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    • 1. 发明授权
    • Method of structuring a semiconductor chip
    • 结晶半导体芯片的方法
    • US5242533A
    • 1993-09-07
    • US828033
    • 1992-01-30
    • Hans-Peter TrahGuenther FindlerJoerg Muchow
    • Hans-Peter TrahGuenther FindlerJoerg Muchow
    • H01L21/22H01L21/302H01L21/306H01L21/3063H01L21/3065H01L21/308H01L29/84
    • H01L21/30604H01L21/3063H01L21/3081Y10S438/924
    • Processes are proposed for structuring monocrystalline semiconductor substrates provided with a basic doping, in particular silicon substrates with a (100) or (110) crystal orientation. In this process, at least one main surface of the semiconductor substrate is passivated by means of a structured masking layer, and in an etching step etching into the semiconductor substrate is done anisotropically through openings in the masking layer. It is proposed that as the masking layer (12), a structured, preferably monocrystalline, layer of the basic material of the semiconductor substrate be used, which is doped such that a pn junction is produced between the masking layer (12) and the semiconductor substrate (10), the junction being polarized in the depletion direction and serving as an etch stop. It is also proposed that the semiconductor substrate (10) be formed of a substrate (11) and at least one layer (13), applied thereon, with buried zones (16), with pn junctions being produced between the zones (16) and the substrate (11). Zones (16) that are electrically insulated from one another and the semiconductor substrate (10) are electrically bonded, so that the pn junctions are polarized in the depletion direction and serve as an etch stop for deep etching.
    • 提出了用于构造设置有基本掺杂的单晶半导体衬底的工艺,特别是具有(100)或(110)晶体取向的硅衬底。 在该工艺中,半导体衬底的至少一个主表面通过结构化掩模层钝化,并且在蚀刻步骤中,通过掩模层中的开口各向异性地进行蚀刻到半导体衬底中。 提出,作为掩模层(12),使用半导体衬底的基本材料的结构化的,优选单晶层,其被掺杂以使得在掩模层(12)和半导体层(12)之间产生pn结 衬底(10),所述结在耗尽方向上极化并用作蚀刻停止。 还提出半导体衬底(10)由衬底(11)和其上施加有至少一个层(13)形成,具有掩埋区域(16),在区域(16)和 基板(11)。 彼此电绝缘的区域(16)和半导体衬底(10)电连接,使得pn结在耗尽方向上极化,并用作深刻蚀的蚀刻停止。
    • 3. 发明授权
    • Structural element having a porous region at least regionally provided with a cover layer and its use as well as method for setting the thermal conductivity of a porous region
    • 具有至少区域地设置有覆盖层的多孔区域的结构元件及其用途以及用于设定多孔区域的热导率的方法
    • US07709933B2
    • 2010-05-04
    • US10742055
    • 2003-12-18
    • Hans ArtmannThorsten PannekHans-Peter TrahFranz Laermer
    • Hans ArtmannThorsten PannekHans-Peter TrahFranz Laermer
    • H01L31/036
    • C04B38/007B81C1/00492B81C2201/0115C04B2111/28C04B35/14
    • A structural element having a region of porous silicon or porous silicon oxide, which was obtained from a porization, starting from an edge area of the region, in at least largely crystalline silicon. Relative to the edge area, the crystalline silicon has a crystal orientation that has an orientation that differs from a orientation or from an orientation that is equivalent for reasons of symmetry. This structural element is suited for use in a mass-flow sensor, in a component for the thermal decoupling of sensor and/or actuator structures, or a gas sensor. Furthermore, methods for setting the thermal conductivity of a region of porous silicon or porous silicon oxide of a structural element are described. In particular, in a porization of crystalline silicon, starting from an edge area of the region, the crystalline orientation of the silicon relative to the edge area is selected such that a thermal conductivity comes about along a direction perpendicular to the edge area that differs from, in particular is lower than, the thermal conductivity, that comes about in this direction in an otherwise analogous porization of crystalline silicon having a orientation or an equivalent orientation relative to this edge area.
    • 具有多孔硅或多孔氧化硅区域的结构元件,其从至少大部分为晶体硅的区域的边缘区域开始从孔化获得。 相对于边缘区域,晶体硅具有取向不同于<100>取向的晶体取向或者由于对称原因等同的取向。 该结构元件适用于质量流量传感器,用于传感器和/或致动器结构或气体传感器的热解耦的部件。 此外,描述了用于设定结构元件的多孔硅或多孔氧化硅区域的热导率的方法。 特别地,在从区域的边缘区域开始的晶体硅的孔化中,选择硅相对于边缘区域的晶体取向,使得热导率沿垂直于与边缘区域不同的边缘区域的方向 ,特别是低于导热率,其在相对于该边缘区域具有<100>取向或等同取向的晶体硅的另外类似的孔化中在该方向上。
    • 7. 发明授权
    • Microstructured thermosensor
    • 微结构热敏传感器
    • US06863438B2
    • 2005-03-08
    • US10070973
    • 2001-06-07
    • Thorsten PannekHans-Peter Trah
    • Thorsten PannekHans-Peter Trah
    • G01J5/12G01J5/16G01K7/02H01L35/14H01L35/16H01L35/32G01J5/00H01L35/28
    • G01K7/028G01J5/12
    • A micropatterned thermosensor, e.g., an infrared sensor, includes a supporting body and at least one thermocouple arranged thereon. The thermocouple also has a first material and a second material, which together form, at least in a pointwise manner, at least one thermal contact. Furthermore, it is provided that the first and/or the second material are configured at least regionally in the form of a meander-shaped or undulating-type circuit trace and extend on the supporting body. In addition, a micropatterned thermosensor having such patterned circuit traces, in which the first material is platinum or aluminum, and the second material is doped or undoped polysilicon-germanium.
    • 微图案化的热传感器,例如红外传感器,包括支撑体和布置在其上的至少一个热电偶。 热电偶还具有第一材料和第二材料,它们至少以点方式一起形成至少一个热接触。 此外,提供第一和/或第二材料至少区域地配置为曲折形或波状型电路迹线的形式,并在支撑体上延伸。 此外,具有这种图案化电路迹线的微图案化热敏传感器,其中第一材料是铂或铝,第二材料是掺杂或未掺杂的多晶硅。