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1. 发明授权

US07049005B2 Organic compositions 有权
公开(公告)号：US07049005B2
公开(公告)日：2006-05-23
申请号：US10160773
申请日：2002-05-30
申请人： Paul G. Apen , William B. Bedwell , Nancy Iwamoto , Boris A. Korolev , Kreisler S. Lau , Bo Li , Ananth Naman
发明人： Paul G. Apen , William B. Bedwell , Nancy Iwamoto , Boris A. Korolev , Kreisler S. Lau , Bo Li , Ananth Naman
IPC分类号： B32B9/04
CPC分类号： H01L21/02118 , C08G61/02 , C08L65/00 , H01L21/02126 , H01L21/02282 , H01L21/312 , H01L21/31695 , H05K1/0313 , Y10T428/31663
摘要： The present invention provides a composition comprising: (a) thermosetting component comprising (1) optionally monomer of Formula I as set forth below and (2) at least one oligomer or polymer of Formula II set forth below where E is a cage compound (defined below); each Q is the same or different and selected from aryl, branched aryl, and substituted aryl wherein the substituents include hydrogen, halogen, alkyl, aryl, substituted aryl, heteroaryl, aryl ether, alkenyl, alkynyl, alkoxyl, hydroxyalkyl, hydroxyaryl, hydroxyalkenyl, hydroxyalkynyl, hydroxyl, or carboxyl; G is aryl or substituted aryl where substituents include halogen and alkyl; h is from 0 to 10; i is from 0 to 10; j is from 0 to 10; and w is 0 or 1; (b) adhesion promoter comprising compound having at least bifunctionality wherein the bifunctionality may be the same or different and the first functionality is capable of interacting with the thermosetting component (a) and the second functionality is capable of interacting with a substrate when the composition is applied to the substrate. The present compositions may be used as a dielectric substrate material, etch stop, hardmask, or air bridge in microchips, multichip modules, laminated circuit boards, or printed wiring boards. The present composition may also be used as a passive coating for enveloping a completed wafer.

2. 发明授权

US06998178B2 Organic compositions 失效
标题翻译：有机成分
公开(公告)号：US06998178B2
公开(公告)日：2006-02-14
申请号：US10404644
申请日：2003-04-02
申请人： Paul G. Apen , William B. Bedwell , Nancy Iwamoto , Boris A. Korolev , Kreisler S. Lau , Bo Li , Ananth Naman
发明人： Paul G. Apen , William B. Bedwell , Nancy Iwamoto , Boris A. Korolev , Kreisler S. Lau , Bo Li , Ananth Naman
IPC分类号： B32B9/04
CPC分类号： C08G61/02 , H01L21/02118 , H01L21/02126 , H01L21/02282 , H01L21/312 , Y10T428/31663
摘要： The present invention provides a composition comprising: (a) thermosetling component comprising (1) optionally at least one monomer of Formula I as sel forth below and (2) at least one oligomer or polymer of Formula II set forth below where E is a cage compound (defined below); each Q is the same or different and selected from hydrogen, aryl, branched aryl, and substituted aryl wherein the substituents include hydrogen, halogen, alkyl, aryl, substituted aryl, heteroaryl, aryl ether, alkenyl, alkynyl, alkoxyl, hydroxyalkyl, hydroxyaryl, hydroxyalkenyl, hydroxyalkynyl, hydroxyl, or carboxyl; Gw is aryl or substituted aryl where substituents include halogen and alkyl; h is from 0 to 10; i is from 0 to 10; j is from 0 to 10; and w is 0 or 1; adhesion promoter comprising compound having least bifunctionality wherein the bifunctionality may be the same or different and the first functionality is capable of interacting with the thermosetting component (a) and the second functionality is capable of interacting with a substrate when the composition is applied to the substrate. The present compositions may be used as a dielectric substrate material, etch stop, hardmask, or air bridge in microchips, multichip modules, laminated circuit boards, or printed wiring boards. The present composition may also be used as a passive coating for enveloping a completed wafer.
摘要翻译：本发明提供一种组合物

3. 发明授权

US06469123B1 Compositions and methods for thermosetting molecules in organic compositions 失效
公开(公告)号：US06469123B1
公开(公告)日：2002-10-22
申请号：US09618945
申请日：2000-07-19
申请人： Kreisler S. Lau , Feng Quan Liu , Boris A. Korolev , Emma Brouk , Ruslan Zherebin , David Nalewajek
发明人： Kreisler S. Lau , Feng Quan Liu , Boris A. Korolev , Emma Brouk , Ruslan Zherebin , David Nalewajek
IPC分类号： C08G6378
CPC分类号： C08G61/02 , C08G61/12 , C08G2650/60
摘要： In a method of producing a low dielectric constant polymer, a thermosetting monomer is provided, wherein the thermosetting monomer has a cage compound or aryl core structure, and a plurality of arms that are covalently bound to the cage compound or core structure. In a subsequent step, the thermosetting monomer is incorporated into a polymer to form the low dielectric constant polymer, wherein the incorporation into the polymer comprises a chemical reaction of a triple bond that is located in at least one of the arms. Contemplated cage compounds and core structures include adamantane, diamantane, silicon, a phenyl group and a sexiphenylene group, while preferred arms include an arylene, a branched arylene, and an arylene ether. The thermosetting monomers may advantageously be employed to produce low-k dielectric material in electronic devices, and the dielectric constant of the polymer can be controlled by varying the overall length of the arms.

4. 发明授权

US06423811B1 Low dielectric constant materials with polymeric networks 失效
公开(公告)号：US06423811B1
公开(公告)日：2002-07-23
申请号：US09619237
申请日：2000-07-19
申请人： Kreisler S. Lau , Feng Quan Liu , Boris Korolev , Emma Brouk , Ruslan Zherebin , David Nalewajek
发明人： Kreisler S. Lau , Feng Quan Liu , Boris Korolev , Emma Brouk , Ruslan Zherebin , David Nalewajek
IPC分类号： C08G802
CPC分类号： C08G69/48 , C08G61/02 , C08G61/12 , C08G65/4012 , C08G2650/20 , C08G2650/60 , C08L2312/00
摘要： A low dielectric constant material has a polymeric network that is fabricated from a first and a second component. The first component comprises a polymeric strand, and the second component comprises a molecule having a central portion with at least three arms extending from the central portion, wherein each of the arms includes a backbone with a reactive group. The first component and the second component form the polymeric network in a reaction that involves at least one of the reactive groups when the first and second components are thermally activated. Contemplated low dielectric constant materials are advantageously employed in the fabrication of electronic devices, and particularly contemplated devices include integrated circuits.

5. 发明授权

US07049386B2 Compositions and methods for thermosetting molecules in organic compositions 失效
标题翻译：有机组合物中热固性分子的组成和方法
公开(公告)号：US07049386B2
公开(公告)日：2006-05-23
申请号：US10176335
申请日：2002-06-19
申请人： Kreisler S. Lau , Feng Quan Liu , Boris A. Korolev , Emma Brouk , Ruslan Zherebin , David Nalewajek
发明人： Kreisler S. Lau , Feng Quan Liu , Boris A. Korolev , Emma Brouk , Ruslan Zherebin , David Nalewajek
IPC分类号： C08G63/78
CPC分类号： C08G61/02 , C08G61/12 , C08G65/40 , C08G2650/60
摘要： In a method of producing a low dielectric constant polymer, a thermosetting monomer is provided, wherein the thermosetting monomer has a cage compound or aryl core structure, and a plurality of arms that are covalently bound to the cage compound or core structure. In a subsequent step, the thermosetting monomer is incorporated into a polymer to form the low dielectric constant polymer, wherein the incorporation into the polymer comprises a chemical reaction of a triple bond that is located in at least one of the arms. Contemplated cage compounds and core structures include adamantane, diamantane, silicon, a phenyl group and a sexiphenylene group, while preferred arms include an arlyene, a branched arylene, and an arylene ether. The thermosetting monomers may advantageously be employed to produce low-k dielectric material in electronic devices, and the dielectric constant of the polymer can be controlled by varying the overall length of the arms.
摘要翻译：在制造低介电常数聚合物的方法中，提供了一种热固性单体，其中该热固性单体具有笼形化合物或芳基核心结构，以及共价结合笼形化合物或核心结构的多个臂。在随后的步骤中，将热固性单体引入聚合物中以形成低介电常数聚合物，其中掺入聚合物中包含位于至少一个臂中的三键的化学反应。沉积的笼状化合物和核心结构包括金刚烷，金刚烷，硅，苯基和亚噻吩基，而优选的臂包括芳烯，支链亚芳基和亚芳基醚。热固性单体可以有利地用于在电子器件中产生低k介电材料，并且聚合物的介电常数可以通过改变臂的整个长度来控制。

6. 发明授权

US06740685B2 Organic compositions 失效
标题翻译：有机成分
公开(公告)号：US06740685B2
公开(公告)日：2004-05-25
申请号：US10158548
申请日：2002-05-30
申请人： Bo Li , Paul G. Apen , Kreisler S. Lau , Edward J. Sullivan
发明人： Bo Li , Paul G. Apen , Kreisler S. Lau , Edward J. Sullivan
IPC分类号： C08J902
CPC分类号： C07C17/10 , C07C17/266 , C07C25/22 , C07C25/24 , C08G61/02 , C08L65/00 , H01L21/02118 , H01L21/02126 , H01L21/02203 , H01L21/02282 , H01L21/312 , H01L21/3122 , H01L21/31695 , H01L23/145 , H01L2924/0002 , H01L2924/09701 , H01L2924/12044 , H05K1/024 , H05K1/0313 , H05K3/4676 , C07C23/46 , H01L2924/00
摘要： The present invention provides a composition comprising (a) thermosetting component comprising: (1) optionally monomer of Formula I as set forth below and (2) at least one oligomer or polymer of Formula II as set forth below where E, Q, G, h, l, j, and w are as set forth below and (b) porogen that bonds to thermosetting component (a). Preferably, the porogen is selected from the group consisting of unsubstituted polynorbornene, substituted polynorbornene, polycaprolactone, unsubstituted polystyrene, substituted polystyrene, polyacenaphthylene homopolymer, and polyacenaphthylene copolymer. Preferably, the present compositions may be used as dielectric substrate in microchips, multichip modules, laminated circuit boards, or printed wiring boards.
摘要翻译：本发明提供一种组合物，其包含（a）热固性组分，其包含：（1）如下所述的任选的式I的单体和（2）至少一种如下所述的式II的低聚物或聚合物，其中E，Q，G， h，l，j和w如下所述，（b）与热固性组分（a）键合的致孔剂。优选地，造孔剂选自未取代的聚降冰片烯，取代的聚降冰片烯，聚己内酯，未取代的聚苯乙烯，取代的聚苯乙烯，聚苊烯均聚物和聚苊烯共聚物。优选地，本发明组合物可以用作微芯片，多芯片模块，层叠电路板或印刷线路板中的电介质基板。

7. 发明授权

US06713590B2 Low dielectric constant materials with polymeric networks 失效
标题翻译：低介电常数材料与聚合网络
公开(公告)号：US06713590B2
公开(公告)日：2004-03-30
申请号：US10004584
申请日：2001-12-03
申请人： Kreisler S. Lau , Feng Quan Liu , Boris Korolev , Emma Brouk , Ruslan Zherebin , David Nalewajek
发明人： Kreisler S. Lau , Feng Quan Liu , Boris Korolev , Emma Brouk , Ruslan Zherebin , David Nalewajek
IPC分类号： C08G802
CPC分类号： C08G69/48 , C08G61/02 , C08G61/12 , C08G65/4012 , C08G2650/20 , C08G2650/60 , C08L2312/00
摘要： A low dielectric constant material has a polymeric network that is fabricated from a first and a second component. The first component comprises a polymeric strand, and the second component comprises a molecule having a central portion with at least three arms extending from the central portion, wherein each of the arms includes a backbone with a reactive group. The first component and the second component form the polymeric network in a reaction that involves at least one of the reactive groups when the first and second components are thermally activated. Contemplated low dielectric constant materials are advantageously employed in the fabrication of electronic devices, and particularly contemplated devices include integrated circuits.
摘要翻译：低介电常数材料具有由第一和第二组分制成的聚合物网络。第一组分包含聚合物链，并且第二组分包含具有至少三个从中心部分延伸的臂的中心部分的分子，其中每个臂包括具有反应性基团的主链。当第一和第二组分被热活化时，第一组分和第二组分在涉及至少一个反应性基团的反应中形成聚合物网络。考虑的低介电常数材料有利地用于制造电子器件，并且特别预期的器件包括集成电路。

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