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1. 发明申请

US20150152124A1 SURFACE TREATMENT METHOD, SURFACE TREATMENT AGENT, AND NOVEL COMPOUND 有权
标题翻译：表面处理方法，表面处理剂和新化合物
公开(公告)号：US20150152124A1
公开(公告)日：2015-06-04
申请号：US14406679
申请日：2012-08-31
申请人： Kunio Mori , Yusuke Matsuno , Katsuhito Mori , Takahiro Kudo , Shuukichi Takii , Shigeru Michiwaki , Manabu Miyawaki , Masanori Yanai , Kouichi Kamiyama , Hitomi Chiba , Yasuyuki Masuda
发明人： Kunio Mori , Yusuke Matsuno , Katsuhito Mori , Takahiro Kudo , Shuukichi Takii , Shigeru Michiwaki , Manabu Miyawaki , Masanori Yanai , Kouichi Kamiyama , Hitomi Chiba , Yasuyuki Masuda
IPC分类号： C07F7/18
CPC分类号： C07F7/1804 , Y10T428/31678
摘要： Provided is a surface treatment technique whereby excellent adhering function, excellent reacting function and rich diversity can be established. A surface treatment method that comprises applying a solution containing compound (α) to a substrate and thus providing compound (α) thereon, wherein: said compound (α) has at least an M-OH group and/or a group capable of forming M-OH (wherein M represents a metal atom), an amino group and a triazine ring; one or more said M-OH groups and/or groups capable of forming M-OH (wherein M represents a metal atom) are present; said amino group is bonded to a terminal; one or more said amino groups bonded to the terminal are present; and one or more said triazine rings are present.
摘要翻译：提供了一种表面处理技术，其具有优异的粘附功能，优异的反应功能和丰富的多样性。一种表面处理方法，其特征在于，将含有化合物（α）的溶液涂布在基材上，从而在其上提供化合物（α），其中：所述化合物（α）至少具有M-OH基团和/或能够形成M -OH（其中M表示金属原子），氨基和三嗪环; 存在一个或多个所述M-OH基团和/或能够形成M-OH（其中M表示金属原子）的基团; 所述氨基键合到末端; 存在一个或多个与末端键合的所述氨基; 并且存在一个或多个所述三嗪环。

2. 发明授权

US09790242B2 Surface treatment method, surface treatment agent, and novel compound 有权
公开(公告)号：US09790242B2
公开(公告)日：2017-10-17
申请号：US14406679
申请日：2012-08-31
申请人： Kunio Mori , Yusuke Matsuno , Katsuhito Mori , Takahiro Kudo , Shuukichi Takii , Shigeru Michiwaki , Manabu Miyawaki , Masanori Yanai , Kouichi Kamiyama , Hitomi Chiba , Yasuyuki Masuda
发明人： Kunio Mori , Yusuke Matsuno , Katsuhito Mori , Takahiro Kudo , Shuukichi Takii , Shigeru Michiwaki , Manabu Miyawaki , Masanori Yanai , Kouichi Kamiyama , Hitomi Chiba , Yasuyuki Masuda
IPC分类号： B05D3/02 , C07F7/18
CPC分类号： C07F7/1804 , Y10T428/31678
摘要： A surface treatment technique having excellent adhering function, excellent reacting function and rich diversity is provided. The surface treatment includes applying a solution containing compound (α) to a substrate and thus providing compound (α) thereon, wherein: the compound (α) is at least one of Formula [IV] and Formula [V]: wherein A is —N(Ra)Rb—Si(Rc)n(ORd)3−n, or —N{Rb—Si(Rc)n(ORd)3−n}2, B is ——N(Re)Rf(NH2)m, or —N{Rf(NH2(m}2, C is A, B, or —N(Rg)Rh, D is Ri and wherein each of Ra, Re, and Rg is independently H or a hydrocarbon group, Rb, Rc, Rd, Rf, Rh, and Ri are hydrocarbon groups, n is 0, 1, or 2, and m is 1 or 2.

3. 发明授权

US10385076B2 Surface treatment agent and novel compound 有权
公开(公告)号：US10385076B2
公开(公告)日：2019-08-20
申请号：US15672145
申请日：2017-08-08
申请人： Kunio Mori , Yusuke Matsuno , Katsuhito Mori , Takahiro Kudo , Shuukichi Takii , Shigeru Michiwaki , Manabu Miyawaki , Masanori Yanai , Kouichi Kamiyama , Hitomi Chiba , Yasuyuki Masuda
发明人： Kunio Mori , Yusuke Matsuno , Katsuhito Mori , Takahiro Kudo , Shuukichi Takii , Shigeru Michiwaki , Manabu Miyawaki , Masanori Yanai , Kouichi Kamiyama , Hitomi Chiba , Yasuyuki Masuda
IPC分类号： C07D251/70 , A61K31/53 , C07F7/18
摘要： A surface treatment agent including a compound (α) is provided. The compound (α) has one or more M-OH groups and/or groups capable of forming M-OH (wherein M represents a metal atom), an amino group and a triazine ring; wherein said amino group is bonded to a terminal; one or more said amino groups bonded to the terminal are present; and one or more said triazine rings are present.

4. 发明授权

US08753748B2 Process for forming metal film, and product equipped with metal film 有权
标题翻译：金属膜成型工艺及配有金属膜的产品
公开(公告)号：US08753748B2
公开(公告)日：2014-06-17
申请号：US13823526
申请日：2011-09-30
申请人： Kunio Mori , Yusuke Matsuno , Katsuhito Mori , Takahiro Kudo , Shigeru Michiwaki , Manabu Miyawaki
发明人： Kunio Mori , Yusuke Matsuno , Katsuhito Mori , Takahiro Kudo , Shigeru Michiwaki , Manabu Miyawaki
IPC分类号： C23C18/16 , C23C18/20
CPC分类号： C23C18/1608 , C23C18/1612 , C23C18/1653 , C23C18/20 , C23C18/204 , C23C18/2086 , C23C18/285 , C23C18/30 , C25D5/56 , C25D11/00 , H05K3/389 , H05K2203/072 , H05K2203/122 , H05K2203/124 , Y10T428/31663 , Y10T428/31678
摘要： The purpose of the present invention is to provide a wiring substrate from which a metal film cannot be detached easily. A process for forming a metal film comprises a step (X) of applying an agent containing a compound (α) onto the surface of a base and a step (Y) of forming a metal film on the surface of the compound (α) by a wet-mode plating technique, wherein the compound (α) is a compound having either an OH group or an OH-generating group, an azide group and a triazine ring per molecule, and the base comprises a polymer.
摘要翻译：本发明的目的在于提供一种金属膜不容易脱离的布线基板。形成金属膜的方法包括在化合物（α）的表面上将含有化合物（α）的试剂涂布在基材表面上的步骤（X）和在化合物（α）的表面上形成金属膜的工序（Y）湿式电镀技术，其中化合物（α）是每分子具有OH基或OH生成基团，叠氮基和三嗪环的化合物，并且碱包含聚合物。

5. 发明申请

US20130183534A1 PROCESS FOR FORMING METAL FILM, AND PRODUCT EQUIPPED WITH METAL FILM 有权
标题翻译：形成金属膜的方法，以及配有金属膜的产品
公开(公告)号：US20130183534A1
公开(公告)日：2013-07-18
申请号：US13823526
申请日：2011-09-30
申请人： Kunio Mori , Yusuke Matsuno , Takahiro Kudo , Shigeru Michiwaki , Manabu Miyawaki
发明人： Kunio Mori , Yusuke Matsuno , Takahiro Kudo , Shigeru Michiwaki , Manabu Miyawaki
IPC分类号： C23C18/20 , C25D11/00
CPC分类号： C23C18/1608 , C23C18/1612 , C23C18/1653 , C23C18/20 , C23C18/204 , C23C18/2086 , C23C18/285 , C23C18/30 , C25D5/56 , C25D11/00 , H05K3/389 , H05K2203/072 , H05K2203/122 , H05K2203/124 , Y10T428/31663 , Y10T428/31678
摘要： The purpose of the present invention is to provide a wiring substrate from which a metal film cannot be detached easily. A process for forming a metal film comprises a step (X) of applying an agent containing a compound (α) onto the surface of a base and a step (Y) of forming a metal film on the surface of the compound (α) by a wet-mode plating technique, wherein the compound (α) is a compound having either an OH group or an OH-generating group, an azide group and a triazine ring per molecule, and the base comprises a polymer.
摘要翻译：本发明的目的在于提供一种金属膜不容易脱离的布线基板。形成金属膜的方法包括将含有化合物（α）的试剂施加到基材表面上的步骤（X）和在化合物（α）的表面上形成金属膜的步骤（Y）湿法电镀技术，其中化合物（α）是每分子具有OH基或OH生成基团，叠氮基和三嗪环的化合物，并且所述碱包含聚合物。

6. 发明授权

US09185811B2 Method of producing printed circuit board, and printed board produced by the method 有权
标题翻译：制造印刷电路板的方法和通过该方法制造的印刷电路板
公开(公告)号：US09185811B2
公开(公告)日：2015-11-10
申请号：US13642471
申请日：2011-03-02
申请人： Yoichi Saito , Shigeru Michiwaki , Noriaki Taneko , Shukichi Takii
发明人： Yoichi Saito , Shigeru Michiwaki , Noriaki Taneko , Shukichi Takii
IPC分类号： H05K3/02 , H01R43/00 , H05K3/00 , H05K1/00 , B29C65/00 , H05K3/20 , H05K3/26
CPC分类号： H05K3/205 , H05K3/26 , H05K2201/0376 , H05K2201/098 , H05K2203/0152 , H05K2203/025 , H05K2203/1572
摘要： A method of producing a printed circuit board includes: forming a metal layer on a support plate; forming a mask layer on the metal layer; forming a pattern plating having a stem as plating up to a level of the mask layer, and a cap as a portion of plating exceeding the mask layer and having an outgrowth lying over the surface of the mask layer; laminating an insulating base on a conductive circuit board constituted by the support plate, the metal layer and the pattern plating to form a circuit board intermediate in which the pattern plating is buried in the base; removing the support plate and the metal layer to form an exposed surface; and mechanically polishing the exposed surface until the stem of the pattern plating is removed, to increase the width of the conductive pattern on the exposed surface.
摘要翻译：制造印刷电路板的方法包括：在支撑板上形成金属层; 在所述金属层上形成掩模层; 形成具有作为所述掩模层的水平的电极的杆的图案电镀，以及作为超过所述掩模层并且具有位于所述掩模层的表面上的生长的电镀部分的帽; 在由支撑板，金属层和图案电镀构成的导电电路板上层叠绝缘基底，以形成电路板中间，其中图案电镀埋在基座中; 移除支撑板和金属层以形成暴露表面; 并且机械抛光露出的表面，直到去除图案电镀的杆，以增加暴露表面上的导电图案的宽度。

7. 发明申请

US20140224762A1 Substrate Manufacturing Method 有权
标题翻译：基板制造方法
公开(公告)号：US20140224762A1
公开(公告)日：2014-08-14
申请号：US14346281
申请日：2011-09-30
申请人： Shukichi Takii , Noriaki Taneko , Shigeru Michiwaki , Mitsuho Kurosu , Yuichiro Naya
发明人： Shukichi Takii , Noriaki Taneko , Shigeru Michiwaki , Mitsuho Kurosu , Yuichiro Naya
IPC分类号： H05K3/12
CPC分类号： H05K3/125 , H01L21/76802 , H01L2221/101 , H05K3/1258 , H05K3/3452 , H05K3/4673 , H05K2203/013 , H05K2203/10 , H05K2203/107
摘要： A substrate manufacturing method includes an inner layer circuit forming step for partially removing metal films from an insulating base material (2), on both surfaces of which the metal films are stuck, and forming an inner layer circuit (3); and an insulating layer forming step for applying first insulating resin (4) to each of both the surfaces of the insulating base material (2) with an inkjet system and forming an insulating layer (5). In the insulating layer forming step, a via hole (6) from which the inner layer circuit (3) is partially exposed is formed simultaneously with the application of the first insulating resin (4). Consequently, a step of separately forming a via hole with a laser or the like is unnecessary, expenses are relatively low, and it is possible to simplify a manufacturing process.
摘要翻译：衬底制造方法包括：内层电路形成步骤，用于从绝缘基材（2）部分地去除金属膜，在其两面上粘附有金属膜，并形成内层电路（3）; 以及绝缘层形成步骤，用喷墨系统将第一绝缘树脂（4）施加到绝缘基材（2）的两个表面中，并形成绝缘层（5）。在绝缘层形成步骤中，与第一绝缘树脂（4）的施加同时形成内层电路（3）部分露出的通孔（6）。因此，不需要用激光等单独形成通孔的步骤，费用相对较低，并且可以简化制造过程。

8. 发明申请

US20130043063A1 METHOD OF PRODUCING PRINTED CIRCUIT BOARD, AND PRINTED BOARD PRODUCED BY THE METHOD 有权
标题翻译：印刷电路板的制造方法以及由该方法生产的印刷电路板
公开(公告)号：US20130043063A1
公开(公告)日：2013-02-21
申请号：US13642471
申请日：2011-03-02
申请人： Yoichi Saito , Shigeru Michiwaki , Noriaki Taneko , Shukichi Takii
发明人： Yoichi Saito , Shigeru Michiwaki , Noriaki Taneko , Shukichi Takii
IPC分类号： B32B38/10 , H05K1/02 , B32B38/08
CPC分类号： H05K3/205 , H05K3/26 , H05K2201/0376 , H05K2201/098 , H05K2203/0152 , H05K2203/025 , H05K2203/1572
摘要： A method of producing a printed circuit board includes: forming a metal layer on a support plate; forming a mask layer on the metal layer; forming a pattern plating having a stem as plating up to a level of the mask layer, and a cap as a portion of plating exceeding the mask layer and having an outgrowth lying over the surface of the mask layer; laminating an insulating base on a conductive circuit board constituted by the support plate, the metal layer and the pattern plating to form a circuit board intermediate in which the pattern plating is buried in the base; removing the support plate and the metal layer to form an exposed surface; and mechanically polishing the exposed surface until the stem of the pattern plating is removed, to increase the width of the conductive pattern on the exposed surface.
摘要翻译：制造印刷电路板的方法包括：在支撑板上形成金属层; 在所述金属层上形成掩模层; 形成具有作为所述掩模层的水平的电极的杆的图案电镀，以及超过所述掩模层并且具有位于所述掩模层的表面上的生长的作为电镀部分的帽; 在由支撑板，金属层和图案电镀构成的导电电路板上层叠绝缘基底，以形成电路板中间，其中图案电镀埋在基座中; 移除支撑板和金属层以形成暴露表面; 并且机械抛光露出的表面，直到去除图案电镀的杆，以增加暴露表面上的导电图案的宽度。

9. 发明授权

US07800917B2 Printed wiring board 失效
标题翻译：印刷电路板
公开(公告)号：US07800917B2
公开(公告)日：2010-09-21
申请号：US11491604
申请日：2006-07-24
申请人： Hiroshi Shimada , Shigeru Michiwaki , Kazuo Shishime
发明人： Hiroshi Shimada , Shigeru Michiwaki , Kazuo Shishime
IPC分类号： H05K1/11 , H05K1/14
CPC分类号： H05K3/4661 , H05K3/387 , H05K2201/0209 , H05K2201/0212 , H05K2201/09518 , H05K2203/0773 , H05K2203/0789 , H05K2203/0796 , H05K2203/1152
摘要： A printed wiring board has a first wiring layer formed at least on one surface of an insulative substrate, an insulating layer formed as covering the first wiring layer, and a second wiring layer formed on the insulating layer. The insulating layer is formed of a cured insulative sheet made of a high-stiff sheet-type reinforcing material containing resin. The first and second wiring layers are electrically connected to each other through at least one hole having a bottom. The second wiring layer is united with the insulating layer at an interface thereof with a conductive material of the second wiring layer injected into concave sections provided on the interface. Another printed wiring board has an insulative substrate having a first surface and a second surface, a first insulating layer and a second insulating layer formed on the first surface and the second surface, respectively, and a first wiring layer formed on the first insulating layer and a second wiring layer formed on the second insulating layer. The first and second wiring layers are electrically connected to each other via at least one through hole. The first wiring layer is united with the first insulating layer at an interface thereof with a conductive material of the first wiring layer injected into concave sections provided on the interface. The second wiring layer is united with the second insulating layer at an interface thereof with a conductive material of the first wiring layer injected into concave sections provided on the interface.
摘要翻译：印刷布线板具有形成在绝缘基板的至少一个表面上的第一布线层，形成为覆盖第一布线层的绝缘层和形成在绝缘层上的第二布线层。绝缘层由包含树脂的高刚性片状增强材料制成的固化绝缘片形成。第一和第二布线层通过具有底部的至少一个孔彼此电连接。第二布线层与绝缘层在其界面处与注入到设置在界面上的凹部中的第二布线层的导电材料相结合。另一种印刷电路板具有分别具有第一表面和第二表面的绝缘基板，分别形成在第一表面和第二表面上的第一绝缘层和第二绝缘层，以及形成在第一绝缘层上的第一布线层和形成在第二绝缘层上的第二布线层。第一和第二布线层经由至少一个通孔彼此电连接。第一布线层与第一绝缘层在其界面处与注入到设置在界面上的凹部中的第一布线层的导电材料结合。第二布线层与第二绝缘层的界面处与第一布线层的导电材料的界面结合，注入到设置在界面上的凹部中。

10. 发明授权

US09380711B2 Substrate manufacturing method 有权
标题翻译：基板制造方法
公开(公告)号：US09380711B2
公开(公告)日：2016-06-28
申请号：US14346281
申请日：2011-09-30
申请人： Shukichi Takii , Noriaki Taneko , Shigeru Michiwaki , Mitsuho Kurosu , Yuichiro Naya
发明人： Shukichi Takii , Noriaki Taneko , Shigeru Michiwaki , Mitsuho Kurosu , Yuichiro Naya
IPC分类号： H01B13/00 , B23P15/00 , C03C25/00 , C23F1/00 , H05K3/12 , H01L21/768 , H05K3/46 , H05K3/34
CPC分类号： H05K3/125 , H01L21/76802 , H01L2221/101 , H05K3/1258 , H05K3/3452 , H05K3/4673 , H05K2203/013 , H05K2203/10 , H05K2203/107
摘要： A substrate manufacturing method includes an inner layer circuit forming step for partially removing metal films from an insulating base material (2), on both surfaces of which the metal films are stuck, and forming an inner layer circuit (3); and an insulating layer forming step for applying first insulating resin (4) to each of both the surfaces of the insulating base material (2) with an inkjet system and forming an insulating layer (5). In the insulating layer forming step, a via hole (6) from which the inner layer circuit (3) is partially exposed is formed simultaneously with the application of the first insulating resin (4). Consequently, a step of separately forming a via hole with a laser or the like is unnecessary, expenses are relatively low, and it is possible to simplify a manufacturing process.
摘要翻译：衬底制造方法包括：内层电路形成步骤，用于从绝缘基材（2）部分地去除金属膜，在其两面上粘附有金属膜，并形成内层电路（3）; 以及绝缘层形成步骤，用喷墨系统将第一绝缘树脂（4）施加到绝缘基材（2）的两个表面中，并形成绝缘层（5）。在绝缘层形成步骤中，与第一绝缘树脂（4）的施加同时形成内层电路（3）部分露出的通孔（6）。因此，不需要用激光等单独形成通孔的步骤，费用相对较低，并且可以简化制造过程。

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