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    • 5. 发明公开
    • SENSOR MODULE
    • US20240027236A1
    • 2024-01-25
    • US18039199
    • 2021-11-10
    • Sony Semiconductor Solutions Corporation
    • Hirofumi Owaki
    • G01D11/24B29C65/16
    • G01D11/245B29C65/1635
    • [Object] To provide a sensor module and a method for producing the sensor module, the sensor module making it possible to improve a degree of freedom in design, to facilitate the operation, and to reduce costs by reducing the number of components.
      [Solving Means] A sensor module according to an embodiment of the present technology includes a first member, a second member, a third member, and a sensor element. The first member is made of a synthetic resin material that has absorptive properties with respect to first laser light. The second member is made of a synthetic resin material that has transmissive properties with respect to second laser light of a wavelength that is different from a wavelength of the first laser light. The third member is made of a synthetic resin material that has transmissive properties with respect to the first laser light and has absorptive properties with respect to the second laser light, the third member including a first surface and a second surface, the first surface including a first welding portion that is welded to the first member, the second surface including a second welding portion that is welded to the second member.