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    • 1. 发明授权
    • Substrate processing method and substrate processing system
    • 基板加工方法和基板处理系统
    • US07445689B2
    • 2008-11-04
    • US10682005
    • 2003-10-08
    • Masahiro YoshidaYasuhiro Chouno
    • Masahiro YoshidaYasuhiro Chouno
    • C23F1/00H01L21/306
    • H01L21/67751H01L21/67167H01L21/67178H01L21/6719H01L21/67236Y10S414/135
    • The substrate processing system has an ozone generator that generates and supplies an ozone-containing gas to plural or N (N is a natural number not less than 2) ozone process units. The ozone generator has capacity of supplying the first processing fluid to only N−n of the first processing units simultaneously at respective supply rates each in accordance with a demand for appropriately performing the first process in each of the first processing units, where n is a natural number and N−n is not less than 2. A controller that controls a timing of loading of the substrate into the ozone process units by the conveyer so as to avoid a case where more than N−n of the first processing units are simultaneously carrying out the first treatment each using the first processing fluid, where n is a natural number and N−n is not less than 2.
    • 基板处理系统具有臭氧发生器,该臭氧发生器产生并供给含臭氧的气体至多个或N(N为自然数不少于2个)臭氧处理单元。 臭氧发生器具有根据在每个第一处理单元中适当地执行第一处理的需求以相应的供给速率同时向第一处理单元中的Nn提供第一处理流体的能力,其中n是自然数 Nn不小于2.一种控制器,其控制由输送机将基板装载到臭氧处理单元中的定时,以避免多于Nn个第一处理单元同时进行第一处理的情况 使用第一处理流体,其中n是自然数,Nn不小于2。
    • 2. 发明授权
    • Substrate processing apparatus
    • 基板加工装置
    • US08978670B2
    • 2015-03-17
    • US12897384
    • 2010-10-04
    • Junya MinamidaIssei UedaYasuhiro ChounoOsamu KurodaKazuyoshi EshimaMasahiro YoshidaSatoshi Morita
    • Junya MinamidaIssei UedaYasuhiro ChounoOsamu KurodaKazuyoshi EshimaMasahiro YoshidaSatoshi Morita
    • B08B3/00H01L21/67
    • H01L21/67051H01L21/6708H01L21/67178H01L21/6719H01L21/67196Y10S414/135
    • Provided is a substrate processing apparatus wherein, even if a trouble occurs, it is bound to continue a process for the substrate without stopping the substrate processing apparatus entirely. The substrate processing apparatus according to the present disclosure includes first and second substrate conveying devices configured to convey wafers, and first and second processing blocks provided on the right and left sides of the substrate conveying device and having processing unit arrays each configured to perform the same process. Processing unit arrays on one side and processing unit arrays on the other side are respectively connected to a processing liquid supply system commonly provided with them. And, when any one of substrate conveying devices, processing liquid supply systems has a problem, the process for the wafer can be performed in the processing unit array to which the substrate conveying device and the processing liquid supply system under normal operation belong.
    • 提供了一种基板处理装置,其中即使发生故障,也必须在不停止基板处理装置的情况下继续进行基板的处理。 根据本公开的基板处理装置包括被配置为输送晶片的第一和第二基板输送装置,以及设置在基板输送装置的左侧和左侧的第一和第二处理块,并且具有各自被配置为执行相同的处理单元阵列 处理。 一侧的处理单元阵列和另一侧的处理单元阵列分别连接到通常设置有它们的处理液体供应系统。 并且,当基板输送装置中的任一个处理液供给系统存在问题时,可以在基板输送装置和处理液供给系统正常运转所属的处理单元阵列中进行晶片的处理。
    • 5. 发明申请
    • Substrate processing container
    • 基材加工容器
    • US20060102210A1
    • 2006-05-18
    • US10522155
    • 2003-07-25
    • Yasuhiro ChounoNorihiro Ito
    • Yasuhiro ChounoNorihiro Ito
    • B08B3/04
    • H01L21/67748H01L21/68728H01L21/68742
    • A substrate processing vessel has a vessel body 100 and a cover 130 hermetically joined to the vessel body 100. The vessel body 100 is provided with a plurality of substrate support rods 102. Each of the support rods 102 has a shank 103 and a head 104 having a diameter greater than that of the shank 103 and attached to the upper end of the shank 103. The shanks 103 penetrate the vessel body 100 and project downward from the vessel body 100. When each substrate support rod 102 is lowered to its lower position, the head 104 is seated hermetically on a part, around the open upper end of a through hole 108 through which the shank 103 is inserted, of the vessel body 100. When each substrate support rod 102 is raised to its upper position, a space of a big thickness capable of receiving a wafer carrying arm 14a is formed between the upper surface of the vessel body 100 and a wafer W supported on the substrate support rods 102. A processing space defined by the substrate processing vessel may be very thin, the amount of a processing fluid necessary for processing the wafer W can be reduced and throughput can be increased.
    • 衬底处理容器具有容器主体100和与容器主体100密封接合的盖130.容器主体100设置有多个基板支撑杆102.每个支撑杆102具有柄103和头部104 其直径大于柄103的直径并且附接到柄103的上端。柄103穿透血管主体100并从血管主体100向下突出。当每个基底支撑杆102下降到其较低位置 头部104气密地坐在容器主体100的一个部分上,该部分围绕容器主体100插入的通孔108的敞开的上端。当每个基板支撑杆102升高到其上部位置时, 在容器主体100的上表面和支撑在基板支撑杆102上的晶片W之间形成能够接收晶片承载臂14a的大厚度的厚度。由基板处理容器ma限定的处理空间 y非常薄,可以减少处理晶片W所需的处理流体的量,并且可以提高生产量。
    • 6. 发明授权
    • Pneumatically driven liquid supply apparatus
    • 气动驱动液体供应装置
    • US06186171B1
    • 2001-02-13
    • US09268183
    • 1999-03-15
    • Hiroshi TanakaYasuhiro ChounoTakashi TeradaSatoshi Nakashima
    • Hiroshi TanakaYasuhiro ChounoTakashi TeradaSatoshi Nakashima
    • F04B4900
    • F04B9/1372Y10T137/86043
    • In a pneumatically driven liquid supply apparatus comprising a circulation pump 26 or constant-volume pump 34 for supplying a washing liquid or chemical to a washing tank 20 for semiconductor wafers used during the fabrication of semiconductor devices; an electromagnetic switching valve 51 and a pressure regulator 52 that configure an air-pressure adjustment means 50 are connected to an air source 60; and air supply pipelines 41a, 41b, 41d, and 41e are each connected to the air-pressure adjustment means 50, the circulation pump 26 and the constant-volume pump 34. A leakage sensor 70 is interposed within each of the air supply pipelines 41a, 41b, 41d, and 41e between the air-pressure adjustment means 50 and the circulation pump 26 or constant-volume pump 34, so that any liquid that flows backward through the circulation pump 26 or the constant-volume pump 34 and into the air supply pipeline 41a, 41b, 41d, or 41e is detected by the leakage sensor 70. This makes it possible to prevent damage or halting of the functions of the air-pressure adjustment means due to liquid flowing into the air supply pipelines via one of the pumps.
    • 在气动驱动液体供给装置中,包括循环泵26或恒定容积泵34,用于将洗涤液或化学品供应到半导体器件制造期间使用的半导体晶片的洗涤槽20; 构成气压调节装置50的电磁切换阀51和压力调节器52连接到空气源60; 空气供给管道41a,41b,41d,41e分别与气压调节机构50,循环泵26,恒定容积泵34连接。另外,在各供气管41a 空气压力调节装置50与循环泵26或恒定体积泵34之间的流体,41b,41d和41e,使得流过循环泵26或恒定容积泵34并进入空气的任何液体 供给管道41a,41b,41d或41e由泄漏传感器70检测。这使得可以防止由于液体经由空气供应管线中的一个流入空气供应管道而导致的空气压力调节装置的功能的损坏或停止 泵。