然空气冷却型的小型计算机中，高温散热器促进自然对流，从而增加散热量，并且提高LSI芯片的允许的发热极限，从而提高处理速度电脑为此，在约40℃的相对低的温度下，壳体和翅片被用作热辐射器，即使操作者的手被触摸也是安全的。另一方面，在壳体内部设置约50〜60℃的高温散热器，防止操作者的手直接接触。通过LSI芯片等产生的热量通过热传导等传递到高温散热器，并且在升温的高温散热器和引入壳体的空气之间进行热交换，以促进套管内部自然对流。

8. 发明授权

US5077601A Cooling system for cooling an electronic device and heat radiation fin for use in the cooling system 失效
标题翻译：用于冷却电子设备的冷却系统和用于冷却系统的散热片
公开(公告)号：US5077601A
公开(公告)日：1991-12-31
申请号：US404350
申请日：1989-09-07
申请人： Toshio Hatada , Takayuki Atarashi , Takahiro Daikoku , Satomi Kobayashi , Shizuo Zushi , Fumiyuki Kobayashi , Susumu Iwai
发明人： Toshio Hatada , Takayuki Atarashi , Takahiro Daikoku , Satomi Kobayashi , Shizuo Zushi , Fumiyuki Kobayashi , Susumu Iwai
IPC分类号： H01L23/467
CPC分类号： H01L23/467 , H01L2924/0002
摘要： A cooling system for cooling an electronic device by allowing a cooling fluid to flow in contact with heat generating components such as LSI chips of the electronic device arranged in series along the major flow of the cooling fluid. The cooling system has heat radiation fins attached to the heat-generating components, and a cooling duct defining a cooling fluid flow passage in which assemblies composed of the heat-generating components and the heat radiation fins are disposed. The flow passage has, at the upstream end of the upstream end assembly, a cross-sectional area greater than that of the assembly when taken in a plane perpendicular to the direction of the major flow of the cooling fluid. The cross-sectional area of the flow passage progressively decreases towards the downstream end, whereby the flow passage is divided into a main passage through which a main flow component of the cooling fluid directly flows into the series of assemblies and an auxiliary passage through which an auxiliary component of the cooling fluid flows substantially vertically towards the heat-generating component to impinge upon the heat generating component.
摘要翻译：一种冷却系统，用于通过使冷却流体沿着沿着冷却流体的主流排列成串联的电子装置的发热部件等发热部件而流动而冷却电子设备。冷却系统具有附接到发热部件的散热翅片，以及限定冷却流体流动通道的冷却管道，其中设置有由发热部件和散热翅片组成的组件。当在垂直于冷却流体的主流方向的平面中时，流动通道在上游端组件的上游端处具有大于组件的截面面积的横截面面积。流动通道的横截面积朝向下游端逐渐减小，由此流动通道被分成主通道，冷却流体的主流分量通过该主通道直接流入一系列组件和辅助通道，通过该辅助通道冷却流体的辅助部件基本垂直地朝着发热部件流动以撞击发热部件。

9. 发明授权

US5315482A Semiconductor apparatus of module installing type 失效
标题翻译：模块安装型半导体装置
公开(公告)号：US5315482A
公开(公告)日：1994-05-24
申请号：US961394
申请日：1992-10-15
申请人： Akira Tanaka , Hiroichi Shinohara , Kazuji Yamada , Takao Ohba , Akira Yamagiwa , Hitoshi Yoshidome , Yuji Shirai , Toshio Hatada , Munehisa Kishimoto , Michiharu Honda
发明人： Akira Tanaka , Hiroichi Shinohara , Kazuji Yamada , Takao Ohba , Akira Yamagiwa , Hitoshi Yoshidome , Yuji Shirai , Toshio Hatada , Munehisa Kishimoto , Michiharu Honda
IPC分类号： H01L23/36 , H01L23/367 , H01L25/10 , H05K1/02 , H05K1/14 , H05K1/18 , H05K3/00 , H05K3/36 , H05K7/20
CPC分类号： H05K1/021 , H01L23/367 , H01L25/105 , H01L2225/107 , H01L2225/1094 , H01L2924/0002 , H05K1/141 , H05K1/182 , H05K2203/049 , H05K3/0061 , H05K3/366
摘要： A semiconductor apparatus comprises a heat diffusing plate and a surface installing printed board. A semiconductor device of a high heat generation is installed on the heat diffusing plate. A surface installing package and chip parts are installed on both surfaces of the printed board. A through hole is formed at the center of the printed board so that the semiconductor device is located at the center. The heat diffusing plate on which the semiconductor device has been installed and the surface installing printed board are connected and integrated.
摘要翻译：半导体装置包括热扩散板和表面安装印刷板。在散热板上安装有高发热的半导体装置。表面安装封装和芯片部件安装在印刷电路板的两个表面上。在印刷电路板的中心形成通孔，使得半导体器件位于中心。已经安装了半导体器件的散热板和表面安装印刷板连接并整合。

10. 发明授权

US5361188A Cooling apparatus of electronic equipment 失效
标题翻译：电子设备冷却装置
公开(公告)号：US5361188A
公开(公告)日：1994-11-01
申请号：US115669
申请日：1993-09-02
申请人： Yoshihiro Kondou , Hitoshi Matsushima , Toshio Hatada , Hiroshi Inouye , Toshihiro Komatsu , Takao Ohba , Akira Yamagiwa
发明人： Yoshihiro Kondou , Hitoshi Matsushima , Toshio Hatada , Hiroshi Inouye , Toshihiro Komatsu , Takao Ohba , Akira Yamagiwa
IPC分类号： H05K7/20 , H01L23/467
CPC分类号： H01L23/467 , H05K7/20563 , H01L2224/32 , H01L2224/73253 , Y10S165/908
摘要： In a cooling apparatus of an electronic equipment, a plurality each of integrated circuit devices and large-scale integrated circuit devices are mounted onto a plurality of substrates, respectively, and a cooling fan supplies cooling air from outside to each of these integrated circuit devices. A duct having a comb-tooth shape suitable for encompassing each substrate and defining flow paths along the substrates introduces the cooling air supplied by the cooling fan to each of the integrated circuit devices. The duct includes a plurality of small holes disposed at positions corresponding to the positions of the integrated circuit devices on the substrates and having open areas corresponding to the heating values of the integrated circuit devices. The small holes flow the cooling air supplied by the cooling fan as jet streams to the integrated circuit devices. This jet stream cooling improves cooling performance and can make uniform the temperature distribution of the integrated circuit devices.
摘要翻译：在电子设备的冷却装置中，分别将多个集成电路装置和大型集成电路装置安装在多个基板上，并且冷却风扇从外部向这些集成电路装置中的每一个提供冷却空气。具有适于包围每个基板并且沿着基板限定流动路径的梳齿形状的管道将由冷却风扇供应的冷却空气引入到每个集成电路装置。导管包括多个小孔，其设置在与基板上的集成电路器件的位置对应的位置处，并且具有与集成电路器件的发热值对应的开放区域。这些小孔将作为喷射流的冷却风扇供给的冷却空气流向集成电路装置。这种喷射流冷却改善了冷却性能，并且可以使集成电路器件的温度分布均匀。

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