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    • 4. 发明授权
    • CMOS-compatible bipolar transistor with reduced collector/substrate
capacitance and process for producing the same
    • 具有降低的集电极/衬底电容的CMOS兼容双极晶体管及其制造方法
    • US5177582A
    • 1993-01-05
    • US754377
    • 1991-08-30
    • Thomas MeisterHans-Willi MeulHelmut KloseHermann Wendt
    • Thomas MeisterHans-Willi MeulHelmut KloseHermann Wendt
    • H01L21/8249H01L27/06H01L29/08H01L29/732
    • H01L29/0826H01L21/8249H01L27/0623H01L29/732
    • A bipolar transistor with a collector, a base and an emitter disposed in vertical succession includes a semiconductor substrate, insulating oxide zones disposed in the substrate for separating adjacent transistors, and a buried collector terminal layer at least partly disposed on the insulating oxide zones. An insulator structure laterally surrounding a collector. A subcollector is surrounded by the insulating oxide zones, has the same conductivity type with a lower impedance than the collector, is disposed under the collector and under the insulator structure, and is electrically connected to the collector. The insulator structure covers the buried collector terminal layer, laterally insulates the collector from the buried collector terminal layer, and has lateral surfaces extending inside the insulating oxide regions up to the subcollector. The buried collector terminal layer is in direct contact with the subcollector. The collector is electrically connected to the buried collector terminal layer only through the subcollector. The insulator structure has a contact hole extending to the buried collector terminal layer laterally of the active transistor zone, and a metallization filling the contact hole. A process for producing the bipolar transistor includes producing an insulator structure on a substrate for determining a location for a collector; and producing the collector by selective epitaxy only inside the insulator structure, for laterally insulating the collector with the insulator structure. An integrated circuit and method include such bipolar transistors and CMOS transistors.
    • 具有垂直相继布置的集电极,基极和发射极的双极晶体管包括半导体衬底,设置在衬底中用于分离相邻晶体管的绝缘氧化物区域和至少部分地设置在绝缘氧化物区域上的埋地集电极端子层。 横向围绕收集器的绝缘体结构。 子集电极被绝缘氧化物区围绕,具有与集电体相比具有较低阻抗的相同的导电类型,设置在集电器下方和绝缘体结构下方,并且与集电极电连接。 绝缘体结构覆盖埋地集电极端子层,使集电体与埋地集电极端子层横向绝缘,并且具有在绝缘氧化物区域内延伸直到子集电极的侧表面。 埋地集电极端子层与子集电极直接接触。 集电极仅通过子集电极电连接到埋地集电极端子层。 绝缘体结构具有在有源晶体管区域侧向延伸到集电极端子层的接触孔,以及填充接触孔的金属化。 制造双极晶体管的方法包括:在基板上制造用于确定集电体位置的绝缘体结构; 并且仅通过绝缘体结构内的选择性外延生产集电体,用于使绝缘体结构的集电体横向绝缘。 集成电路和方法包括这样的双极晶体管和CMOS晶体管。