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1. 发明授权

US06888072B2 Fixture, circuit board with fixture, and electronic-component mounted body and method of manufacturing the same 失效
标题翻译：夹具，带夹具的电路板和电子元件安装体及其制造方法
公开(公告)号：US06888072B2
公开(公告)日：2005-05-03
申请号：US09810846
申请日：2001-03-16
申请人： Masahide Tsukamoto , Kazufumi Yamaguchi , Takeshi Shimamoto , Fumikazu Tateishi
发明人： Masahide Tsukamoto , Kazufumi Yamaguchi , Takeshi Shimamoto , Fumikazu Tateishi
IPC分类号： H01L21/68 , H01L23/32 , H05K3/32 , H05K1/16
CPC分类号： H01L21/6835 , H01L23/32 , H01L24/16 , H01L24/72 , H01L2224/16238 , H01L2224/73251 , H01L2224/81901 , H01L2924/01078 , H01L2924/19041 , H05K3/325 , Y10T29/49137 , H01L2224/16 , H01L2224/72
摘要： A fixture with movable pawls and positioning walls is attached to a circuit board. An electronic component is inserted into the fixture from its upper side. Since the movable pawls move outward due to their slopes, the electronic component is allowed to fit between the positioning walls. After the fitting of the electronic component, the movable pawls hold the sides of the upper face of the electronic component and the positioning walls are in contact with the peripheral walls of the electronic component. Bumps provided on electrode pads of the electronic component are connected to electrodes on the circuit board. Thus, the electronic component can be mounted using the flip chip technique. In addition, the electronic component can be removed easily by moving the movable pawls even after being mounted.
摘要翻译：具有可移动爪和定位壁的夹具连接到电路板。电子部件从其上侧插入固定装置。由于可动爪由于其斜面而向外移动，所以允许电子部件配合在定位壁之间。在电子部件的装配之后，可动爪保持电子部件的上表面的侧面并且定位壁与电子部件的周壁接触。提供在电子部件的电极焊盘上的凸起连接到电路板上的电极。因此，可以使用倒装芯片技术来安装电子部件。此外，即使在安装之后，通过移动可动爪也能够容易地去除电子部件。

2. 发明授权

US06683260B2 Multilayer wiring board embedded with transmission line conductor 失效
标题翻译：多层布线板嵌入传输线导体
公开(公告)号：US06683260B2
公开(公告)日：2004-01-27
申请号：US09897127
申请日：2001-07-03
申请人： Takeshi Shimamoto , Kazufumi Yamaguchi , Masahide Tsukamoto , Fumikazu Tateishii , Yutaka Taguchi
发明人： Takeshi Shimamoto , Kazufumi Yamaguchi , Masahide Tsukamoto , Fumikazu Tateishii , Yutaka Taguchi
IPC分类号： H05K100
CPC分类号： H05K1/0245 , H01P3/08 , H05K1/0219 , H05K1/0242 , H05K1/09 , H05K3/107 , H05K2201/0305 , H05K2201/09036 , H05K2201/09118 , H05K2201/09236 , H05K2201/098 , H05K2201/09981 , Y10T29/49126
摘要： Transmission line structure is composed of a pair of signal conductors which are embedded in one wiring region of a dielectric layer and a thickness in height of the signal conductor is larger than a width, and is constituted so that a coupling impedance between the adjacent signal conductors is lower than a coupling impedance between the signal conductor and another conductor formed in another wiring region, and thus to provide a multi-layer wiring board having a transmission line structure of high wiring density and excellent transmission characteristic.
摘要翻译：传输线结构由嵌入在电介质层的一个布线区域中的一对信号导体组成，信号导体的高度大于宽度，并且构成为使得相邻信号导体之间的耦合阻抗低于在另一布线区域中形成的信号导体和另一导体之间的耦合阻抗，从而提供具有高布线密度和优良传输特性的传输线结构的多层布线板。

3. 发明授权

US6045897A Nonwoven fabric cloth substrate for printed wiring boards, and prepreg using the same 失效
标题翻译：印刷电路板用无纺布布基材和使用其的预浸料
公开(公告)号：US6045897A
公开(公告)日：2000-04-04
申请号：US178852
申请日：1998-10-26
申请人： Masayuki Sakai , Hideo Hatanaka , Masahide Tsukamoto , Seiichi Nakatani , Masayuki Okano , Tamao Kojima
发明人： Masayuki Sakai , Hideo Hatanaka , Masahide Tsukamoto , Seiichi Nakatani , Masayuki Okano , Tamao Kojima
IPC分类号： B32B15/14 , C08J5/04 , C09D5/25 , D04H1/00 , D04H1/42 , D04H1/58 , D21H13/26 , D21H17/52 , H05K1/02 , H05K1/03 , D21H13/02
CPC分类号： H05K1/0366 , B32B15/14 , C08J5/04 , D04H1/00 , D04H1/4342 , D04H1/4382 , D04H1/64 , D21H13/26 , D21H17/52 , H05K1/024 , H05K2201/0239 , H05K2201/0278 , H05K2201/0293 , H05K2203/0783 , H05K2203/087 , H05K2203/097 , H05K2203/1105 , Y10T442/198 , Y10T442/2049 , Y10T442/2475 , Y10T442/2902 , Y10T442/626
摘要： A nonwoven fabric cloth substrate for printed wiring boards containing aromatic polyamide fibers and having a 0.7-1.0 dynamic elastic modulus ratio (E' (250.degree. C.)/E' (30.degree. C.)) and a 0.05 or less loss tangent (Tan .delta.) peak value at 30-250.degree. C., and a prepreg and a printed wiring board using the nonwoven fabric cloth substrate.
摘要翻译：一种包含芳族聚酰胺纤维并且具有0.7-1.0动态弹性模量比（E'（250℃）/ E'（30℃））和0.05或更小的损耗角正切的印刷线路板的无纺布基底 Tan delta）峰值，以及使用该无纺布基板的预浸料坯和印刷线路板。

4. 发明授权

US5960538A Printed circuit board 失效
标题翻译：印刷电路板
公开(公告)号：US5960538A
公开(公告)日：1999-10-05
申请号：US31082
申请日：1998-02-26
申请人： Kouji Kawakita , Seiichi Nakatani , Masahide Tsukamoto
发明人： Kouji Kawakita , Seiichi Nakatani , Masahide Tsukamoto
IPC分类号： H05K1/11 , H01L21/48 , H01L23/367 , H01L23/538 , H05K1/02 , H05K3/06 , H05K3/40 , H05K3/46 , H05K3/02
CPC分类号： H05K3/4069 , H01L21/4857 , H01L21/486 , H01L23/3677 , H01L23/5384 , H05K1/0206 , H01L2224/16 , H01L2224/16235 , H01L2924/01046 , H01L2924/01079 , H01L2924/15311 , H05K2201/0209 , H05K2201/0355 , H05K2201/10378 , H05K2203/0191 , H05K2203/1461 , H05K3/4614 , H05K3/462 , H05K3/4623 , H05K3/4652 , Y10S428/901 , Y10T29/49124 , Y10T29/49155 , Y10T29/49156 , Y10T428/24917 , Y10T428/24926
摘要： The present invention provides a printed circuit board in which electrode layers can electrically be connected by an inner-through-hole connection, the coefficient of thermal expansion of the board is equal to that of a semiconductor, high thermal conductivity can be obtained and wiring can be formed at a high density. A cover film is laminated on both surfaces of a resin impregnated fabric sheet, holes are formed by laser beams in the direction of the thickness of the sheet and cover film, an electrically conductive paste that contains the electrically conductive particles and a thermosetting resin is filled in the holes. The cover film is removed, a copper foil is placed on both sides of the sheet, and pressed and heated, and the resin component of the sheet and that of the electrically conductive paste are hardened. The copper foil is etched to form circuit patterns, and further etching removes the electrically conductive particles present at a surface layer portion so that an electrical insulating layer is thus formed.
摘要翻译：本发明提供一种印刷电路板，其中电极层可以通过内部通孔连接而电连接，板的热膨胀系数等于半导体的热膨胀系数，可以获得高导热性，并且布线可以以高密度形成。在树脂浸渍织物片的两个表面上层压覆盖膜，在片材和覆盖膜的厚度方向上通过激光束形成孔，填充含有导电性粒子和热固性树脂的导电性糊剂在洞里除去覆盖膜，将铜箔放置在片材的两侧，并被加压和加热，并且片材的树脂成分和导电膏的树脂成分硬化。蚀刻铜箔以形成电路图案，并且进一步蚀刻除去存在于表面层部分的导电颗粒，从而形成电绝缘层。

5. 发明授权

US5407511A Process for forming a sintered conductor circuit board 失效
标题翻译：形成烧结导体电路板的工艺
公开(公告)号：US5407511A
公开(公告)日：1995-04-18
申请号：US214267
申请日：1994-03-17
申请人： Seiichi Nakatani , Masahide Tsukamoto , Mikinari Shimada
发明人： Seiichi Nakatani , Masahide Tsukamoto , Mikinari Shimada
IPC分类号： H05K1/09 , C04B35/583 , H01L21/48 , H05K1/03 , H05K1/11 , H05K3/20 , H05K3/40 , H05K3/46 , B44C1/165 , B32B31/00
CPC分类号： C04B35/583 , H01L21/4857 , H01L21/4867 , H05K3/207 , H05K3/4069 , H05K1/0313 , H05K1/092 , H05K1/095 , H05K2201/0394 , H05K2203/016 , H05K2203/1453 , H05K2203/1461 , H05K3/4614 , H05K3/462
摘要： A circuit board that is made compact or highly dense and can be prepared using no chemical etching is obtained by patternwise printing a sinterable conductor on a releasing substrate, sintering the conductor by heating at a given temperature, and transferring the sintered conductor to a resin support. A plurality of sintered conductors each prepared by the above process may be laminated to give a multi-layered circuit board.
摘要翻译：通过在剥离基板上图案化印刷可烧结导体，通过在给定温度下加热烧结导体，并将烧结导体转印到树脂载体上，获得致密或高密度且不经化学蚀刻制备的电路板。可以将通过上述方法制备的多个烧结导体层叠以形成多层电路板。

6. 发明授权

US5141461A Method of forming a metal-backed layer and a method of forming an anode 失效
标题翻译：形成金属背层的方法和形成阳极的方法
公开(公告)号：US5141461A
公开(公告)日：1992-08-25
申请号：US478499
申请日：1990-02-12
申请人： Yutaka Nishimura , Masahide Tsukamoto , Hirotoshi Watanabe , Kohji Matsuo , Noboru Aikawa
发明人： Yutaka Nishimura , Masahide Tsukamoto , Hirotoshi Watanabe , Kohji Matsuo , Noboru Aikawa
IPC分类号： H01J9/14 , H01J29/08 , H01J29/28
CPC分类号： H01J29/085 , H01J29/28 , H01J9/14
摘要： This invention proposes methods of effectively forming a metal-backed layer and an anode using a metal film transferring sheet in which micro-holes are formed. that is, the metal film transferring sheet is structured by forming a metal film on a mold-releasable, highly characteristic sheet. Then, the metal film having micro-holes of the metal film transferring sheet is transferred onto a phosphor screen. Or, on the metal film of the above-mentioned metal film transferring sheet, is formed a phosphor screen and the metal film, the phosphor screen, etc. are all transferred onto a face plate form an anode of a cathode-ray tube. Then the methods proposed by this invention are applied for making phosphor products of, for example, a cathode-ray tube or a plasma display. According to these methods, there is no need to use a large-scaled manufacturing facility and high quality, low cost products can be obtainable.

7. 发明授权

US5006189A Coating method and cleaning method for heat-soluble material 失效
标题翻译：热溶性材料的涂布方法和清洗方法
公开(公告)号：US5006189A
公开(公告)日：1991-04-09
申请号：US357597
申请日：1989-05-26
申请人： Masahide Tsukamoto , Yutaka Nishimura , Yasuo Fukui
发明人： Masahide Tsukamoto , Yutaka Nishimura , Yasuo Fukui
IPC分类号： B41J17/40 , B41J31/14 , B41M5/26 , B41M5/382 , B44C1/00
CPC分类号： B41M5/38207 , B41J17/40 , B41J31/14 , Y10T156/1153
摘要： Coating of heat-soluble material on a substrate or cleaning is performed by supplying a heat-soluble material in heated and melted condition onto a substrate, laying a sheet member on the heat-soluble material, cooling the heat-soluble material to solidify, and peeling off the sheet member.

8. 发明授权

US4203082A Surface acoustic wave filter 失效
标题翻译：表面声波滤波器
公开(公告)号：US4203082A
公开(公告)日：1980-05-13
申请号：US911082
申请日：1978-05-31
申请人： Masahide Tsukamoto , Masahiro Nagasawa , Hiroshi Yamazoe
发明人： Masahide Tsukamoto , Masahiro Nagasawa , Hiroshi Yamazoe
IPC分类号： H03H3/08 , H03H9/00 , H03H9/145 , H03H9/64 , H03H9/04 , H01L41/10 , H03H9/26 , H03H9/32
CPC分类号： H03H9/1455 , H03H9/0038 , H03H9/1452 , H03H9/14547 , H03H9/14558 , H03H9/14564 , H03H9/14567 , H03H9/14594 , H03H9/6433 , H03H9/14552
摘要： To obtain low insertion loss and low TTE level, a first central transducer, a second transducer and a third transducer are disposed on one surface of a piezoelectric substrate in such a manner that the second and the third transducers are in the direction of propagation (X-direction) of surface acoustic waves launched by the first transducer and the distance between center lines of the first and the second transducers and also the distance between the center lines of the first and the third transducers vary along the Y-direction perpendicular to the X-direction.
摘要翻译：为了获得低插入损耗和低TTE电平，第一中心换能器，第二换能器和第三换能器以这样的方式设置在压电基板的一个表面上，使得第二和第三换能器处于传播方向（X 由第一换能器发射的表面声波和第一和第二换能器的中心线之间的距离以及第一和第三换能器的中心线之间的距离沿垂直于X的Y方向变化 -方向。

9. 发明授权

US06197407B1 Circuit board and method of manufacturing the same 有权
标题翻译：电路板及其制造方法
公开(公告)号：US06197407B1
公开(公告)日：2001-03-06
申请号：US09304714
申请日：1999-05-04
申请人： Daizou Andou , Toshio Sugawa , Tadashi Nakamura , Hideki Higashitani , Masahide Tsukamoto
发明人： Daizou Andou , Toshio Sugawa , Tadashi Nakamura , Hideki Higashitani , Masahide Tsukamoto
IPC分类号： B32B300
CPC分类号： H05K3/20 , H05K3/007 , H05K3/205 , H05K3/386 , H05K3/4069 , H05K3/4614 , H05K3/4617 , H05K3/4623 , H05K3/4658 , H05K3/4688 , H05K2201/0116 , H05K2201/0195 , H05K2201/10378 , H05K2203/0152 , H05K2203/0384 , H05K2203/061 , H05K2203/1461 , Y10S428/901 , Y10T29/49126 , Y10T29/49155 , Y10T29/49165 , Y10T428/24917 , Y10T428/2804
摘要： Through holes formed in an electrical insulating substrate having adhesive layers on its both surfaces are filled with a conductor. Then, supporting bases having wiring layers with a predetermined pattern are laminated on both the surfaces of the electrical insulating substrate, which are then heated and pressurized. After that, the supporting bases are removed, thus obtaining a circuit board in which the wiring layers have been embedded in the adhesive layers. The conductor within the through holes are compressed sufficiently, thus forming minute via holes with high reliability.
摘要翻译：形成在其两面具有粘合层的电绝缘基板中的通孔填充有导体。然后，将具有预定图案的布线层的支撑基板层压在电绝缘基板的两个表面上，然后被加热和加压。之后，除去支撑基底，从而获得其中布线层已经嵌入粘合剂层中的电路板。通孔内的导体被充分压缩，从而形成具有高可靠性的微通孔。

10. 发明授权

US5635006A Pattern forming method and ink compostion 失效
标题翻译：图案形成方法和油墨组合
公开(公告)号：US5635006A
公开(公告)日：1997-06-03
申请号：US540622
申请日：1990-06-19
申请人： Hirotoshi Watanabe , Yutaka Nishimura , Koji Matsuo , Noboru Aikawa , Masahide Tsukamoto
发明人： Hirotoshi Watanabe , Yutaka Nishimura , Koji Matsuo , Noboru Aikawa , Masahide Tsukamoto
IPC分类号： B41M1/10 , G02F1/1335 , H01J9/227 , H01J29/32 , B05D5/00
CPC分类号： H01J29/327 , B41M1/10 , G02F1/133516 , H01J9/2277 , H01J9/2278
摘要： The fine-line pattern forming method is to form a pattern by transferring the pattern formed on the blanket of which surface is covered with an elastic material mainly composed of silicone resin, on a substrate on which a tack layer is formed. As an example thereof, the forming method of cathode-ray tube anode comprises a step of filling the groove of an intaglio with a graphite ink, a step of transferring the graphite ink in the groove of the intaglio on a blanket of which surface is covered with an elastic material mainly composed of silicone resin, a step of forming a tack layer on a substrate, a step of transferring and printing the pattern transferred on the blanket onto the substrate, a step of filling the groove of the intaglio with a phosphor ink, a step of transferring the ink in the groove of the intaglio on the blanket of which surface is covered with an elastic material mainly composed of silicone resin, a step of forming a tack layer on the substrate, a step of transferring and printing the pattern transferred on the blanket on the substrate on which the graphite pattern has been formed, a step of transferring an aluminum thin film possessing multiple pores as a metal-backed layer so as to cover a black matrix and a phosphor layer, and a step of firing the substrate covered with the aluminum thin film. The graphite ink comprises graphite powder, vehicle containing depolymerization type organic binder, and organic acid metal salt. The phosphor ink comprises phosphor powder and vehicle containing polymerization type organic binder.
摘要翻译：细线图案形成方法是在形成有粘性层的基板上，通过将主要由硅树脂构成的弹性材料覆盖在其表面的毯子上的图案转印而形成图案。作为其示例，阴极射线管阳极的形成方法包括用石墨墨水填充凹版的凹槽的步骤，将石墨墨在凹版的凹槽中的表面覆盖的毯子上的步骤主要由硅树脂构成的弹性材料，在基材上形成粘性层的步骤，将在橡皮布上转印的图案转印印刷到基材上的步骤，用荧光体墨水填充凹版的凹槽的步骤将主要由硅树脂构成的弹性材料覆盖在表面的毯子上的凹版凹槽中的墨水转印到基板上形成粘着层的工序，转印印刷图案的步骤转印在已经形成有石墨图案的基板上的橡皮布上，转印具有多个孔的铝薄膜作为金属背衬层以覆盖黑矩阵a 和荧光体层，以及烧制被铝薄膜覆盖的基板的步骤。石墨油墨包括石墨粉，含有解聚型有机粘合剂的载体和有机酸金属盐。荧光体油墨包含荧光体粉末和含有聚合型有机粘合剂的载体。

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