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    • 1. 发明授权
    • Large tuning range junction varactor
    • 大调谐范围结变容二极管
    • US08450832B2
    • 2013-05-28
    • US11696732
    • 2007-04-05
    • Manju SarkarPurakh Raj Verma
    • Manju SarkarPurakh Raj Verma
    • H01L29/93
    • H01L27/0808H01L29/93
    • Large tuning range junction varactor includes first and second junction capacitors coupled in parallel between first and second varactor terminals. First and second plates of the capacitors are formed by three alternating doped regions in a substrate. The first and third doped regions are of the same type sandwiching the second doped region of the second type. A first input terminal is coupled to the first and third doped regions and a second terminal is coupled to the second doped region. At the interfaces of the doped regions are first and second depletion regions whose width can be varied by varying the voltage across the terminals from zero to full reverse bias.
    • 大型调谐范围结变容二极管包括并联在第一和第二变容二极管端子之间的第一和第二结电容器。 电容器的第一和第二板由衬底中的三个交替掺杂区域形成。 第一和第三掺杂区域具有夹着第二类型的第二掺杂区域的相同类型。 第一输入端子耦合到第一和第三掺杂区域,第二端子耦合到第二掺杂区域。 在掺杂区域的界面处是第一和第二耗尽区域,其宽度可以通过将端子间的电压从零改变为全反向偏压来改变。
    • 3. 发明授权
    • MOS varactors with large tuning range
    • 具有较大调谐范围的MOS变容二极管
    • US07994563B2
    • 2011-08-09
    • US12616150
    • 2009-11-11
    • Manju SarkarPurakh Raj Verma
    • Manju SarkarPurakh Raj Verma
    • H01L27/108H01L29/93
    • H01L29/93H01L29/66189H01L29/94
    • A device is presented. The device includes a substrate with a first well of a first polarity type. The first well defines a varactor region and comprises a lower first well boundary located above a bottom surface of the substrate. A second well in the varactor region is also included in the device. The second well comprises a buried well of a second polarity type having an upper second well boundary disposed below an upper portion of the first well from an upper first well boundary to the upper second well boundary and a lower second well boundary disposed above the lower first well boundary, wherein an interface of the second well and the upper portion of the first well forms a shallow PN junction in the varactor region. The device also includes a gate structure in the varactor region. The upper portion of the first well beneath the gate structure forms a channel region of the device. In depletion mode, a depletion region under the gate structure in the channel region merges with a depletion region of the shallow PN junction.
    • 提供了一个设备。 该装置包括具有第一极性类型的第一阱的衬底。 第一阱限定变容二极管区域并且包括位于衬底的底表面上方的下第一阱边界。 变容二极管区域中的第二个井也包含在设备中。 第二井包括具有第二极性类型的埋井,其具有设置在第一井的上部下方的上第二井边界,从上第一井边界到上第二井边界,以及设置在下第一井边界的下第二井边界 其中第二阱的界面和第一阱的上部在变容二极管区域中形成浅PN结。 该装置还包括变容二极管区域中的栅极结构。 栅极结构下面的第一阱的上部形成器件的沟道区。 在耗尽模式中,沟道区域中的栅极结构之下的耗尽区域与浅PN结的耗尽区域合并。
    • 4. 发明授权
    • Method for forming a thin-film, electrically blowable fuse with a reproducible blowing wattage
    • 用可重现的吹制瓦数形成薄膜可电熔熔断器的方法
    • US06372652B1
    • 2002-04-16
    • US09494633
    • 2000-01-31
    • Purakh Raj VermaZia Alan ShafiYu ShanZeng ZhengManju SarkarShao-Fu Sanford Chu
    • Purakh Raj VermaZia Alan ShafiYu ShanZeng ZhengManju SarkarShao-Fu Sanford Chu
    • H01L21302
    • H01L23/5256H01L2924/0002H01L2924/00
    • A method for forming a thin film, electrically blowable fuse with reproducible blowing wattage using a sacrificial metal patch over a fuse dielectric layer and two etch processes; wherein the first etch process is selective to the metal patch and the second etch process is selective to the fuse dielectric layer. A fuse element, having an element width, is formed over a semiconductor structure, and a fuse dielectric layer is formed over the fuse element. A sacrificial metal patch is formed on the fuse dielectric layer; wherein the patch width being greater than the fuse element width. A second dielectric layer is formed on the sacrificial metal patch, and additional metal layers and dielectric layers may be formed over the second dielectric layer, but only the dielectric layers will remain over the fuse element. The second dielectric layer and any overlying dielectric layers are patterned to form a fuse window opening, having a width greater than the sacrificial metal patch, using a first fuse window etch selective to the sacrificial metal patch. Then, the sacrificial metal patch is etched through the fuse window opening using a second fuse window etch selective to the fuse dielectric layer, leaving a reproducible thickness of the fuse dielectric layer overlying the fuse element; thereby providing a reproducible blowing wattage.
    • 一种用于在熔丝电介质层和两个蚀刻工艺上使用牺牲金属贴片形成具有可再现的吹扫功率的薄膜电可熔电熔丝的方法; 其中所述第一蚀刻工艺对所述金属贴片是选择性的,并且所述第二蚀刻工艺对所述熔丝电介质层是选择性的。 在半导体结构上形成具有元件宽度的熔丝元件,并且在保险丝元件上形成熔丝电介质层。 在熔丝绝缘层上形成牺牲金属贴片; 其中所述贴片宽度大于所述熔丝元件宽度。 在牺牲金属贴片上形成第二电介质层,并且可以在第二电介质层上形成附加的金属层和电介质层,但是只有电介质层将保留在熔丝元件上方。 使用对牺牲金属贴片选择性的第一熔丝窗口蚀刻,将第二电介质层和任何上覆电介质层图案化以形成具有大于牺牲金属贴片的宽度的熔丝窗口。 然后,使用对熔丝电介质层选择性的第二熔丝窗蚀刻,通过熔丝窗口蚀刻牺牲金属贴片,留下覆于熔丝元件上的熔丝电介质层的可再现厚度; 从而提供可重复的吹制瓦数。
    • 6. 发明申请
    • LARGE TUNING RANGE JUNCTION VARACTOR
    • 大型调谐范围变送器
    • US20080246119A1
    • 2008-10-09
    • US11696732
    • 2007-04-05
    • Manju SARKARPurakh Raj Verma
    • Manju SARKARPurakh Raj Verma
    • H01L29/93H01L21/20
    • H01L27/0808H01L29/93
    • Large tuning range junction varactor includes first and second junction capacitors coupled in parallel between first and second varactor terminals. First and second plates of the capacitors are formed by three alternating doped regions in a substrate. The first and third doped regions are of the same type sandwiching the second doped region of the second type. A first input terminal is coupled to the first and third doped regions and a second terminal is coupled to the second doped region. At the interfaces of the doped regions are first and second depletion regions whose width can be varied by varying the voltage across the terminals from zero to full reverse bias.
    • 大型调谐范围结变容二极管包括并联在第一和第二变容二极管端子之间的第一和第二结电容器。 电容器的第一和第二板由衬底中的三个交替掺杂区域形成。 第一和第三掺杂区域具有夹着第二类型的第二掺杂区域的相同类型。 第一输入端子耦合到第一和第三掺杂区域,第二端子耦合到第二掺杂区域。 在掺杂区域的界面处是第一和第二耗尽区域,其宽度可以通过将端子间的电压从零改变为全反向偏压来改变。
    • 7. 发明授权
    • Integration of germanium photo detector in CMOS processing
    • 锗光电检测器在CMOS处理中的集成
    • US08802484B1
    • 2014-08-12
    • US13747009
    • 2013-01-22
    • Purakh Raj VermaGuowei ZhangKah Wee Ang
    • Purakh Raj VermaGuowei ZhangKah Wee Ang
    • H01L21/00H01L31/102
    • H01L21/02532H01L21/84H01L27/0617H01L27/1203H01L31/028
    • A method and device are provided for forming an integrated Ge or Ge/Si photo detector in the CMOS process by non-selective epitaxial growth of the Ge or Ge/Si. Embodiments include forming an N-well in a Si substrate; forming a transistor or resistor in the Si substrate; forming an ILD over the Si substrate and the transistor or resistor; forming a Si-based dielectric layer on the ILD; forming a poly-Si or a-Si layer on the Si-based dielectric layer; forming a trench in the poly-Si or a-Si layer, the Si-based dielectric layer, the ILD, and the N-well; forming Ge or Ge/Si in the trench; and removing the Ge or Ge/Si, the poly-Si or a-Si layer, and the Si-based dielectric layer down to an upper surface of the ILD. Further aspects include forming an in-situ doped Si cap epilayer or an ex-situ doped poly-Si or a-Si cap layer on the Ge or Ge/Si.
    • 提供了一种通过Ge或Ge / Si的非选择性外延生长在CMOS工艺中形成集成的Ge或Ge / Si光电检测器的方法和装置。 实施例包括在Si衬底中形成N阱; 在Si衬底中形成晶体管或电阻器; 在Si衬底和晶体管或电阻器上形成ILD; 在ILD上形成Si基电介质层; 在所述Si基电介质层上形成多晶硅或Si-Si层; 在多晶硅或a-Si层中形成沟槽,Si基介电层,ILD和N阱; 在沟槽中形成Ge或Ge / Si; 并且将Ge或Ge / Si,多晶硅或a-Si层以及Si基介电层除去到ILD的上表面。 另外的方面包括在Ge或Ge / Si上形成原位掺杂的Si帽外延层或非原位掺杂的多晶Si或者a-Si覆盖层。