专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US06357669B1 Nozzle 失效
标题翻译：喷嘴
公开(公告)号：US06357669B1
公开(公告)日：2002-03-19
申请号：US09470139
申请日：1999-12-22
申请人： Lakhi Nandlal Goenka , Marc Alan Straub , Jay D Baker
发明人： Lakhi Nandlal Goenka , Marc Alan Straub , Jay D Baker
IPC分类号： B05B706
CPC分类号： B05B7/025 , B05B7/0075 , B05B7/0416 , B05B7/2416
摘要： A nozzle 10 which receives first and second materials 24, 30 and which has an outlet aperture 18. The first material 24 is received within the outlet aperture 18 and is atomized by the second material 30 within the outlet aperture 18 before it is emitted from the nozzle 10 and applied to a targeted location and/or object 26.
摘要翻译：接收第一和第二材料24,30并且具有出口孔18的喷嘴10.第一材料24被容纳在出口孔18内并且在出口孔18中从第二材料30发射之前被第二材料30雾化喷嘴10并施加到目标位置和/或物体26。

2. 发明授权

US06338439B1 Nozzle assembly 失效
标题翻译：喷嘴总成
公开(公告)号：US06338439B1
公开(公告)日：2002-01-15
申请号：US09470138
申请日：1999-12-22
申请人： Lakhi Nandlal Goenka , Marc Alan Straub , Jay D Baker
发明人： Lakhi Nandlal Goenka , Marc Alan Straub , Jay D Baker
IPC分类号： B05B1700
CPC分类号： B05B7/1495 , B05B7/1486
摘要： A nozzle assembly 10 including a first inlet aperture 12 which receives material 14 which is to be selectively emitted from assembly 10. Assembly 10 includes an outlet aperture 16 having several apertures 18, 20, 22, 24, and 26 which are respectively separated by substantially identical elements 28, 30, 32, and 34. Elements 28-34 cooperatively form a plurality of passages or channels 40-50 through assembly 10. A centrally disposed channel 44 is relatively narrower than the other channels 40, 42, 46, and 50, and channels 42, 46 are relatively narrower than outermost channels 46, 50, thereby causing material 14 to be emitted at a substantially similar and/or uniform velocity at each point or location within outlet aperture 16.
摘要翻译：喷嘴组件10包括第一入口孔12，其容纳待从组件10选择性地发射的材料14.组件10包括具有多个孔18,20,22,24和26的出口孔16，孔口18,20,22,24和26分别由基本上相同的元件28,30,32和34.元件28-34通过组件10协同地形成多个通道或通道40-50.居中设置的通道44比其他通道40,42,46和50相对较窄，并且通道42,46比最外面的通道46,50相对较窄，从而使材料14在出口孔16内的每个点或位置以基本上相似和/或均匀的速度发射。

3. 发明授权

US06328226B1 Nozzle assembly 失效
标题翻译：喷嘴总成
公开(公告)号：US06328226B1
公开(公告)日：2001-12-11
申请号：US09470136
申请日：1999-12-22
申请人： Lakhi Nandlal Goenka , Marc Alan Straub
发明人： Lakhi Nandlal Goenka , Marc Alan Straub
IPC分类号： B05B128
CPC分类号： B05B7/0075 , B05B7/0416
摘要： A nozzle 10 including a member 12 which selectively receives a first material 18 and a second material 22, and which selectively atomizes the second material 22 by use of the first material 18. The nozzle 10 further includes a diffuser member 50 which receives the atomized second material 22 and which diffuses the received and atomized second material 22 while substantially, concomitantly, and tangentially applying the first material 18 to the diffused second material 22, thereby allowing the atomized second material 22 to be desirably deposited upon a target location 7 and/or object 9.
摘要翻译：喷嘴10包括选择性地容纳第一材料18和第二材料22并且通过使用第一材料18选择性地雾化第二材料22的构件12.喷嘴10还包括扩散器构件50，其接收雾化的第二材料22，并且在基本上伴随地并且相切地将第一材料18施加到扩散的第二材料22的同时扩散接收和雾化的第二材料22，从而允许雾化的第二材料22被期望地沉积在目标位置7和/或对象9。

4. 发明授权

US06315221B1 Nozzle 失效
标题翻译：喷嘴
公开(公告)号：US06315221B1
公开(公告)日：2001-11-13
申请号：US09470137
申请日：1999-12-22
申请人： Lakhi Nandial Goenka , Marc Alan Straub
发明人： Lakhi Nandial Goenka , Marc Alan Straub
IPC分类号： B05B100
CPC分类号： B05B7/0416
摘要： A nozzle 10 having an outlet aperture 26, the outlet aperture 26 having at least one injector 40,42 which is disposed within the aperture 26 and which injects a material 17 within the aperture 26, effective to allow the material to be atomized and to be emitted from the aperture 26 at a substantially identical velocity at each point within the aperture 26.
摘要翻译：具有出口孔26的喷嘴10，出口孔26具有至少一个喷射器40,42，其被设置在孔26内并且在孔26内注入材料17，其有效地允许材料被雾化并成为在孔26中的每个点处以基本相同的速度从孔26发射。

5. 发明授权

US06740246B2 Circuit board and a method for making the same 失效
标题翻译：电路板及其制作方法
公开(公告)号：US06740246B2
公开(公告)日：2004-05-25
申请号：US09836645
申请日：2001-04-17
申请人： Andrew Zachary Glovatsky , Robert Edward Belke , Marc Alan Straub , Michael George Todd
发明人： Andrew Zachary Glovatsky , Robert Edward Belke , Marc Alan Straub , Michael George Todd
IPC分类号： H01B1300
CPC分类号： H05K3/4641 , H05K3/062 , H05K3/4038 , H05K3/44 , H05K3/4623 , H05K3/4652 , H05K2201/0305 , H05K2201/0361 , H05K2201/0397 , H05K2201/09554 , H05K2201/09881 , H05K2203/0733 , H05K2203/1184 , Y10T29/49124 , Y10T29/49155 , Y10T29/49156
摘要： A method for making multi-layer electronic circuit boards 64 having “blind” type apertures 28, 30 which may be selectively and electrically grounded and further having selectively formed air bridges and/or crossover circuits 45, 46.
摘要翻译：一种用于制造具有“盲”型孔28,30的多层电子电路板64的方法，其可选择性地和电接地，并且还具有选择性地形成的空气桥和/或交叉电路45,46。

6. 发明授权

US6000597A Molten solder dispensing system 失效
标题翻译：熔融焊料分配系统
公开(公告)号：US6000597A
公开(公告)日：1999-12-14
申请号：US14878
申请日：1998-01-28
申请人： Marc Alan Straub , Frank Burke DiPiazza , Vivek Amir Jairazbhoy , Lakhi Nandial Goenka , Randy Claude Stevenson
发明人： Marc Alan Straub , Frank Burke DiPiazza , Vivek Amir Jairazbhoy , Lakhi Nandial Goenka , Randy Claude Stevenson
IPC分类号： B23K3/06 , H05K3/34
CPC分类号： B23K3/0607 , H05K3/3457
摘要： An apparatus for dispensing solder includes a nozzle body having a plurality of flow channels formed therein. Each flow channel includes an inlet end and a dispenser end for dispensing solder. The nozzle body forms a nipple surrounding each dispenser end, and the nozzle body further forms a shielding chamber in communication with each dispenser end for protecting the respective nipple, and optionally providing flow of inerting gas and/or excluding ambient oxygen from the soldering area. The nozzle bodies comprise micro-machined silicon. Various flow channel configurations are provided for improved flow characteristics.
摘要翻译：用于分配焊料的设备包括具有形成在其中的多个流动通道的喷嘴体。每个流动通道包括用于分配焊料的入口端和分配器端。喷嘴体形成围绕每个分配器端的乳头，并且喷嘴体还形成与每个分配器端连通的屏蔽室，用于保护相应的乳头，并且可选地提供惰性气体流和/或排除来自焊接区域的环境氧气。喷嘴体包括微加工硅。提供了各种流动通道构造以改善流动特性。

7. 发明授权

US06303992B1 Interposer for mounting semiconductor dice on substrates 失效
标题翻译：用于将半导体裸片安装在基板上的插入器
公开(公告)号：US06303992B1
公开(公告)日：2001-10-16
申请号：US09347542
申请日：1999-07-06
申请人： Cuong Van Pham , Frank Burke DiPiazza , Jay DeAvis Baker , Marc Alan Straub , Vivek Amir Jairazbhoy
发明人： Cuong Van Pham , Frank Burke DiPiazza , Jay DeAvis Baker , Marc Alan Straub , Vivek Amir Jairazbhoy
IPC分类号： H01L2348
CPC分类号： H01L23/473 , H01L2224/16225
摘要： An interposer 10 for electrically coupling a semiconductor die 50 to a substrate 70, comprising: an interposer body 12 made of a dielectric material and having a contact surface 14 and an opposed bonding surface 16; a plurality of contact pads 18 arranged about the periphery of the contact surface 14; a plurality of bonding pads 20 arranged across generally the entire area of the bonding surface 16; and a plurality of electrically conductive conduits 22 disposed generally within the interposer body, such that each conduit 22 connects a respective one of the contact pads 18 with a respective one of the bonding pads 20. The interposer 10 may also include: a sealed cooling channel 28 defined within the interposer body 12; a fluid medium 30 generally filling the cooling channel 28; and a piezoelectric element 26 attached to the interposer body such that the piezoelectric element communicates with the cooling channel 28 and the fluid medium 30, the piezoelectric element being operatively coupled to at least two of the electrically conductive conduits 22.
摘要翻译：一种用于将半导体管芯50电耦合到衬底70的插入器10，包括：由介电材料制成并具有接触表面14和相对的接合表面16的插入体本体12; 布置在接触表面14周围的多个接触垫18; 布置在接合表面16的整个区域的多个接合焊盘20; 以及大体上设置在插入体内部的多个导电管道22，使得每个导管22将相应的一个接触焊盘18与相应的一个接合焊盘20连接。插入器10还可以包括：密封的冷却通道 28; 通常填充冷却通道28的流体介质30; 以及压电元件26，其连接到中介体，使得压电元件与冷却通道28和流体介质30连通，压电元件可操作地耦合到至少两个导电导管22。

8. 发明授权

US5746368A Molten solder dispensing system 失效
公开(公告)号：US5746368A
公开(公告)日：1998-05-05
申请号：US649750
申请日：1996-05-15
申请人： Marc Alan Straub , Frank Burke DiPiazza , Vivek Amir Jairazbhoy , Lakhi Nandial Goenka , Randy Claude Stevenson
发明人： Marc Alan Straub , Frank Burke DiPiazza , Vivek Amir Jairazbhoy , Lakhi Nandial Goenka , Randy Claude Stevenson
IPC分类号： B23K3/06 , H05K3/34
CPC分类号： B23K3/0607 , H05K3/3457
摘要： An apparatus for dispensing solder includes a nozzle body having a plurality of flow channels formed therein. Each flow channel includes an inlet end and a dispenser end for dispensing solder. The nozzle body forms a nipple surrounding each dispenser end, and the nozzle body further forms a shielding chamber in communication with each dispenser end for protecting the respective nipple, and optionally providing flow of inerting gas and/or excluding ambient oxygen from the soldering area. The nozzle bodies comprise micro-machined silicon. Various flow channel configurations are provided for improved flow characteristics.

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式