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1. 发明授权

US4377316A High density interconnection means for chip carriers 失效
标题翻译：用于芯片载体的高密度互连装置
公开(公告)号：US4377316A
公开(公告)日：1983-03-22
申请号：US238873
申请日：1981-02-27
申请人： Mario E. Ecker , Leonard T. Olson
发明人： Mario E. Ecker , Leonard T. Olson
IPC分类号： H01L23/32 , H01L21/48 , H01L23/12 , H01L23/498 , H01L23/52 , H01L23/538 , H05K1/02 , H05K1/11 , H05K1/14 , H05K3/30 , H05K3/34 , H05K3/36 , H05K1/18
CPC分类号： H05K3/303 , H01L21/486 , H01L23/4985 , H01L23/5384 , H05K3/363 , H01L2224/16 , H01L2224/16225 , H01L2924/01019 , H01L2924/01057 , H01L2924/01078 , H01L2924/01322 , H01L2924/16152 , H05K1/0206 , H05K1/113 , H05K1/141 , H05K2201/09472 , H05K2201/09509 , H05K2201/09572 , H05K2201/10659 , H05K2201/10666 , H05K2201/10681 , H05K2201/10727 , H05K2201/10878 , H05K2201/2036 , H05K2203/043 , H05K3/308 , H05K3/3447 , H05K3/3452 , H05K3/3457 , Y02P70/613
摘要： A system for connecting a semiconductor chip carrier to a printed circuit card is described. The semiconductor chip carrier has a flexible, extendable wiring membrane attached to the bottom thereof which extends beyond the periphery of the semiconductor chip carrier and in the area beyond the periphery is provided with electrical contacts. The electrical contacts are mated to complementary contacts in a printed circuit card which is biased from the semiconductor chip carrier by electrical and thermal contact means. The membrane, inter alia, provides high density electrical contact between the semiconductor and printed circuit card. Various elements thereof and a process for forming the same are described.
摘要翻译：描述了用于将半导体芯片载体连接到印刷电路卡的系统。半导体芯片载体具有附接到其底部的柔性的可延伸的布线膜，其延伸超出半导体芯片载体的周边，并且在超过外围的区域中设置有电触点。电触点与印刷电路卡中的互补触点配合，印刷电路卡通过电接触和热接触装置从半导体芯片载体偏置。该膜尤其在半导体和印刷电路卡之间提供了高密度的电接触。对其各种要素及其形成方法进行说明。

2. 发明授权

US4251852A Integrated circuit package 失效
标题翻译：集成电路封装
公开(公告)号：US4251852A
公开(公告)日：1981-02-17
申请号：US49824
申请日：1979-06-18
申请人： Mario E. Ecker , Leonard T. Olson
发明人： Mario E. Ecker , Leonard T. Olson
IPC分类号： H01L23/055 , H01L23/48 , H01L23/538 , H05K7/20
CPC分类号： H01L23/5383 , H01L23/055 , H01L24/72 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01023 , H01L2924/01029 , H01L2924/01049 , H01L2924/01057 , H01L2924/01082 , H01L2924/14 , H01L2924/15312 , H01L2924/16152 , H01L2924/19041 , H01L2924/19043
摘要： Disclosed is a packaging structure wherein one or more integrated circuit semiconductor chips are mounted on membrane-like insulating members. The membrane-like members provide multilevel wiring and interconnection between the chip or chips and a secondary wiring structure. The packaging structure includes a module protective cap (preferably metal) and resilient means supported by said secondary wiring structure. The resilient means physically biases the semiconductor chip or chips against the module protective cap and also accommodate induced chip motion and variation. The packaging structure provides enhanced thermal, mechanical and electrical characteristics.
摘要翻译：公开了一种封装结构，其中一个或多个集成电路半导体芯片安装在膜状绝缘构件上。膜状构件提供芯片或芯片之间的多层布线和互连以及次级布线结构。包装结构包括模块保护盖（优选为金属）和由所述次级布线结构支撑的弹性装置。弹性装置将半导体芯片或芯片物理地偏置抵靠模块保护盖，并且还适应感应的芯片运动和变化。包装结构提供增强的热，机械和电气特性。

3. 发明授权

US4549200A Repairable multi-level overlay system for semiconductor device 失效
标题翻译：半导体器件可修复多层覆盖系统
公开(公告)号：US4549200A
公开(公告)日：1985-10-22
申请号：US396204
申请日：1982-07-08
申请人： Mario E. Ecker , Leonard T. Olson
发明人： Mario E. Ecker , Leonard T. Olson
IPC分类号： H01L23/52 , H01L23/40 , H01L23/538 , H01L25/00 , H01L27/12
CPC分类号： H01L23/5385 , H01L23/4006 , H01L23/5382 , H01L2023/405 , H01L2023/4062 , H01L2023/4081 , H01L2224/16 , H01L2924/01014 , H01L2924/01019 , H01L2924/01057 , H01L2924/01077 , H01L2924/10253 , H01L2924/16152
摘要： A multi-level integrated circuit packaging system having a primary support frame, an array of secondary support frames mounted in said primary support frame and an array of single chip carriers associated with each secondary support frame. An integrated circuit is encapsulated in each single chip carrier, which may be a variety of carrier types which has an insulated wiring pattern with EC wells and delete lands. The secondary and primary support frames also have EC pads so that a change capability exists to any electrical signal path terminating on the chip.
摘要翻译：一种多级集成电路封装系统，其具有主支撑框架，安装在所述主支撑框架中的辅助支撑框架阵列和与每个辅助支撑框架相关联的单个芯片载体的阵列。集成电路封装在每个单芯片载体中，其可以是各种载体类型，其具有与EC阱和删除焊盘的绝缘布线图案。辅助和主要支撑框架还具有EC垫，使得在芯片上终止的任何电信号路径存在变化能力。

4. 发明授权

US4785135A De-coupled printed circuits 失效
标题翻译：去耦合印刷电路
公开(公告)号：US4785135A
公开(公告)日：1988-11-15
申请号：US72833
申请日：1987-07-13
申请人： Mario E. Ecker , Leonard T. Olson
发明人： Mario E. Ecker , Leonard T. Olson
IPC分类号： H05K1/02 , H05K1/00 , H05K3/00
CPC分类号： H05K1/0228 , H01R13/6461 , H01R13/6474 , H05K1/0245 , H05K2201/09236 , H05K2201/09263 , H05K2201/097 , Y10T29/49124
摘要： Arrangement for reducing cross talk between electrical circuit conductors wherein the conductors lie within individual parallel channels within the same plane or different parallel planes within the induced voltage or cross talk region of an energized and a quiet conductor and either converge or diverge with respect to each other. The amount of relative convergence or divergence, preferably mor than six degrees and less than 15 degrees, is that required to attenuate the magnitude of any signal induced by the activated conductor in a neighboring or quiet conductor to maintain an acceptable and desired signal-to-noise ratio.

5. 发明授权

US5173668A Apparatus and a method for an electrical transmission-line interface 失效
标题翻译：装置和电气传输线接口的方法
公开(公告)号：US5173668A
公开(公告)日：1992-12-22
申请号：US693971
申请日：1991-04-29
申请人： Lawrence Jacobowitz , Mario E. Ecker
发明人： Lawrence Jacobowitz , Mario E. Ecker
IPC分类号： G06F1/18 , H01P1/04
CPC分类号： H01P1/04
摘要： The present invention relates generally to a new interface and a method for making the same, and more particularly, to an electrical transmission-line interface and a method for making the same. On a substrate having semiconductors, a driver or receiver circuit is provided to interface with an electrical transmission-line. Integral means for the electrical transmission-line alignment, support and transit through a sealed environment is also provided. A fluid tight seal can also be provided for the various components that are in the interior of the housing. Variable time-delay means is provided for a computer clock system or other microwave applications.

6. 发明授权

US5337388A Matrix of pluggable connectors for connecting large numbers of clustered electrical and/or opticcal cables to a module 失效
标题翻译：用于将大量集群电和/或光缆连接到模块的可插拔连接器矩阵
公开(公告)号：US5337388A
公开(公告)日：1994-08-09
申请号：US101118
申请日：1993-08-03
申请人： Lawrence Jacobowitz , Mario E. Ecker , Casimer M. DeCusatis
发明人： Lawrence Jacobowitz , Mario E. Ecker , Casimer M. DeCusatis
IPC分类号： G02B6/38 , G02B6/42 , G02B6/36
CPC分类号： G02B6/4249 , G02B6/3807 , G02B6/3817 , G02B6/3839 , G02B6/3897 , G02B6/4261 , G02B6/4274 , G02B6/4284 , G02B6/4293 , G02B6/3893
摘要： A matrix of cluster connectors for switching and interconnecting large numbers of optical fiber and/or electrical conductors (such as coaxial lines) to a module used in computers, communications and related applications. The matrix of pluggable cluster connector receptacles is located on a major surface of a module, such as a ceramic multi-chip module or a thin film silicon chip carrier module. A semiconductor wafer is fabricated with a matrix of angled slots fabricated to form the matrix of receptacles. The wafer is a major surface of the module, and may have another opening for chips fastened to the module surface below the wafer. Each angled slot engages an end of a plug member to align any optical fiber ends contained in the cluster held by the plug with a corresponding lens/light signal transducer in the module. Instead, a light transducer may be contained in the plug to provide electrical signals to a contact of the plug mating with a contact deposited on the wall of the engaged slot, which also engage contacts connected to coaxial lines in the cluster.
摘要翻译：用于将大量光纤和/或电导体（例如同轴线）切换和互连到用于计算机，通信和相关应用中的模块的群集连接器矩阵。可插拔群集连接器插座的矩阵位于模块的主表面上，例如陶瓷多芯片模块或薄膜硅芯片载体模块。制造半导体晶片，其具有被形成为形成容器基体的倾斜槽的矩阵。晶片是模块的主表面，并且可以具有用于紧固到晶片下方的模块表面的芯片的另一个开口。每个成角度的狭槽与插头构件的端部接合，以将包含在由插头保持的群集中的任何光纤端与模块中的对应的透镜/光信号传感器对准。相反，光插头中可以包含一个光转换器，以将电信号提供给与插入在接合槽的壁上的触点相配合的插头的触点，该接触件也接合连接到群集中的同轴线的触点。

7. 发明授权

US5241614A Apparatus and a method for an optical fiber interface 失效
标题翻译：光纤接口的装置和方法
公开(公告)号：US5241614A
公开(公告)日：1993-08-31
申请号：US893173
申请日：1992-06-03
申请人： Mario E. Ecker , Lawrence Jacobowitz
发明人： Mario E. Ecker , Lawrence Jacobowitz
IPC分类号： G02B6/42
CPC分类号： G02B6/4248 , G02B6/4202 , G02B6/4257 , G02B6/4274 , G02B6/424 , G02B6/4271
摘要： The present invention relates generally to a new interface and a method for making the same, and more particularly, to an optical fiber interface and a method for making the same. On a substrate having semiconductors, a receiver/transmitter connection is provided to interface with an optical fiber. Integral means for the fiber alignment, support and transit through a sealed environment is also provided. The substrate having the receiver/transmitter secured to it with the optical fiber end, is then enclosed in a housing.
摘要翻译：本发明一般涉及一种新的接口及其制造方法，更具体地说，涉及一种光纤接口及其制造方法。在具有半导体的衬底上，提供接收器/发射器连接以与光纤接口。还提供了用于光纤对准，支撑和通过密封环境的整体装置。具有用光纤端固定到其上的接收器/发送器的基板然后封闭在外壳中。

8. 发明授权

US5396573A Pluggable connectors for connecting large numbers of electrical and/or optical cables to a module through a seal 失效
标题翻译：可插拔连接器，用于通过密封将大量电气和/或光缆连接到模块
公开(公告)号：US5396573A
公开(公告)日：1995-03-07
申请号：US101120
申请日：1993-08-03
申请人： Mario E. Ecker , Lawrence Jacobowitz , Casimer M. DeCusatis
发明人： Mario E. Ecker , Lawrence Jacobowitz , Casimer M. DeCusatis
IPC分类号： G02B6/38 , G02B6/42 , G02B6/36
CPC分类号： G02B6/421 , G02B6/3817 , G02B6/4249 , G02B6/4292 , G02B6/4232
摘要： Enables a large number of pluggable-array connectors to be used with a multi-chip module (MCM) by using a connector technique that does not require a significant amount of available surface area on a module. The array connectors provide a large increase in the input/output (I/O) capacity of a module. Each of the connectors has a receptacle supported by a frame around the module, and short flexible transmission lines connect the receptacle to the module. A plug connects a cluster (array) of external transmission lines, which may be optical and/or electrical transmission lines operating in parallel. Optical transmission lines may have optical/electrical transducers mounted on either the frame or module. Frame mounting of optical transducers with a connector receptacle enables a connector to transfer only electrical signals between the connector and the module, regardless of a mix of optical and electrical transmission lines to the same connector plug.
摘要翻译：通过使用不需要模块上大量可用表面积的连接器技术，可以使用多个可插拔阵列连接器与多芯片模块（MCM）一起使用。阵列连接器大大增加了模块的输入/输出（I / O）容量。每个连接器具有由围绕模块的框架支撑的插座，并且短的柔性传输线将插座连接到模块。插头连接外部传输线的簇（阵列），其可以是并行操作的光和/或电传输线。光传输线可以具有安装在框架或模块上的光/电换能器。具有连接器插座的光学传感器的框架安装使得连接器只能在连接器和模块之间传输电信号，而不管光纤和电气传输线与同一个连接器插头的混合。

9. 发明授权

US5541005A Large ceramic article and method of manufacturing 失效
标题翻译：大型陶瓷制品及其制造方法
公开(公告)号：US5541005A
公开(公告)日：1996-07-30
申请号：US438825
申请日：1995-05-11
申请人： Raschid J. Bezama , Jon A. Casey , Mario E. Ecker , Shaji Farooq , Irene S. Frantz , Katherine G. Frase , David H. Gabriels , Lester W. Herron , John U. Knickerbocker , Sarah H. Knickerbocker , Govindarajan Natarajan , John Thomson , Yee-Ming Ting , Sharon L. Tracy , Robert M. Troncillito , Vivek M. Sura , Donald R. Wall , Giai V. Yen
发明人： Raschid J. Bezama , Jon A. Casey , Mario E. Ecker , Shaji Farooq , Irene S. Frantz , Katherine G. Frase , David H. Gabriels , Lester W. Herron , John U. Knickerbocker , Sarah H. Knickerbocker , Govindarajan Natarajan , John Thomson , Yee-Ming Ting , Sharon L. Tracy , Robert M. Troncillito , Vivek M. Sura , Donald R. Wall , Giai V. Yen
IPC分类号： B28B11/02 , H01L21/48 , H01L21/768 , H01L23/15 , H01L23/522 , H05K1/03 , H05K1/14 , H05K3/46 , B22F3/105
CPC分类号： H05K1/142 , H01L21/4807 , H01L23/15 , H05K3/46 , H05K3/4629 , H01L2924/0002 , H01L2924/09701 , H05K1/0306 , H05K2201/09972 , Y10T428/12049 , Y10T428/12146 , Y10T428/16 , Y10T428/163 , Y10T428/166 , Y10T428/192
摘要： A large ceramic substrate article for electronic applications including at least one layer of sintered ceramic material, the layer including a plurality of greensheet segments of ceramic material joined edge to edge. Also disclosed is a method of fabricating a large ceramic greensheet article as well as a large ceramic substrate article.
摘要翻译：一种用于电子应用的大型陶瓷衬底制品，包括至少一层烧结陶瓷材料，该层包括多个边缘到边缘连接的陶瓷材料毛坯块。还公开了一种制造大型陶瓷毛坯制品的方法以及大型陶瓷基片制品。

10. 发明授权

US5333225A Substrate-embedded pluggable receptacles for connecting clustered optical cables to a module 失效
标题翻译：用于将集群光缆连接到模块的基板嵌入式可插拔插座
公开(公告)号：US5333225A
公开(公告)日：1994-07-26
申请号：US101119
申请日：1993-08-03
申请人： Lawrence Jacobowitz , Mario E. Ecker , Casimer M. DeCusatis
发明人： Lawrence Jacobowitz , Mario E. Ecker , Casimer M. DeCusatis
IPC分类号： G02B6/38 , G02B6/42 , G02B6/00 , G02B6/36
CPC分类号： G02B6/4292 , G02B6/423 , G02B6/4249 , G02B6/3839 , G02B6/421 , G02B6/4214 , G02B6/4232
摘要： Obtains a large increase in the number of fiber optic inputs/output (I/O) lines connectable to a module by enabling edge connection of multiple clusters of optical fibers to be connected around a module. Each connector connects a cluster of optical fibers in a small dimension of space on the module. Many distinct pluggable connectors may be provided along one or more edges of a module. The optical-fiber cluster connectors are embedded in indentations around the edges of a multilayer glass/ceramic (MLGC) multi-chip module (MCM), which may be a thermal conduction module (TCM), containing an integrated photonic receiver and/or transmitter for each fiber. Each connector supports a large number of fibers from a single cable, and a large number of connectors may be provided in a single module. Easy plugging and unplugging is obtained for each connector without interferring with any existing cooling apparatus or I/O pins of the module. Receptacle and plug assemblies which hold the fibers in respective key V-grooves etched in silicon members which carry and interlock each fiber in each receptacle. Alignment and locking means is provided in each connector for aligning a plug's array of fibers with corresponding receptacle fibers in one or more angled groove(s) in a receiving receptacle. Thermal coefficients of expansion match between the silicon receptacle and the glass-ceramic substrate to guarantee the preservation of opto-mechanical alignments.
摘要翻译：通过使多个光纤集群的边缘连接能够连接到模块上，可以大幅度增加可连接到模块的光纤输入/输出（I / O）线路数量。每个连接器在模块的一小部分空间中连接一束光纤。可以沿着模块的一个或多个边缘设置许多不同的可插拔连接器。光纤簇连接器嵌入在多层玻璃/陶瓷（MLGC）多芯片模块（MCM）的边缘周围的凹陷中，多层玻璃/陶瓷（MLGC）多芯片模块（MCM）可以是导热模块（TCM），其包含集成的光子接收器和/或发射器对于每根纤维每个连接器支持来自单个电缆的大量光纤，并且可以在单个模块中提供大量连接器。每个连接器都可以轻松插拔插头，而不会干扰任何现有的冷却设备或模块的I / O引脚。插座和插头组件，其将纤维保持在硅构件中蚀刻的相应的键V形槽中，所述硅构件在每个容座中承载和互锁每个纤维。对准和锁定装置设置在每个连接器中，用于将插头的光纤阵列与在接收容座中的一个或多个成角度的凹槽中的对应插座光纤对准。硅插座和玻璃陶瓷基板之间的热膨胀系数匹配，以保证光机械对准的保存。

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