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    • 4. 发明授权
    • Process for ion-supported vacuum coating
    • 离子支持真空镀膜工艺
    • US5846608A
    • 1998-12-08
    • US722024
    • 1996-10-11
    • Manfred NeumannKlaus GoedickeSiegfried SchillerJonathan ReschkeHenry MorgnerFalk MildeFred Fietzke
    • Manfred NeumannKlaus GoedickeSiegfried SchillerJonathan ReschkeHenry MorgnerFalk MildeFred Fietzke
    • H05H1/32C23C14/32C23C14/56H01J37/32H05H1/46C23C14/08
    • H01J37/32422C23C14/32C23C14/562H01J37/32706
    • A process an device for ion-supported vacuum coating. The process and the affiliated device is intended to permit the high-rate ating of large-surfaced, electrically conductive and electrically insulating substrates with electrically insulating and electrically conductive coatings with relatively low expenditure. The substrates are predominantly band-shaped, in particular plastic sheets with widths of over a meter. According to the invention, in an intrinsically known device for vacuum coating, alternating negative and positive voltage pulses are applied to the electrically conductive substrate or in electrically insulating substrates, to an electrode disposed directly behind them, e.g. the cooling roller, relative to the plasma or to an electrode that is disposed almost at plasma potential. The form, the voltage, and the duration of the pulses are adapted to the coating task and the material. The process is used particularly for depositing abrasion protection, corrosion protection, and barrier coatings. The user is the packaging industry, among others.
    • PCT No.PCT / DE95 / 00476 Sec。 371日期:1996年10月11日 102(e)日期1996年10月11日PCT提交1995年4月7日PCT公布。 公开号WO95 / 28508 日期:1995年10月26日一种用于离子支持真空涂层的装置。 该方法和附属装置旨在允许具有相对较低支出的具有电绝缘和导电涂层的大表面,导电和电绝缘基板的高速涂布。 基底主要是带状,特别是宽度超过一米的塑料片。 根据本发明,在本来已知的用于真空涂覆的装置中,将交替的负电压和正电压脉冲施加到导电衬底或电绝缘衬底,直接设置在其后面的电极,例如, 冷却辊相对于等离子体或几乎处于等离子体电位的电极。 脉冲的形式,电压和持续时间适用于涂层任务和材料。 该方法特别用于沉积磨损保护,防腐蚀和阻隔涂层。 用户是包装行业等。
    • 5. 发明授权
    • Process for producing organically modified oxide, oxynitride or nitride
layers by vacuum deposition
    • 通过真空沉积生产有机改性氧化物,氮氧化物或氮化物层的方法
    • US6130002A
    • 2000-10-10
    • US91487
    • 1998-07-22
    • Manfred NeumannSiegfried SchillerHenry MorgnerNicolas SchillerSteffen Straach
    • Manfred NeumannSiegfried SchillerHenry MorgnerNicolas SchillerSteffen Straach
    • C23C14/00C23C14/08C23C14/32B32B9/00H05H1/00
    • C23C14/08C23C14/0021C23C14/32Y10T428/31663
    • Method for producing at least one organically-modified oxide, oxinitride or nitride layer by vacuum coating on a substrate through plasma-enhanced evaporation of evaporation material comprising nitride-forming evaporation material and one of oxide and suboxide evaporation material, wherein the at least one layer is deposited through plasma-enhanced, reactive high-rate evaporation of the evaporation material with use of gaseous monomers and a reactive gas including at least one of oxygen and nitrogen, and wherein the evaporation material, gaseous monomers, and reactive gas pass through a high-density plasma zone immediately in front of the substrate. A method for producing at least one organically-modified oxide, oxinitride or nitride layer by vacuum coating on a substrate through plasma-enhanced evaporation of one of oxide and suboxide evaporation material, wherein the at least one layer is deposited through plasma-enhanced, reactive high-rate evaporation of the evaporation material with use of gaseous monomers and a reactive gas including at least one of oxygen and nitrogen, and wherein the evaporation material, gaseous monomers, and reactive gas pass through a high-density plasma zone immediately in front of the substrate. Substrates with an organically-modified oxide, oxinitride or nitride layer, as produced by the methods, wherein the at least one layer deposited by plasma-enhanced, high-rate vapor deposition includes more than 50 wt% of inorganic molecules and less than 50 wt% of partially cross-linked organic molecules.
    • PCT No.PCT / DE96 / 02434 Sec。 371日期:1998年7月22日 102(e)日期1998年7月22日PCT 1996年12月13日PCT PCT。 公开号WO97 / 23661 日期1997年7月3日通过使包含氮化物形成蒸发材料和氧化物和低氧化物蒸发材料之一的蒸发材料的等离子体增强蒸发在衬底上真空涂覆来生产至少一种有机改性氧化物,氮氧化物或氮化物层的方法,其中 通过使用气体单体和包括氧和氮中的至少一种的反应性气体,通过等离子体增强的反应性高速蒸发蒸发材料沉积至少一层,并且其中蒸发材料,气体单体和反应性 气体立即在基板的前方通过高密度等离子体区域。 一种用于通过氧化物和低氧化物蒸发材料之一的等离子体增强蒸发在衬底上真空涂覆来生产至少一种有机改性氧化物,氮氧化物或氮化物层的方法,其中所述至少一层通过等离子体增强的反应性沉积 使用气体单体和包括至少一种氧气和氮气的反应气体蒸发材料的高速蒸发,并且其中蒸发材料,气体单体和反应性气体立即通过高密度等离子体区域 底物。 通过该方法制备的具有有机改性的氧化物,氮氧化物或氮化物层的衬底,其中通过等离子体增强的高速气相沉积沉积的至少一层包括超过50重量%的无机分子和小于50重量% %的部分交联的有机分子。