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    • 6. 发明授权
    • Integration of germanium photo detector in CMOS processing
    • 锗光电检测器在CMOS处理中的集成
    • US08802484B1
    • 2014-08-12
    • US13747009
    • 2013-01-22
    • Purakh Raj VermaGuowei ZhangKah Wee Ang
    • Purakh Raj VermaGuowei ZhangKah Wee Ang
    • H01L21/00H01L31/102
    • H01L21/02532H01L21/84H01L27/0617H01L27/1203H01L31/028
    • A method and device are provided for forming an integrated Ge or Ge/Si photo detector in the CMOS process by non-selective epitaxial growth of the Ge or Ge/Si. Embodiments include forming an N-well in a Si substrate; forming a transistor or resistor in the Si substrate; forming an ILD over the Si substrate and the transistor or resistor; forming a Si-based dielectric layer on the ILD; forming a poly-Si or a-Si layer on the Si-based dielectric layer; forming a trench in the poly-Si or a-Si layer, the Si-based dielectric layer, the ILD, and the N-well; forming Ge or Ge/Si in the trench; and removing the Ge or Ge/Si, the poly-Si or a-Si layer, and the Si-based dielectric layer down to an upper surface of the ILD. Further aspects include forming an in-situ doped Si cap epilayer or an ex-situ doped poly-Si or a-Si cap layer on the Ge or Ge/Si.
    • 提供了一种通过Ge或Ge / Si的非选择性外延生长在CMOS工艺中形成集成的Ge或Ge / Si光电检测器的方法和装置。 实施例包括在Si衬底中形成N阱; 在Si衬底中形成晶体管或电阻器; 在Si衬底和晶体管或电阻器上形成ILD; 在ILD上形成Si基电介质层; 在所述Si基电介质层上形成多晶硅或Si-Si层; 在多晶硅或a-Si层中形成沟槽,Si基介电层,ILD和N阱; 在沟槽中形成Ge或Ge / Si; 并且将Ge或Ge / Si,多晶硅或a-Si层以及Si基介电层除去到ILD的上表面。 另外的方面包括在Ge或Ge / Si上形成原位掺杂的Si帽外延层或非原位掺杂的多晶Si或者a-Si覆盖层。
    • 8. 发明授权
    • Large tuning range junction varactor
    • 大调谐范围结变容二极管
    • US08450832B2
    • 2013-05-28
    • US11696732
    • 2007-04-05
    • Manju SarkarPurakh Raj Verma
    • Manju SarkarPurakh Raj Verma
    • H01L29/93
    • H01L27/0808H01L29/93
    • Large tuning range junction varactor includes first and second junction capacitors coupled in parallel between first and second varactor terminals. First and second plates of the capacitors are formed by three alternating doped regions in a substrate. The first and third doped regions are of the same type sandwiching the second doped region of the second type. A first input terminal is coupled to the first and third doped regions and a second terminal is coupled to the second doped region. At the interfaces of the doped regions are first and second depletion regions whose width can be varied by varying the voltage across the terminals from zero to full reverse bias.
    • 大型调谐范围结变容二极管包括并联在第一和第二变容二极管端子之间的第一和第二结电容器。 电容器的第一和第二板由衬底中的三个交替掺杂区域形成。 第一和第三掺杂区域具有夹着第二类型的第二掺杂区域的相同类型。 第一输入端子耦合到第一和第三掺杂区域,第二端子耦合到第二掺杂区域。 在掺杂区域的界面处是第一和第二耗尽区域,其宽度可以通过将端子间的电压从零改变为全反向偏压来改变。
    • 9. 发明授权
    • High voltage device
    • 高压设备
    • US08222130B2
    • 2012-07-17
    • US12500620
    • 2009-07-10
    • Guowei ZhangPurakh Raj Verma
    • Guowei ZhangPurakh Raj Verma
    • H01L21/22
    • H01L29/0847H01L21/26586H01L21/823807H01L27/0922H01L29/0653H01L29/1045H01L29/66659H01L29/7835
    • A method of forming a device is presented. The method includes providing a substrate prepared with an active device region. The active device region includes gate stack layers of a gate stack including at least a gate electrode layer over a gate dielectric layer. A first mask is provided on the substrate corresponding to the gate. The substrate is patterned to at least remove portions of a top gate stack layer unprotected by the first mask. A second mask is also provided on the substrate with an opening exposing a portion of the first mask and the top gate stack layer. A channel well is formed by implanting ions through the opening and gate stack layers into the substrate.
    • 提出了一种形成装置的方法。 该方法包括提供用活性器件区域制备的衬底。 有源器件区域包括至少包括栅极电介质层上的栅极电极层的栅极堆叠的栅极堆叠层。 在对应于栅极的基板上设置第一掩模。 将衬底图案化以至少去除未被第一掩模保护的顶部栅极堆叠层的部分。 在基板上还设有第二掩模,该开口具有暴露第一掩模和顶栅层叠层的一部分的开口。 通过将离子通过开口和栅极堆叠层注入衬底而形成通道阱。
    • 10. 发明授权
    • Self-aligned vertical PNP transistor for high performance SiGe CBiCMOS process
    • 用于高性能SiGe CBiCMOS工艺的自对准垂直PNP晶体管
    • US07488662B2
    • 2009-02-10
    • US11302479
    • 2005-12-13
    • Shaoqiang ZhangPurakh Raj VermaSanford Chu
    • Shaoqiang ZhangPurakh Raj VermaSanford Chu
    • H01L21/331
    • H01L21/82285H01L21/8249H01L27/0623H01L27/0826H01L29/7378
    • A structure and a process for a self-aligned vertical PNP transistor for high performance SiGe CBiCMOS process. Embodiments include SiGe CBiCMOS with high-performance SiGe NPN transistors and PNP transistors. As the PNP transistors and NPN transistors contained different types of impurity profile, they need separate lithography and doping step for each transistor. The process is easy to integrate with existing CMOS process to save manufacturing time and cost. As plug-in module, fully integration with SiGe BiCMOS processes. High doping Polysilicon Emitter can increase hole injection efficiency from emitter to base, reduce emitter resistor, and form very shallow EB junction. Self-aligned N+ base implant can reduce base resistor and parasitical EB capacitor. Very low collector resistor benefits from BP layer. PNP transistor can be Isolated from other CMOS and NPN devices by BNwell, Nwell and BN+ junction.
    • 用于高性能SiGe CBiCMOS工艺的自对准垂直PNP晶体管的结构和工艺。 实施例包括具有高性能SiGe NPN晶体管和PNP晶体管的SiGe CBiCMOS。 由于PNP晶体管和NPN晶体管包含不同类型的杂质分布,因此每个晶体管需要单独的光刻和掺杂步骤。 该过程易于与现有的CMOS工艺集成,以节省制造时间和成本。 作为插件模块,与SiGe BiCMOS工艺完全集成。 高掺杂多晶硅发射器可以增加从发射极到基极的空穴注入效率,减少发射极电阻,并形成非常浅的EB结。 自对准N +基极植入可以减少基极电阻和寄生EB电容。 极低的集电极电阻受益于BP层。 PNP晶体管可以通过BNwell,Nwell和BN +结与其他CMOS和NPN器件隔离。