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1. 发明申请

US20060009051A1 Flexible cable interconnect assembly 有权
公开(公告)号：US20060009051A1
公开(公告)日：2006-01-12
申请号：US11226186
申请日：2005-09-13
申请人： Koenraad Schuylenbergh , Armin Volkel , Thomas DiStefano , Michel Rosa , David Fork , Eugene Chow , Meng Lean
发明人： Koenraad Schuylenbergh , Armin Volkel , Thomas DiStefano , Michel Rosa , David Fork , Eugene Chow , Meng Lean
IPC分类号： H01R12/00
CPC分类号： H01R12/78 , H05K1/147 , H05K3/323 , H05K3/361 , H05K3/365 , H05K2201/044 , H05K2201/09845
摘要： A data transmission interconnect assembly capable of transmission speeds in excess of 40 Gbps in which, for example, a line-card is detachably coupled to a backplane using flexible flat cables that are bent to provide a continuous, smooth curve between the connected boards, and connected by a connection apparatus that employs cable-to-cable interface members that are transparent to the transmitted signal waves. Microspring interface members are formed on the contact structure pressed against the cables to provide interface arrangements that are smaller than a wavelength of the transmitted signal. A connector apparatus uses a cam mechanism to align the cables, and then to press the contact structure, having the microspring interface members formed thereon, against the cables. An alterative contact structure uses anisotropic conductive film.

2. 发明申请

US20050136703A1 Flexible cable interconnect assembly 有权
公开(公告)号：US20050136703A1
公开(公告)日：2005-06-23
申请号：US10742501
申请日：2003-12-19
申请人： Koenraad Van Schuylenbergh , Armin Volkel , Thomas DiStefano , Michel Rosa , David Fork , Eugene Chow , Meng Lean
发明人： Koenraad Van Schuylenbergh , Armin Volkel , Thomas DiStefano , Michel Rosa , David Fork , Eugene Chow , Meng Lean
IPC分类号： H05K1/14 , H01B11/00 , H01R12/00 , H01R12/04 , H05K3/32 , H05K3/36
CPC分类号： H01R12/78 , H05K1/147 , H05K3/323 , H05K3/361 , H05K3/365 , H05K2201/044 , H05K2201/09845
摘要： A data transmission interconnect assembly (e.g., a router) capable of transmission speeds in excess of 40 Gbps in which a line-card is detachably coupled to a backplane using flexible flat cables that are bent to provide a continuous, smooth curve between the connected boards, and connected by a connection apparatus that employs cable-to-cable interface members that are transparent to the transmitted signal waves. Microspring contact structures are formed on the cables, or on a contact structure pressed against the cables, to provide interface arrangements that are smaller than a wavelength of the transmitted signal. A connector apparatus uses a cam mechanism to align the cables, and then to press a contact structure, having micro spring interface members formed thereon, against the cables. An alterative contact structure uses anisotropic conductive film.

3. 发明申请

US20070145523A1 Integrateable capacitors and microcoils and methods of making thereof 审中-公开
标题翻译：可集成电容器和微型线圈及其制造方法
公开(公告)号：US20070145523A1
公开(公告)日：2007-06-28
申请号：US11319056
申请日：2005-12-28
申请人： Eugene Chow , Koenraad Schuylenbergh , David Fork , JengPing Lu
发明人： Eugene Chow , Koenraad Schuylenbergh , David Fork , JengPing Lu
IPC分类号： H01L29/00
CPC分类号： H01G5/18 , B81B3/0051 , H01F17/0006 , H01F17/02 , H01F21/04 , H01F27/40 , H01L28/10 , H01L28/60
摘要： Method for integrally forming high Q tunable capacitors and high Q inductors on a substrate are described. A variable capacitors may employ stops between a moveable electrode and a fixed electrode to reduce and/or prevent electrical shorting between the moveable and fixed electrode. A capacitor may employ a split bottom electrode structure to removing a suspension portion of a moveable top electrode from an RF part of a circuit.
摘要翻译：描述了在衬底上整体形成高Q可调电容器和高Q电感器的方法。可变电容器可以在可移动电极和固定电极之间使用停止以减少和/或防止可移动和固定电极之间的电短路。电容器可以采用分离的底部电极结构来从电路的RF部分去除可移动顶部电极的悬挂部分。

4. 发明申请

US20060057031A1 Capillary-channel probes for liquid pickup, transportation and dispense using stressy metal 有权
标题翻译：用于采用压力金属的液体拾取，运输和分配的毛细管通道探头
公开(公告)号：US20060057031A1
公开(公告)日：2006-03-16
申请号：US11267762
申请日：2005-11-03
申请人： Thomas Hantschel , David Fork , Eugene Chow , Dirk De Bruyker , Michel Rosa
发明人： Thomas Hantschel , David Fork , Eugene Chow , Dirk De Bruyker , Michel Rosa
IPC分类号： B01L3/00 , G01N33/00
CPC分类号： G01N35/1074 , B01J2219/00387 , B01L3/0244 , B01L3/0255 , B01L3/502715 , B01L2300/0819 , B01L2400/025 , B01L2400/0406 , B41J2/14314 , B41J2/16 , B41J2/1628 , B41J2/1629 , B41J2/1631 , B41J2/1632 , B41J2/1639 , B41J2/1643 , C40B60/14 , G01N35/1009 , G01N2035/00237 , G01N2035/1037 , G03F7/0002 , Y10T436/2575
摘要： Fluidic conduits, which can be used in microarraying systems, dip pen nanolithography systems, fluidic circuits, and microfluidic systems, are disclosed that use channel spring probes that include at least one capillary channel. Formed from spring beams (e.g., stressy metal beams) that curve away from the substrate when released, channels can either be integrated into the spring beams or formed on the spring beams. Capillary forces produced by the narrow channels allow liquid to be gathered, held, and dispensed by the channel spring probes. Because the channel spring beams can be produced using conventional semiconductor processes, significant design flexibility and cost efficiencies can be achieved.
摘要翻译：公开了可用于微阵列系统，浸笔纳米光刻系统，流体回路和微流体系统的流体导管，其使用包括至少一个毛细通道的通道弹簧探针。由释放时从基板弯曲的弹簧梁（例如，应力金属梁）形成，通道可以集成到弹簧梁中或形成在弹簧梁上。由窄通道产生的毛细管力允许液体被通道弹簧探针收集，保持和分配。由于可以使用传统的半导体工艺制造通道弹簧梁，所以可以实现显着的设计灵活性和成本效率。

5. 发明申请

US20090322845A1 ANISOTROPICALLY CONDUCTIVE BACKSIDE ADDRESSABLE IMAGING BELT FOR USE WITH CONTACT ELECTROGRAPHY 有权
标题翻译：使用联系电子技术的非均匀导电背面可寻址成像带
公开(公告)号：US20090322845A1
公开(公告)日：2009-12-31
申请号：US12145677
申请日：2008-06-25
申请人： Timothy D. Stowe , Chu-heng Liu , Jeng Ping Lu , Eugene Chow , Gregory B. Anderson , Armin Volkel , Eric Peeters
发明人： Timothy D. Stowe , Chu-heng Liu , Jeng Ping Lu , Eugene Chow , Gregory B. Anderson , Armin Volkel , Eric Peeters
IPC分类号： B41J2/41
CPC分类号： B41J2/41 , G03G15/32
摘要： An addressable imaging belt for use in printing applications having embedded anisotropically conductive addressable islands configured for electric contact on a first side of the belt by a write head consisting of an array of compliant cantilevered fingers with contact pads/points to which a voltage can be applied. The conductive addressable islands electrically isolated from one another and extending substantially through the thickness of the belt in order to allow charge to flow through the belt towards a second side of the belt, in order to form a latent electrostatic image on the second side and develop this latent image by attracting colorized toner or other electrically charged particles to the second side.
摘要翻译：一种用于印刷应用的可寻址成像带，其具有嵌入的各向异性导电可寻址岛，其配置用于通过由柔性悬臂指状物阵列组成的写头组成，用于在带的第一侧上进行电接触，所述写头具有可被施加电压的接触焊盘/点。导电寻址岛彼此电隔离并且基本上延伸穿过带的厚度，以便允许电荷通过带流向带的第二侧，以在第二面上形成静电潜像并显影该潜像通过将着色调色剂或其它带电粒子吸引到第二侧。

6. 发明申请

US20060038643A1 Stressed material and shape memory material MEMS devices and methods for manufacturing 有权
标题翻译：强调材料和形状记忆材料MEMS器件和制造方法
公开(公告)号：US20060038643A1
公开(公告)日：2006-02-23
申请号：US10923277
申请日：2004-08-20
申请人： Baomin Xu , David Fork , Michael Young , Eugene Chow
发明人： Baomin Xu , David Fork , Michael Young , Eugene Chow
IPC分类号： H01H51/22
CPC分类号： G11C23/00 , F03G7/065 , F04B17/003 , F05C2201/0412 , F05C2203/0813 , F05C2251/00 , F05C2251/08 , H01L41/094
摘要： Disclosed is a MEMS device which comprises at least one shape memory material such as a shape memory alloy (SMA) layer and at least one stressed material layer. Examples of such MEMS devices include an actuator, a micropump, a microvalve, or a non-destructive fuse-type connection probe. The device exhibits a variety of improved properties, for example, large deformation ability and high energy density. Also provided is a method of easily fabricating the MEMS device in the form of a cantilever-type or diaphragm-type structure.
摘要翻译：公开了一种MEMS器件，其包括至少一种形状记忆材料，例如形状记忆合金（SMA）层和至少一个应力材料层。这种MEMS器件的实例包括致动器，微型泵，微型阀或非破坏性熔丝式连接探针。该装置具有各种改进的性能，例如，大的变形能力和高的能量密度。还提供了以悬臂式或隔膜式结构的形式容易地制造MEMS器件的方法。

7. 发明申请

US20060076693A1 Self-releasing spring structures and methods 有权
标题翻译：自释弹簧结构及方法
公开(公告)号：US20060076693A1
公开(公告)日：2006-04-13
申请号：US10959180
申请日：2004-10-07
申请人： Thomas Hantschel , Sven Kosgalwies , David Fork , Eugene Chow
发明人： Thomas Hantschel , Sven Kosgalwies , David Fork , Eugene Chow
IPC分类号： H01L23/52
CPC分类号： G01R1/06716 , G01R3/00 , Y10T29/49609
摘要： According to various exemplary embodiments, a spring device that includes a substrate, a self-releasing layer provided over the substrate and a stressed-metal layer provided over the self-releasing layer is disclosed, wherein an amount of stress inside the stressed-metal layer results in a peeling force that is higher than an adhesion force between the self-releasing layer and the stressed-metal layer. Moreover, a method of manufacturing a spring device, according to various exemplary embodiments, includes providing a substrate, providing a self-releasing layer over the substrate and providing a stressed-metal layer over the self-releasing layer wherein an amount of stress inside the stressed-metal layer results in a peeling force that is higher than an adhesion force between the self-releasing layer and the stressed-metal layer is also disclosed in this invention.
摘要翻译：根据各种示例性实施例，公开了一种弹簧装置，其包括基板，设置在基板上的自放电层和设置在自放电层上的应力金属层，其中应力金属层内部的应力量导致剥离力高于自释放层和应力金属层之间的粘附力。此外，根据各种示例性实施例的制造弹簧装置的方法包括提供衬底，在衬底上提供自释放层，并在自释放层上方提供应力金属层，其中，在本发明中也公开了应力金属层导致比自发层和应力金属层之间的粘附力高的剥离力。

8. 发明申请

US20050006829A1 High force metal plated spring structure 有权
标题翻译：高强度金属电镀弹簧结构
公开(公告)号：US20050006829A1
公开(公告)日：2005-01-13
申请号：US10615653
申请日：2003-07-08
申请人： Eugene Chow , David Fork , Thomas Hantschel , Koenraad Van Schuylenbergh , Christopher Chua
发明人： Eugene Chow , David Fork , Thomas Hantschel , Koenraad Van Schuylenbergh , Christopher Chua
IPC分类号： F16F1/02 , H01L27/148 , F16F1/00 , F16F9/00 , H01L29/768
CPC分类号： F16F1/027
摘要： Lithographically defined and etched spring structures are produced by various methods such that they avoid the formation of a plated metal wedge on an underside of the spring structure after release. A post is utilized to offset the spring from an underlying substrate by a distance greater than the thickness of the plated metal. A trench is etched into the substrate below the spring to provide clearance during deflection of the spring. Another spring includes a knee (bend) that provides the necessary clearance during deflection. A plating process is limited to the upper side of another spring. A released spring is used as a shadow mask for patterning resist that prevents wedge formation during plating. Various tip arrangements are disclosed that can be utilized with each spring structure
摘要翻译：通过各种方法制造光刻定义和蚀刻的弹簧结构，使得它们在释放之后避免在弹簧结构的下侧上形成电镀金属楔。使用柱子将弹簧从下面的衬底偏移大于电镀金属的厚度的距离。在弹簧下方的衬底中蚀刻沟槽，以在弹簧偏转期间提供间隙。另一个弹簧包括在偏转期间提供必要的间隙的膝盖（弯头）。电镀工艺限于另一弹簧的上侧。释放的弹簧用作用于图案化抗蚀剂的荫罩，其防止电镀期间的楔形成。公开了可以与每个弹簧结构一起使用的各种尖端装置

9. 发明申请

US20070148895A1 Integrateable capacitors and microcoils and methods of making thereof 有权
标题翻译：可集成电容器和微型线圈及其制造方法
公开(公告)号：US20070148895A1
公开(公告)日：2007-06-28
申请号：US11319075
申请日：2005-12-28
申请人： Koenraad Van Schuylenbergh , Eugene Chow , JengPing Lu
发明人： Koenraad Van Schuylenbergh , Eugene Chow , JengPing Lu
IPC分类号： H01L21/00
CPC分类号： H01G5/18 , H01F17/0006 , H01F17/02 , H01F21/04 , H01F27/40 , H01F41/041 , H01L28/10 , H01L28/40
摘要： Methods for integrally forming high Q tunable capacitors and high Q inductors on a substrate are described. A method for integrally forming a capacitor and a microcoil on a substrate may involve depositing and patterning a dielectric layer on the substrate, depositing and patterning a sacrificial layer on the substrate, depositing and patterning conductive material on the semiconductor substrate, depositing and patterning a polymer layer on the semiconductor substrate, removing an exposed portion of the conductive material exposed by the patterned polymer layer to release a portion of the conductive pattern from the semiconductor substrate to form out-of-plane windings of the microcoil, depositing second conductive material on exposed portions of the conductive material, and removing the sacrificial layer. The patterned conductive material may include a windings portion of the microcoil, an overlapping electrode portion of the capacitor and a support portion for the electrode of the capacitor.
摘要翻译：描述了在衬底上整体形成高Q可调谐电容器和高Q电感器的方法。用于在基板上一体地形成电容器和微线圈的方法可以包括在基板上沉积和图案化电介质层，在衬底上沉积和图案化牺牲层，在半导体衬底上沉积和图案化导电材料，沉积和图案化聚合物去除由所述图案化聚合物层暴露的所述导电材料的暴露部分，以从所述半导体衬底释放所述导电图案的一部分，以形成所述微线圈的面外绕组，将第二导电材料沉积在暴露的部分导电材料，并去除牺牲层。图案化导电材料可以包括微线圈的绕组部分，电容器的重叠电极部分和用于电容器电极的支撑部分。

10. 发明申请

US20060128057A1 Xerographic micro-assembler 有权
标题翻译：静电复印机
公开(公告)号：US20060128057A1
公开(公告)日：2006-06-15
申请号：US11011652
申请日：2004-12-14
申请人： Jeng Lu , Eugene Chow
发明人： Jeng Lu , Eugene Chow
IPC分类号： H01L21/50 , H01L21/30 , B23P21/00
CPC分类号： H01L25/50 , H01L21/67271 , H01L21/67282 , H01L21/67294 , H01L24/95 , H01L2224/95085 , H01L2224/95144 , H01L2224/95145 , H01L2924/14 , H01L2924/1461 , Y10T29/4913 , Y10T29/49133 , Y10T29/53004 , Y10T29/5313 , Y10T29/53174 , Y10T29/53178 , Y10T29/53278 , H01L2924/00
摘要： Xerographic micro-assembler systems and methods are disclosed. The systems and methods involve manipulating charge-encoded micro-objects. The charge encoding identifies each micro-object and specifies its orientation for sorting. The micro-objects are sorted in a sorting unit so that they have defined positions and orientations. The sorting unit has the capability of electrostatically and magnetically manipulating the micro-objects based on their select charge encoding. The sorted micro-objects are provided to an image transfer unit. The image transfer unit is adapted to receive the sorted micro-objects, maintain them in their sorted order and orientation, and deliver them to a substrate. Maintaining the sorted order as the micro-objects are delivered to the substrate may be accomplished through the use of an electrostatic image, as is done in xerography. The substrate with the micro-objects is further processed to interconnect the micro-objects—through electrical wiring, for example—to form the final micro-assembly.
摘要翻译：公开了静电印刷微组装系统和方法。系统和方法涉及操纵电荷编码的微物体。电荷编码识别每个微物体并指定其排列方向。微物体在分类单元中排序，使得它们具有定义的位置和取向。分选单元具有基于其选择电荷编码的静电和磁性操纵微物体的能力。分类的微物体被提供给图像传送单元。图像传送单元适于接收分类的微物体，将它们保持在排列顺序和方位，并将其传送到基底。将排序的顺序作为微物体传送到基底可以通过使用静电图像来实现，如在静电复印中所做的那样。具有微物体的衬底被进一步处理以使例如微通孔电线互连，以形成最终的微组件。

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