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    • 1. 发明授权
    • Laser module carrier for printed circuit boards
    • 用于印刷电路板的激光模块载体
    • US07115821B1
    • 2006-10-03
    • US10681871
    • 2003-10-08
    • Mark SondereggerBalwantrai Mistry
    • Mark SondereggerBalwantrai Mistry
    • H01R13/46H05K5/00
    • G02B6/4201G02B6/4269G02B6/4271G02B6/428G02B6/4478
    • A carrier for alignment and attachment of an electronics module to a circuit board is described. The carrier includes a frame having sides defining a region to receive the electronics module. A gap between two of the sides allows for passage of leads that extend from the electronics module. The frame includes an alignment guide to align the electronics module to the carrier, an alignment guide to align the frame to the circuit board and a capture device to attach the electronics module to the frame. The carrier also includes a fiber guide or wire guide extending from one of the sides of the frame to secure an optical fiber or wire, respectively, extending from the electronics module. At least one of the sides of the frame has an opening to receive a fastener for attaching the carrier to the circuit board.
    • 描述了用于将电子模块对准和附接到电路板的载体。 载体包括具有限定用于接收电子模块的区域的侧面的框架。 两个侧面之间的间隙允许从电子模块延伸的引线通过。 框架包括对准引导件,以将电子模块对准载体,对准引导件将框架对准电路板,以及捕获装置将电子模块附接到框架。 载体还包括从框架的一个侧面延伸的纤维引导件或导线引导件,以分别从电子模块延伸的光纤或电线。 框架的至少一个侧面具有用于接收用于将托架附接到电路板的紧固件的开口。
    • 2. 发明授权
    • System for dissipating heat and shielding electromagnetic radiation produced by an electronic device
    • 用于散热和屏蔽由电子设备产生的电磁辐射的系统
    • US06982481B1
    • 2006-01-03
    • US10681875
    • 2003-10-08
    • Mark SondereggerBalwantrai Mistry
    • Mark SondereggerBalwantrai Mistry
    • H01L23/34
    • H01L23/4006H01L2023/405H01L2023/4062H01L2924/0002H01L2924/00
    • Described is an apparatus for dissipating heat and shielding electromagnetic radiation from at least one electronic device on a printed circuit board. The apparatus includes a printed circuit board with a surface, at least one integrated circuit on the surface, and an electrically conductive region surrounding the at least one integrated circuit. The apparatus also includes an electrically conductive cover portion. The electrically conductive cover portion has a top surface and a bottom edge, and defines a cavity. The top surface has at least one heat-dissipating structure that extends from it. The bottom edge is in electrically conductive contact with the electrically conductive region of the printed circuit board. The cavity encloses the at least one integrated circuit on the surface of the printed circuit board to shield electromagnetic radiation. The at least one integrated circuit is in thermally conductive communication with the electrically conductive cover portion. Heat generated by the at least one integrated circuit is transferred to the electrically conductive cover portion from which the heat is dissipated by the at least one heat-dissipating structure.
    • 描述了一种用于散热并屏蔽来自印刷电路板上的至少一个电子设备的电磁辐射的装置。 该装置包括具有表面的印刷电路板,表面上的至少一个集成电路和围绕至少一个集成电路的导电区域。 该装置还包括导电盖部分。 导电盖部分具有顶表面和底部边缘,并且限定空腔。 顶表面具有从其延伸的至少一个散热结构。 底边缘与印刷电路板的导电区域导电接触。 空腔将印刷电路板表面上的至少一个集成电路封闭以屏蔽电磁辐射。 所述至少一个集成电路与导电盖部分导热连通。 由至少一个集成电路产生的热量传递到导电盖部分,热量由该至少一个散热结构消散。
    • 5. 发明授权
    • Apparatus for multi-dimensional fiber management
    • 多维光纤管理设备
    • US06873779B1
    • 2005-03-29
    • US10681867
    • 2003-10-08
    • Mark SondereggerBalwantrai Mistry
    • Mark SondereggerBalwantrai Mistry
    • G02B6/00G02B6/44
    • G02B6/4478G02B6/4459
    • Described is a fiber optic cable clip for managing fiber optic cables connected to a faceplate of an optical module by bulkhead adapters or small form-factor pluggable fiber optic transceiver modules. The fiber optic cable clip includes a clip body having a front side, an upper end, and a lower end. The clip body has a curved shape that bends vertically and laterally from the upper end to the lower end. The front side of the clip body has a groove extending therethrough. The groove is shaped for receiving and bending the fiber optic cable vertically and laterally from the upper end to the lower end in accordance with the curved shape of the clip body. Coupler means on the clip body couple the fiber optic cable within the groove of the clip body.
    • 描述了一种用于管理通过隔板适配器或小型可插拔光纤收发器模块连接到光学模块的面板的光纤电缆的光纤电缆夹。 光缆夹具包括具有前侧,上端和下端的夹体。 夹体具有从上端向下端垂直和横向弯曲的弯曲形状。 夹体的前侧具有延伸穿过其的凹槽。 凹槽被成形为根据夹子主体的弯曲形状从上端向下端垂直和横向地接收和弯曲光纤电缆。 夹子主体上的耦合器装置将光纤电缆连接在夹子主体的凹槽内。
    • 9. 发明授权
    • VME bus compatible backplane and shelf arrangement
    • VME总线兼容背板和机柜布置
    • US5488541A
    • 1996-01-30
    • US251994
    • 1994-06-01
    • Balwantrai MistryRaymond B. Wallace
    • Balwantrai MistryRaymond B. Wallace
    • G06F13/40H01R12/73H05K7/14H01R23/68
    • G06F13/409H01R23/68H05K7/1445
    • A VME Bus Compatible backplane and shelf arrangement is provided which incorporates a connectorized backplane arrangement which provides for direct mating to both industry standard VME bus cards as well as VME transition cards. A backplane is provided that is double-sided. On a first face, access to two VME busses (P1 & P2) is provided via rows of first and second connectors. The connector of each row are evenly spaced along the bus and the connectors of one row are vertically aligned with the connectors of the second row. On the second face a third row of connectors is provided, directly behind the second row with each connector offset with respect to a corresponding second connector. The first and second rows of connectors accept standard VME bus cards. The third connectors accept directly, industry standard transition cards. Some of the conductors in the second connectors are connected to the second bus, while others are connected directly to conductors in the third connectors.
    • 提供了一个VME总线兼容的背板和机柜布置,其中包含一个连接的背板布置,可以直接匹配工业标准VME总线卡和VME转换卡。 提供双面的背板。 在第一面上,通过第一和第二连接器行提供对两个VME总线(P1和P2)的访问。 每排的连接器沿总线均匀间隔,一排的连接器与第二排的连接器垂直对齐。 在第二面上设有第三排连接器,其直接位于第二排后面,每个连接器相对于相应的第二连接器偏移。 第一和第二排连接器接受标准VME总线卡。 第三个连接器直接接受工业标准的过渡卡。 第二连接器中的一些导体连接到第二总线,而其它导体直接连接到第三连接器中的导体。