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1. 发明申请

US20050186703A1 Method for packaging semiconductor chips and corresponding semiconductor chip system 审中-公开
标题翻译：封装半导体芯片的方法和相应的半导体芯片系统
公开(公告)号：US20050186703A1
公开(公告)日：2005-08-25
申请号：US11041157
申请日：2005-01-21
申请人： Kurt Weiblen , Hubert Benzel , Stefan Pinter , Roland Guenschel , Frieder Haag
发明人： Kurt Weiblen , Hubert Benzel , Stefan Pinter , Roland Guenschel , Frieder Haag
IPC分类号： H01L23/02 , B81B3/00 , B81B7/00 , B81C1/00 , B81C3/00 , G01L9/00 , G01P1/02 , H01L21/50 , H01L21/52 , H01L21/56 , H01L21/60
CPC分类号： B81B7/0051 , B81C2203/0154 , G01L19/141 , G01P1/023 , H01L2224/05554 , H01L2224/48091 , H01L2224/48247 , H01L2224/48472 , H01L2924/0102 , H01L2924/01068 , H01L2924/01079 , H01L2924/15151 , H01L2924/181 , H01L2924/1815 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A method for packaging semiconductor chips and a corresponding semiconductor chip system. The method includes making available a semiconductor chip having a diaphragm region; providing a cap over the diaphragm region, while leaving the diaphragm region open; mounting the semiconductor chip on a support frame; and providing a molded housing around the semiconductor chip and at least a partial region of the support frame for packaging the semiconductor chip.
摘要翻译：一种用于封装半导体芯片的方法和相应的半导体芯片系统。该方法包括提供具有隔膜区域的半导体芯片; 在隔膜区域上提供盖子，同时使隔膜区域打开; 将半导体芯片安装在支撑框架上; 以及提供围绕半导体芯片的模制外壳和用于包装半导体芯片的支撑框架的至少一部分区域。

2. 发明授权

US06778400B2 Electronic device 失效
标题翻译：电子设备
公开(公告)号：US06778400B2
公开(公告)日：2004-08-17
申请号：US10030994
申请日：2002-05-13
申请人： Juergen Kurle , Kurt Weiblen , Stefan Pinter , Frieder Haag
发明人： Juergen Kurle , Kurt Weiblen , Stefan Pinter , Frieder Haag
IPC分类号： H05K500
CPC分类号： H01R12/585 , H05K7/1417 , H05K7/142
摘要： An electronic device, including a housing part having at least one closable opening and one plug-in part, the housing part accommodating a printed circuit board, which has at least one electrical and/or electronic component arranged thereon, and electrical contact elements, which are electrically connected to the plug-in part, and which have ends in the housing interior that run parallel to each other and protrude in the direction of the at least one opening, the ends being passed through contact openings of the printed circuit board and being connected conductively to the printed circuit board. To protect impact-sensitive and vibration-sensitive components, it is proposed to provide the contact elements, on a part of their length not inserted into the contact openings, with elastically deformable segments and to flexibly support the printed circuit board in the housing part by the contact element configured in this way, and, additionally, to connect it via damping elements at least indirectly to the housing part.
摘要翻译：一种电子设备，包括具有至少一个可闭合开口和一个插入部分的壳体部分，所述壳体部分容纳布置在其上的至少一个电气和/或电子部件的印刷电路板和电接触元件，其中电连接到插入部分，并且其在壳体内部中的彼此平行延伸并且沿至少一个开口的方向突出的端部，端部穿过印刷电路板的接触开口，并且是与印刷电路板导电连接。为了保护冲击敏感和振动敏感的部件，建议在其长度的一部分长度上未插入接触开口中的可弹性变形的部分提供接触元件，并且通过以下方式灵活地支撑外壳部件中的印刷电路板：以这种方式构造的接触元件，并且另外通过阻尼元件至少间接地连接到壳体部分。

3. 发明授权

US06528868B1 Lead frame device and method for producing the same 失效
标题翻译：引线框架装置，引线框架和芯片之间的热膨胀系数最小
公开(公告)号：US06528868B1
公开(公告)日：2003-03-04
申请号：US09622768
申请日：2000-10-12
申请人： Kurt Weiblen , Stefan Pinter , Frieder Haag
发明人： Kurt Weiblen , Stefan Pinter , Frieder Haag
IPC分类号： H01L23495
CPC分类号： H01L23/49503 , H01L23/49575 , H01L24/48 , H01L24/49 , H01L24/97 , H01L2224/05554 , H01L2224/48137 , H01L2224/48247 , H01L2224/49171 , H01L2924/00014 , H01L2924/01068 , H01L2924/01077 , H01L2924/10253 , H01L2924/14 , H01L2924/00 , H01L2224/45015 , H01L2924/207 , H01L2224/45099 , H01L2224/05599 , H01L2224/85399
摘要： A lead frame device having a lead frame made of copper, copper alloy or copper compound having a die pad area, within which a chip is to be mounted, and having a multiplicity of leads, which are arranged around the die pad area; and having a die pad made of silicon which is mounted in the die pad area on the lead frame to accommodate the chip.
摘要翻译：一种引线框架装置，其具有由铜，铜合金或铜化合物构成的引线框架，所述引线框架具有芯片焊盘区域，芯片安装在芯片区域内，并且具有多个引线，其布置在芯片焊盘区域周围; 并且具有安装在引线框架上的管芯焊盘区域中以容纳芯片的由硅制成的管芯焊盘。

4. 发明授权

US06804883B1 Method for producing a pressure sensor 有权
标题翻译：压力传感器的制造方法
公开(公告)号：US06804883B1
公开(公告)日：2004-10-19
申请号：US09603060
申请日：2000-06-26
申请人： Kurt Weiblen , Anton Doering , Juergen Nieder , Frieder Haag
发明人： Kurt Weiblen , Anton Doering , Juergen Nieder , Frieder Haag
IPC分类号： H01R4300
CPC分类号： B81C1/00333 , B81B2201/0264 , B81C2203/0154 , G01L19/0084 , G01L19/147 , G01L19/148 , H01L2224/48091 , H01L2224/48247 , H01L2924/1815 , Y10T29/49002 , Y10T29/49005 , Y10T29/4902 , Y10T29/49169 , Y10T29/49171 , Y10T29/49174 , Y10T29/49176 , H01L2924/00014
摘要： A method for producing a pressure sensor, in which a semiconductor pressure pick-up is mounted on a mounting section of a lead grid, in particular a leadframe. The semiconductor pressure pick-up is electrically connected to contact sections of the lead grid. The lead grid, together with the semiconductor pressure pick-up, is inserted into an injection molding die. A die part is brought into contact at the side of the semiconductor pressure pick-up facing away from the mounting section or at side of the mounting section facing away from the semiconductor pressure pick-up. The semiconductor pressure pick-up in the injection molding die is subsequently enclosed by a housing made of mold compound. In order to prevent the mounting section from giving way, it is proposed to clamp the mounting section of the lead grid in the injection molding die when producing the housing.
摘要翻译：一种制造压力传感器的方法，其中半导体压力传感器安装在引线格栅的安装部分，特别是引线框架上。半导体压力传感器电连接到引线栅格的接触部分。引线格栅与半导体压力传感器一起插入注塑模具中。模具部件在半导体压力拾取器的背离安装部分或背离半导体压力传感器的安装部分的一侧被接触。注射模具中的半导体压力拾取器随后由由模具化合物制成的壳体封闭。为了防止安装部分的脱落，提出在制造壳体时将引线格栅的安装部分夹紧在注塑模具中。

5. 发明授权

US06300169B1 Method for manufacturing a pressure sensor 有权
标题翻译：制造压力传感器的方法
公开(公告)号：US06300169B1
公开(公告)日：2001-10-09
申请号：US09603082
申请日：2000-06-26
申请人： Kurt Weiblen , Anton Doering , Juergen Nieder , Frieder Haag
发明人： Kurt Weiblen , Anton Doering , Juergen Nieder , Frieder Haag
IPC分类号： H01L2144
CPC分类号： G01L19/143 , G01L19/141 , H01L21/565 , H01L2224/48091 , H01L2224/48247 , H01L2224/49171 , H01L2924/10253 , H01L2924/1815 , H01L2924/00014 , H01L2924/00
摘要： In a method for manufacturing a pressure sensor, in which a semiconductor pressure sensing element is applied to an assembly segment of a lead grid, the semiconductor pressure sensing element is electrically connected to contact segments of the lead grid. The lead grid having the semiconductor pressure sensing element is inserted into an injection molding die, and then the semiconductor pressure sensing element, in the injection molding die, is surrounded by a housing made of injection molding compound. A structure is present in the injection molding die through which a pressure feed for the semiconductor pressure sensing element is left free from the jacket of injection molding compound. A stamp is arranged in the injection molding die so as to be separated by a gap from the side of the assembly segment that is facing away from the semiconductor pressure sensing element or from the side of the semiconductor pressure sensing element that is facing away from the assembly segment. As a result of a change in the temperature of the stamp relative to the temperature of the liquefied injection molding compound, a reduction in the flow capacity of the injection molding compound in the area of the stamp is brought about and, as a result, at least a complete penetration of the injection molding compound into the gap is avoided.
摘要翻译：在用于制造压力传感器的方法中，其中半导体压力感测元件被施加到引线栅的组装段，半导体压力感测元件电连接到引线栅的接触段。具有半导体压力感测元件的引线格栅被插入到注射成型模具中，然后在注射成型模具中的半导体压力感测元件被由注射成型化合物制成的壳体包围。在注模模具中存在一种结构，通过该结构，半导体压力传感元件的压力进料不被注射模塑料的夹套留下。在注射成型模具中布置有印模，以便与组件段的背离半导体压力感测元件的侧面或从半导体压力感测元件的背离背面的间隙分开装配段由于印模温度相对于液化注射模塑料的温度变化的结果，注塑模具在印模区域的流动能力降低，结果是在避免了将注射成型化合物完全渗透到间隙中。

6. 发明授权

US06711033B2 Sealed housing for an electronic device and the respective seal 失效
标题翻译：用于电子设备的密封外壳和相应的密封件
公开(公告)号：US06711033B2
公开(公告)日：2004-03-23
申请号：US10041352
申请日：2002-01-08
申请人： Kurt Weiblen , Frieder Haag
发明人： Kurt Weiblen , Frieder Haag
IPC分类号： H05K900
CPC分类号： H05K5/061
摘要： A sealed housing for an electronic device has a housing bottom part which has a first contact surface; a housing top part which has a second contact surface; the housing bottom part being connectable to the housing top part; and a seal which is insertable between the housing bottom part and the housing top part so that it contacts the first contact surface and the second contact surface to form a seal when the housing bottom part and the housing top part are joined. The seal is in the form of a continuous disk.
摘要翻译：一种用于电子设备的密封壳体具有壳体底部，其具有第一接触表面; 具有第二接触表面的壳体顶部; 所述壳体底部可连接到所述壳体顶部; 以及密封件，其可插入在壳体底部部分和壳体顶部部分之间，使得当壳体底部部分和壳体顶部部分接合时，该密封件接触第一接触表面和第二接触表面以形成密封。密封是连续盘的形式。

7. 发明授权

US06872911B2 Welding method 有权
标题翻译：焊接方法
公开(公告)号：US06872911B2
公开(公告)日：2005-03-29
申请号：US10482568
申请日：2002-06-12
申请人： Kurt Weiblen , Christian Ohl , Oliver Kohn , Frieder Haag , Michael Honer
发明人： Kurt Weiblen , Christian Ohl , Oliver Kohn , Frieder Haag , Michael Honer
IPC分类号： B23K26/244 , B29C35/08 , B29C65/00 , B29C65/16 , B23K26/20 , B32B31/00
CPC分类号： B29C66/3282 , B23K26/244 , B29C65/1612 , B29C65/1635 , B29C66/112 , B29C66/114 , B29C66/116 , B29C66/12445 , B29C66/1282 , B29C66/12821 , B29C66/1284 , B29C66/1286 , B29C66/322 , B29C66/53461 , B29C66/542 , B29C66/73921 , B29C66/8322 , B29C2035/0822 , B29K2995/0027
摘要： A method is proposed for welding a first component part to a second component part, the energy to melt melting regions being supplied by a laser beam. In this context, the laser beam is directed through the first component part, which is made of a nonabsorbing material, to the second component part. The second component part is made of a material which strongly absorbs laser beam. At least one stop is provided outside melting regions.
摘要翻译：提出了一种将第一组分部分焊接到第二组分部分的方法，熔融熔化区域的能量由激光束提供。在这种情况下，激光束被引导通过由非吸收材料制成的第一组分部分到第二组分部分。第二部件由强烈吸收激光束的材料制成。熔融区域外至少设有一个停止点。

8. 发明授权

US07585662B2 Container for an analysis chip 有权
标题翻译：容器用于分析芯片
公开(公告)号：US07585662B2
公开(公告)日：2009-09-08
申请号：US10477160
申请日：2002-03-27
申请人： Kurt Weiblen , Hubert Benzel
发明人： Kurt Weiblen , Hubert Benzel
IPC分类号： C12M1/34 , C12M3/00 , C12Q1/70
CPC分类号： B01L3/502715 , B01L9/52 , B01L2200/027 , B01L2200/0689 , B01L2300/045 , B01L2300/0636 , B01L2300/0877
摘要： A receptacle is provided for accommodating an analysis chip, which receptacle has openings in a housing having access to the analysis chip, which openings are protected from external influences by a movable protector, and for carrying out an analysis, a mechanism for moving the protector is provided such that an opening in the protector coincides with the receptacle openings.
摘要翻译：提供容纳分析芯片的插座，该插座在具有进入分析芯片的壳体中具有开口，该开口被可移动保护器保护免受外部影响，并且为了进行分析，用于移动保护器的机构是设置成使得保护器中的开口与容器开口重合。

9. 发明申请

US20050194685A1 Method for mounting semiconductor chips and corresponding semiconductor chip system 审中-公开
标题翻译：安装半导体芯片的方法和相应的半导体芯片系统
公开(公告)号：US20050194685A1
公开(公告)日：2005-09-08
申请号：US11065638
申请日：2005-02-23
申请人： Kurt Weiblen , Hubert Benzel , Regina Grote
发明人： Kurt Weiblen , Hubert Benzel , Regina Grote
IPC分类号： G01L9/00 , B81B7/00 , B81C3/00 , H01L21/48 , H01L21/60 , H01L23/48 , H01L29/84
CPC分类号： G01L19/148 , B81B7/0048 , B81B2201/0257 , B81B2207/012 , G01L19/0636 , G01L19/141 , G01L19/145 , H01L2224/05571 , H01L2224/05573 , H01L2224/131 , H01L2224/1715 , H01L2224/29035 , H01L2224/73204 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01033 , H01L2924/01068 , H01L2924/01082 , H01L2924/014 , H01L2224/13099 , H01L2224/13599 , H01L2224/05599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599
摘要： A method for mounting semiconductor chips includes the steps of: a) providing a semiconductor chip having a surface that has a diaphragm region and a peripheral region, the peripheral region having a mounting region; b) providing a substrate which has a surface having a recess; c) mounting the mounting region of the semiconductor chip using a flip-chip technique onto the surface of the substrate in such a way that an edge of the recess lies between the mounting region and the diaphragm region; and d) underfilling the mounting region using an underfilling component, the edge of the recess being used a demarcation region for the underfilling component, so that no underfilling component is able to get into the diaphragm region. Also provided is a corresponding semiconductor chip system.
摘要翻译：一种用于安装半导体芯片的方法包括以下步骤：a）提供具有具有膜片区域和周边区域的表面的半导体芯片，所述周边区域具有安装区域; b）提供具有凹部的表面的基板; c）使用倒装芯片技术将半导体芯片的安装区域以使得凹部的边缘位于安装区域和隔膜区域之间的方式安装到基板的表面上; 和d）使用底部填充部件对安装区域进行底部填充，凹部的边缘用于底部填充部件的分界区域，使得没有底部填充的部件能够进入隔膜区域。还提供了相应的半导体芯片系统。

10. 发明授权

US6062088A Pressure sensor 有权
标题翻译：压力传感器
公开(公告)号：US6062088A
公开(公告)日：2000-05-16
申请号：US171035
申请日：1999-03-03
申请人： Kurt Ingrisch , Kurt Weiblen , Hubert Benzel , Botho Ziegenbein , Hans-Peter Trah , Andreas Duell , Karl Bender , Jochen Franz
发明人： Kurt Ingrisch , Kurt Weiblen , Hubert Benzel , Botho Ziegenbein , Hans-Peter Trah , Andreas Duell , Karl Bender , Jochen Franz
IPC分类号： G01L9/04 , G01L9/00 , H01L29/84 , G01L9/06 , G01L7/06
CPC分类号： G01L9/006 , G01L9/0052
摘要： A pressure sensor includes a metallic membrane and a frame. For detecting the deflection of the membrane, a silicon bridge element having piezoresistive resistor elements is arranged on the membrane and the frame.
摘要翻译： PCT No.PCT / DE97 / 00716 Sec。 371日期1999年3月3日 102（e）1999年3月3日PCT PCT 1997年4月9日PCT公布。第WO97 / 39320号公报日期1997年10月23日压力传感器包括金属膜和框架。为了检测膜的挠曲，在膜和框架上布置具有压阻电阻元件的硅桥元件。

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